Information

 2009-2013 Microchip Technology Inc. DS80000439N-page 19
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
2. Module: Packaging
A new packaging type, Ultra-Thin Quad Flat Pack
No Lead, 6 mm x 6 mm x 0.5 mm (UQFN), is added
for the dsPIC33FJ16GS502 28-pin device.
The 28-pin UQFN package shares the same pin
configurations as the existing 28-pin QFN-S
packages. Users may refer to the existing QFN pin
diagrams at the front of the device data sheet for
the appropriate pin configurations.
The format of package marking in Section 28.1
“Package Marking Information” is identical to that
of the existing 28-pin QFN-S packaging. The sole
difference is that UQFN packages are marked “/MX”
in the second line, instead of “/MM” for QFN-S
devices.
The following additions are made to the device
data sheet:
• Microchip Technology Drawing C04-0209A,
three sheets (“28-Lead Plastic Ultra Thin
Quad Flat, No Lead Package”) are added by
reference to Section 28.2 “Packaging
Details”. The latest version of these drawings
is in Microchip Technology document
DS00049, “Packaging Specification”,
available at the Microchip web site, at
www.microchip.com/packaging.
• The data sheet Product Information System is
amended to add package type “MX, Plastic
Ultra Thin Quad Flat, No Lead Package –
6 mm x 6 mm x 0.5 mm (UQFN).”