Datasheet

dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 368 © 2008-2012 Microchip Technology Inc.
Section 23.0 “Electrical
Characteristics”
Updated Typ values for Thermal Packaging Characteristics (Table 23-3).
Removed Typ value for DC Temperature and Voltage Specifications
parameter DC12 (Table 23-4).
Updated all Typ values and conditions for DC Characteristics: Operating
Current (I
DD), updated last sentence in Note 2 (Table 23-5).
Updated all Typ values for DC Characteristics: Idle Current (I
IDLE) (see
Table 23-6).
Updated all Typ values for DC Characteristics: Power Down Current (I
PD)
(see Table 23-7).
Updated all Typ values for DC Characteristics: Doze Current (I
DOZE) (see
Table 23-8).
Added Note 4 (reference to new table containing digital-only and analog pin
information, as well as Current Sink/Source capabilities) in the I/O Pin Input
Specifications (Table 23-9).
Updated Max value for BOR electrical characteristics parameter BO10 (see
Table 23-11).
Swapped Min and Typ values for Program Memory parameters D136 and
D137 (Table 23-12).
Updated Typ values for Internal RC Accuracy parameter F20 and added
Extended temperature range to table heading (see Table 23-19).
Removed all values for Reset, Watchdog Timer, Oscillator Start-up Timer,
and Power-up Timer parameter SY20 and updated conditions, which now
refers to Section 20.4 “Watchdog Timer (WDT)” and LPRC parameter
F21a (see Table 23-22).
Added specifications to High-Speed PWM Module Timing Requirements for
Tap Delay (Table 23-29).
Updated Min and Max values for 10-bit High-Speed Analog-to-Digital
Module parameters AD01 and AD11 (see Table 23-36).
Updated Max value and unit of measure for DAC AC Specification (see
Table 23-40).
TABLE A-1: MAJOR SECTION UPDATES (CONTINUED)
Section Name Update Description