Datasheet
dsPIC33EPXXXGP50X, dsPIC33EPXXXMC20X/50X AND PIC24EPXXXGP/MC20X
DS70000657H-page 406 2011-2013 Microchip Technology Inc.
TABLE 30-8: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD)
DC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C T
A +125°C for Extended
Parameter
No.
Typ. Max. Units Conditions
Power-Down Current (I
PD)
(1)
– dsPIC33EP32GP50X, dsPIC33EP32MC20X/50X and PIC24EP32GP/MC20X
DC60d 30 100 A -40°C
3.3V
DC60a 35 100 A+25°C
DC60b 150 200 A+85°C
DC60c 250 500 A +125°C
Power-Down Current (I
PD)
(1)
– dsPIC33EP64GP50X, dsPIC33EP64MC20X/50X and PIC24EP64GP/MC20X
DC60d 25 100 A -40°C
3.3V
DC60a 30 100 A+25°C
DC60b 150 350 A+85°C
DC60c 350 800 A +125°C
Power-Down Current (I
PD)
(1)
– dsPIC33EP128GP50X, dsPIC33EP128MC20X/50X and PIC24EP128GP/MC20X
DC60d 30 100 A -40°C
3.3V
DC60a 35 100 A+25°C
DC60b 150 350 A+85°C
DC60c 550 1000 A +125°C
Power-Down Current (I
PD)
(1)
– dsPIC33EP256GP50X, dsPIC33EP256MC20X/50X and PIC24EP256GP/MC20X
DC60d 35 100 A -40°C
3.3V
DC60a 40 100 A+25°C
DC60b 250 450 A+85°C
DC60c 1000 1200 A +125°C
Power-Down Current (I
PD)
(1)
– dsPIC33EP512GP50X, dsPIC33EP512MC20X/50X and PIC24EP512GP/MC20X
DC60d 40 100 A -40°C
3.3V
DC60a 45 100 A+25°C
DC60b 350 800 A+85°C
DC60c 1100 1500 A +125°C
Note 1: I
PD (Sleep) current is measured as follows:
• CPU core is off, oscillator is configured in EC mode and external clock is active; OSC1 is driven with
external square wave from rail-to-rail (EC clock overshoot/undershoot < 250 mV required)
• CLKO is configured as an I/O input pin in the Configuration Word
• All I/O pins are configured as inputs and pulled to V
SS
•MCLR = VDD, WDT and FSCM are disabled
• All peripheral modules are disabled (PMDx bits are all set)
• The VREGS bit (RCON<8>) = 0 (i.e., core regulator is set to standby while the device is in Sleep
mode)
• The VREGSF bit (RCON<11>) = 0 (i.e., Flash regulator is set to standby while the device is in Sleep
mode)
• JTAG is disabled