Datasheet

dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 286 © 2008-2012 Microchip Technology Inc.
24.1 DC Characteristics
TABLE 24-1: OPERATING MIPS VS. VOLTAGE
Characteristic
V
DD Range
(in Volts)
Temp Range
(in °C)
Max MIPS
dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04
—
3.0-3.6V
(1)
-40°C to +85°C 40
—
3.0-3.6V
(1)
-40°C to +125°C 40
Note 1: Overall functional device operation at V
BORMIN < VDD < VDDMIN is tested but not characterized. All device
analog modules such as the ADC, etc., will function but with degraded performance below V
DDMIN. Refer
to BO10 in Table 24-11 for BOR values.
TABLE 24-2: THERMAL OPERATING CONDITIONS
Rating Symbol Min Typ Max Unit
Industrial Temperature Devices
Operating Junction Temperature Range T
J -40 — +125 °C
Operating Ambient Temperature Range T
A -40 — +85 °C
Extended Temperature Devices
Operating Junction Temperature Range TJ -40 — +140 °C
Operating Ambient Temperature Range TA -40 — +125 °C
Power Dissipation:
Internal chip power dissipation:
PINT = VDD x (IDD – Σ IOH)
P
D PINT + PI/O W
I/O Pin Power Dissipation:
I/O = Σ ({V
DD – VOH} x IOH) + Σ (VOL x IOL)
Maximum Allowed Power Dissipation PDMAX (TJ – TA)/θJA W
TABLE 24-3: THERMAL PACKAGING CHARACTERISTICS
Characteristic Symbol Typ Max Unit Notes
Package Thermal Resistance, 44-Pin QFN θ
JA 28 — °C/W 1
Package Thermal Resistance, 44-Pin TFQP θJA 39 — °C/W 1
Package Thermal Resistance, 28-Pin SPDIP θ
JA 42 — °C/W 1
Package Thermal Resistance, 28-Pin SOIC θ
JA 47 — °C/W 1
Package Thermal Resistance, 28-Pin QFN-S θ
JA 34 — °C/W 1
Package Thermal Resistance, 18-Pin SOIC θ
JA 57 — °C/W 1
Package Thermal Resistance, 44-Pin VTLA θ
JA 25 — °C/W 1
Note 1: Junction to ambient thermal resistance, Theta-
JA (θJA) numbers are achieved by package simulations.