Datasheet

dsPIC33FJ06GS001/101A/102A/202A and dsPIC33FJ09GS302
DS75018C-page 272  2011-2012 Microchip Technology Inc.
25.1 DC Characteristics
TABLE 25-1: OPERATING MIPS vs. VOLTAGE
Characteristic
V
DD Range
(in Volts)
Temp Range
(in °C)
Maximum MIPS
dsPIC33FJ06GS001/101A/102A/202A
and dsPIC33FJ09GS302
—V
BOR-3.6V
(1)
-40°C to +85°C 40
—V
BOR-3.6V
(1)
-40°C to +125°C 40
Note 1: Overall functional device operation at V
BORMIN < VDD < VDDMIN is tested but not characterized. All device
analog modules, such as the ADC, etc., will function but with degraded performance below VDDMIN. Refer
to Parameter BO10 in Table 25-11 for BOR values.
TABLE 25-2: THERMAL OPERATING CONDITIONS
Rating Symbol Min. Typ. Max. Unit
Industrial Temperature Devices
Operating Junction Temperature Range T
J -40 — +125 °C
Operating Ambient Temperature Range TA -40 — +85 °C
Extended Temperature Devices
Operating Junction Temperature Range T
J -40 — +140 °C
Operating Ambient Temperature Range TA -40 — +125 °C
Power Dissipation
Internal Chip Power Dissipation:
PINT = VDD x (IDD –  IOH)
P
D PINT + PI/O W
I/O Pin Power Dissipation:
I/O =  ({V
DD – VOH} x IOH) +  (VOL x IOL)
Maximum Allowed Power Dissipation PDMAX (TJ – TA)/JA W
TABLE 25-3: THERMAL PACKAGING CHARACTERISTICS
Characteristic Symbol Typ. Max. Unit Notes
Package Thermal Resistance, 18-Pin SOIC 
JA 57 — °C/W 1
Package Thermal Resistance, 18-pin PDIP 
JA 66 — °C/W 1
Package Thermal Resistance, 20-pin SSOP 
JA 64 — °C/W 1
Package Thermal Resistance, 28-Pin QFN-S 
JA 34 — °C/W 1
Package Thermal Resistance, 28-pin SSOP JA 71 — °C/W 1
Package Thermal Resistance, 28-Pin SOIC 
JA 47 — °C/W 1
Package Thermal Resistance, 28-Pin SPDIP 
JA 45 — °C/W 1
Package Thermal Resistance, 36-Pin VTLA 
JA 29 — °C/W 1
Note 1: Junction to ambient thermal resistance, Theta-
JA (JA) numbers are achieved by package simulations.