Information

dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
DS70152H-page 60 © 2010 Microchip Technology Inc.
P9b TDLY5 Delay between PGDx by Programming
Executive to PGDx Released by
Programming Executive
15 23 μs—
P10 TDLY6 PGCx Low Time After Programming 400 ns
P11 TDLY7 Bulk Erase Time 330 ms See Note 2
P12 T
DLY8 Page Erase Time 19.5 ms See Note 2
P13 T
DLY9 Row Programming Time 1.28 ms See Note 2
P14 T
R MCLR Rise Time to Enter ICSP mode 1.0 μs—
P15 T
VALID Data Out Valid from PGCx 10 ns
P16 T
DLY10 Delay between Last PGCx and MCLR 0—s
P17 T
HLD3MCLR to VDD —100ns
P18 T
KEY1 Delay from First MCLR to First PGCx
for Key Sequence on PGDx
1—μs—
P19 TKEY2 Delay from Last PGCx for Key Sequence
on PGDx to Second MCLR
25 ns
P20 TDLY11 Maximum Wait Time for Configuration
Register Programming
—25ms
P21 T
MCLRH MCLR High Time 500 μs—
TABLE 8-1: AC/DC CHARACTERISTICS AND TIMING REQUIREMENTS (CONTINUED)
Standard Operating Conditions
Operating Temperature: –40ºC-85ºC. Programming at 25ºC is recommended.
Param
No.
Symbol Characteristic Min Max Units Conditions
Note 1: V
DD must also be supplied to the AVDD pins during programming. AVDD and AVSS should always be within
±0.3V of VDD and VSS, respectively.
2: Time depends on the FRC accuracy and the value of the FRC Oscillator tuning register. Refer to
“Electrical Characteristics” section in the specific device data sheet.