Datasheet

dsPIC33FJ06GS001/101A/102A/202A and dsPIC33FJ09GS302
DS75018C-page 312  2011-2012 Microchip Technology Inc.
TABLE 25-44: DAC GAIN STAGE TO COMPARATOR SPECIFICATIONS
TABLE 25-43: DAC OUTPUT (DACOUT PIN) DC SPECIFICATIONS
DC CHARACTERISTICS
(1)
Standard Operating Conditions (unless otherwise stated)
Operating temperature: -40°C  TA  +85°C for Industrial
-40°C  T
A  +125°C for Extended
Param. Symbol Characteristic Min. Typ. Max. Units Comments
DA11 RLOAD Resistive Output Load
Impedance
3K — — Ohm
—C
LOAD Output Load
Capacitance
— — 35 pF Including output pin
capacitance
DA12 I
OUT Output Current Drive
Strength
200 300 — µA Sink and source
DA13 V
RANGE Output Drive Voltage
Range at Current
Drive of 200 mA
AVSS + 250 mV — AVDD – 900 mV V
DA14 V
LRANGE Output Drive Voltage
Range at Reduced
Current Drive of 50 mA
AVSS + 5 mV — AVDD – 500 mV V
DA15 I
DD Current Consumed
when Module Is
Enabled
— — 1.3 x IOUT µA Module will always con-
sume this current even if
no load is connected to
the output
DA16 R
OUTON Output Impedance
when Module is
Enabled
— 820 — Ohms
DA30 V
OFFSET Input Offset Voltage — 10 10 mV
Note 1: Overall functional device operation at V
BORMIN < VDD < VDDMIN is tested but not characterized. All device
analog modules, such as the ADC, etc., will function but with degraded performance below VDDMIN. Refer
to Parameter BO10 in Table 2 5 - 11 for BOR values.
DC CHARACTERISTICS
(1)
Standard Operating Conditions
(unless otherwise stated)
Operating temperature: -40°C  T
A  +85°C for Industrial
-40°C  TA  +125°C for Extended
Param. Symbol Characteristic Min. Typ. Max. Units Conditions
DA15 I
DD Current Consumed when
Module Is Enabled.
— 60 — µA Module will always consume this
current even if no load is
connected to the output
DA32 G Amplifier Gain — 1.0 — —
—1.8 — —
DA33 GBWP Gain Bandwidth Product — 2.0 — MHz At 1 pF load capacitance.
Measured with sine wave output
signal of 1V peak-to-peak with a
midpoint value of 1.2V. Voltage
excursion from 0.7 to 1.7V.
DA34 SR Slew Rate — 5 — V/µs Slew rate between 10% and 90%
of AV
DD
DA07 TS Settling Time — 200 — ns Settling time to 3%
Note 1: Overall functional device operation at V
BORMIN < VDD < VDDMIN is tested but not characterized. All device
analog modules, such as the ADC, etc., will function but with degraded performance below V
DDMIN. Refer
to Parameter BO10 in Table 25-11 for BOR values.