Information

2009-2013 Microchip Technology Inc. DS80442J-page 13
dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 and dsPIC33FJ128MCX02/X04
6. Module: High-Temperature Electrical
Characteristics
A new table, Table 32-8: DC Characteristics: I/O
Pin Input Specifications and Parameter HDI51f
(Input Leakage Current, RB9-RB12), are added to
this chapter under DC Characteristics. They are
shown in Table 32-8 below. The following tables in
this chapter will be renumbered sequentially.
7. Module: High-Temperature Electrical
Characteristics
A new table, Table 32-19: AC Characteristics:
Internal FRC Accuracy, is added to this chapter
under AC Characteristics. Table 32-19 summarizes
the internal oscillator tolerance over the entire
temperature range.
TABLE 32-8: DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS
DC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +150°C for Extended Temperature
Param
No.
Symbol Characteristic Min Typ
(1)
Max Units Conditions
HDI51f I
IL Input Leakage Current,
RB9 through RB12
——±15µA
VSS VPIN VDD,
Pin at high-impedance,
-40°C TA +150°C
Note 1: Negative current is defined as current sourced by the pin.
TABLE 32-19: AC CHARACTERISTICS: INTERNAL FRC ACCURACY
AC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
Operating temperature -40°C TA +150°C for High Temperature
Param
No.
Characteristic Min Typ Max Units Conditions
HF20 FRC
(1,2)
-5 5 % -40°C TA +150°C VDD = 3.0-3.6V
Note 1: Negative current is defined as current sourced by the pin.
2: Frequency is calibrated at +25°C and 3.3V. The TUNx bits can be used to compensate for temperature drift.