Datasheet

dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04, AND dsPIC33FJ128GPX02/X04
DS70292G-page 338 © 2007-2012 Microchip Technology Inc.
30.1 DC Characteristics
TABLE 30-1: OPERATING MIPS VS. VOLTAGE
Characteristic
V
DD Range
(in Volts)
Temp Range
(in °C)
Max MIPS
dsPIC33FJ32GP302/304,
dsPIC33FJ64GPX02/X04, and
dsPIC33FJ128GPX02/X04
—
3.0-3.6V
(1)
-40°C to +85°C 40
—
3.0-3.6V
(1)
-40°C to +125°C 40
Note 1: Device is functional at V
BORMIN < VDD < VDDMIN. Analog modules such as the ADC will have degraded
performance. Device functionality is tested but not characterized. Refer to parameter BO10 in Table 30-11
for the minimum and maximum BOR values.
TABLE 30-2: THERMAL OPERATING CONDITIONS
Rating Symbol Min Typ Max Unit
Industrial Temperature Devices
Operating Junction Temperature Range T
J -40 — +125 °C
Operating Ambient Temperature Range TA -40 — +85 °C
Extended Temperature Devices
Operating Junction Temperature Range TJ -40 — +155 °C
Operating Ambient Temperature Range T
A -40 — +125 °C
Power Dissipation:
Internal chip power dissipation:
PINT = VDD x (IDD – Σ IOH)
P
D PINT + PI/O W
I/O Pin Power Dissipation:
I/O = Σ ({V
DD – VOH} x IOH) + Σ (VOL x IOL)
Maximum Allowed Power Dissipation P
DMAX (TJ – TA)/θJA W
TABLE 30-3: THERMAL PACKAGING CHARACTERISTICS
Characteristic Symbol Typ Max Unit Note
Package Thermal Resistance, 44-pin QFN
θJA 30 — °C/W 1
Package Thermal Resistance, 44-pin TFQP θJA 40 — °C/W 1
Package Thermal Resistance, 28-pin SPDIP
θJA 45 — °C/W 1
Package Thermal Resistance, 28-pin SOIC
θJA 50 — °C/W 1
Package Thermal Resistance, 28-pin QFN-S
θJA 30 — °C/W 1
Note 1: Junction to ambient thermal resistance, Theta-
JA (θJA) numbers are achieved by package simulations.