Information

 2009-2013 Microchip Technology Inc. DS80000443K-page 13
dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04 and dsPIC33FJ128GPX02/X04
APPENDIX A: REVISION HISTORY
Rev A Document (3/2009)
Initial release of this document; issued for revision A1,
A2 and A3 silicon.
Includes silicon issues 1-2 (UART), 3-4 (SPI), 5-10
(I
2
C™), 11-12 (UART), 13 (Comparator), 14 (Internal
Voltage Regulator), 15 (PSV Operations), 16-17
(ECAN™), 18 (CPU) and 19 (SPI).
This document replaces the following errata document:
“dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04
and dsPIC33FJ128GPX02/X04 Rev. A1/A2/A3 Silicon
Errata” (DS80371)
Rev B Document (4/2009)
Corrected part numbers.
Rev C Document (8/2009)
Added silicon issue 20 (UART).
Added data sheet clarification 1 (Electrical
Characteristics).
Rev D Document (1/2010)
Added Rev. A4 silicon information.
Added silicon issue 21 (Audio DAC).
Rev E Document (6/2010)
Updated silicon issue 18 (CPU).
Added silicon issues 22 (ADC), 23 (JTAG) and 24
(RTCC), and data sheet clarification 2 (DC
Characteristics: I/O Pin Input Specifications).
Rev F Document (10/2010)
Updated the work around in silicon issue 22 (ADC).
Added silicon issue 25 (Core).
Rev G Document (3/2011)
Removed data sheet clarification 1.
Updated the Affected Silicon Revisions for item 25 in
Table 2 and in silicon issue 25 (Core).
Added silicon issue 26 (I/O Port).
Rev H Document (11/2011)
Updated the current Device Data Sheet revision to “F”.
Added Rev. A5 silicon information.
Added silicon issues 27 (CPU), 28 (CPU), 29 (UART),
and 30 (JTAG).
Rev J
Document (4/2013)
Updated the current Device Data Sheet revision to “G”.
Added data sheet clarifications 1 through 4 (Electrical
Characteristics) and 5 (High-Temperature Electrical
Characteristics).
Other minor typographic changes to improve table
readability.
Rev K
Document (8/2013)
Added data sheet clarifications 6 (Electrical Char-
acteristics) and 7 (High-Temperature Electrical
Characteristics).