Information

 2012-2013 Microchip Technology Inc. DS80000540E-page 11
dsPIC33FJ06GS001/101A/102A/202A and dsPIC33FJ09GS302
Data Sheet Clarifications
The following typographic corrections and clarifications
are to be noted for the latest version of the device data
sheet (DS75018C):
1. Module: Electrical Characteristics
The Min. and Typ. values in Table 25-42 have
been corrected. The correct values are shown in
bold below:
2. Module: Oscillator Configuration
Bit CF in Register 8-1 was stated as R/C-0. The correct
definition is R/W-0. The (read/clear by application) text
has also been removed from the CF bit description on
Page 127.
Note: Corrections are shown in bold. Where
possible, the original bold text formatting
has been removed for clarity.
TABLE 25-42: DAC MODULE SPECIFICATIONS
AC and DC CHARACTERISTICS
(2)
Standard Operating Conditions (unless otherwise stated)
Operating temperature: -40°C  T
A  +85°C for Industrial
-40°C  T
A  +125°C for Extended
Param. Symbol Characteristic Min. Typ. Max. Units Comments
DA01 EXTREF External Voltage Reference
(1)
0—AVDD – 1.6 V
DA08 INTREF Internal Voltage Reference
(1)
1.15 1.25 1.35 V
DA02 CVRES Resolution 10 Bits
DA03 INL Integral Nonlinearity Error -15 -1 +15 LSB AV
DD = 3.3V,
DAC
REF = (AVDD/2)V
DA04 DNL Differential Nonlinearity Error -5 -0.5 +5 LSB
DA05 EOFF Offset Error -0.8 0.4 2.6 %
DA06 EG Gain Error -1.8 0.4 5.2 %
DA07 T
SET Settling Time
(1)
711 1551 2100 ns Measured when
range = 1 (high range)
and the CMREF<9:0>
bits transition from
0x1FF to 0x300.
Note 1: Parameters are for design guidance only and are not tested in manufacturing.
2: Overall functional device operation at VBORMIN < VDD < VDDMIN is tested but not characterized. All device
analog modules, such as the ADC, etc., will function but with degraded performance below V
DDMIN. Refer
to Parameter BO10 in Table 25-11 for BOR values.