Datasheet

© 2008-2012 Microchip Technology Inc. DS70318F-page 291
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
TABLE 24-7: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD)
DC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤ T
A ≤ +85°C for Industrial
-40°C ≤ T
A ≤ +125°C for Extended
Parameter
No.
Typical
(1)
Max Units Conditions
Power-Down Current (IPD)
(2,4)
DC60d 125 500 μA -40°C
3.3V Base Power-Down Current
DC60a 135 500 μA +25°C
DC60b 235 500 μA +85°C
DC60c 565 950 μA +125°C
DC61d 40 50 μA -40°C
3.3V Watchdog Timer Current: ΔI
WDT
(3)
DC61a 40 50 μA +25°C
DC61b 40 50 μA +85°C
DC61c 80 90 μA +125°C
Note 1: Data in the Typical column is at 3.3V, +25°C unless otherwise stated.
2: I
PD (Sleep) current is measured as follows:
• CPU core is off, oscillator is configured in EC mode and external clock active, OSC1 is driven with
external square wave from rail-to-rail (EC clock overshoot/undershoot < 250 mV required)
• CLKO is configured as an I/O input pin in the Configuration word
• All I/O pins are configured as inputs and pulled to V
SS
•MCLR = VDD, WDT and FSCM are disabled
• All peripheral modules are disabled (PMDx bits are all ones)
• The VREGS bit (RCON<8>) = 0 (i.e., core regulator is set to stand-by while the device is in Sleep
mode)
• JTAG disabled
3: The Δ current is the additional current consumed when the WDT module is enabled. This current should
be added to the base I
PD current.
4: These currents are measured on the device containing the most memory in this family.