Datasheet

ManualsBrandsMICROCHIP TECHNOLOGY ManualsMicrocontrollers, Microprocessors & QuartzesEmbedded microcontroller TQFP 80 (14x14) 16-Bit 30 null I/O number 68

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Table Of Contents

High-Performance Modified RISC CPU:
DSP Features:
Peripheral Features:
Analog Features:
Special Microcontroller Features:
CMOS Technology:
dsPIC30F6011A/6012A/6013A/6014A Controller Families
Pin Diagrams
Pin Diagrams (Continued)
Pin Diagrams (Continued)
Pin Diagrams (Continued)
Table of Contents
Most Current Data Sheet
Errata
Customer Notification System
1.0 Device Overview
- FIGURE 1-1: dsPIC30F6011A/6012A Block Diagram
- FIGURE 1-2: dsPIC30F6013A/6014A Block Diagram
- TABLE 1-1: PINOUT I/O DESCRIPTIONS
2.0 CPU Architecture Overview
- 2.1 Core Overview
- 2.2 Programmer’s Model
- 2.3 Divide Support
- 2.4 DSP Engine
3.0 Memory Organization
- 3.1 Program Address Space
- 3.2 Data Address Space
4.0 Address Generator Units
- 4.1 Instruction Addressing Modes
- 4.2 Modulo Addressing
- 4.3 Bit-Reversed Addressing
  - 4.3.1 Bit-Reversed Addressing Implementation
5.0 Interrupts
- 5.1 Interrupt Priority
  - TABLE 5-1: Interrupt Vector Table
- 5.2 Reset Sequence
  - 5.2.1 Reset Sources
- 5.3 Traps
  - 5.3.1 Trap Sources
  - 5.3.2 Hard and Soft Traps
    - FIGURE 5-1: Trap VECTORS
- 5.4 Interrupt Sequence
  - FIGURE 5-2: INTERRUPT STACK FRAME
- 5.5 Alternate Vector Table
- 5.6 Fast Context Saving
- 5.7 External Interrupt Requests
- 5.8 Wake-up from Sleep and Idle
  - TABLE 5-2: Interrupt Controller Register Map(1)
6.0 Flash Program Memory
- 6.1 In-Circuit Serial Programming (ICSP)
- 6.2 Run-Time Self-Programming (RTSP)
- 6.3 Table Instruction Operation Summary
  - FIGURE 6-1: ADDRESSING FOR TABLE AND NVM REGISTERS
- 6.4 RTSP Operation
- 6.5 Control Registers
- 6.6 Programming Operations
7.0 Data EEPROM Memory
- 7.1 Reading the Data EEPROM
  - EXAMPLE 7-1: Data EEPROM Read
- 7.2 Erasing Data EEPROM
  - 7.2.1 Erasing a block of Data EEPROM
    - EXAMPLE 7-2: Data EEPROM block erase
  - 7.2.2 Erasing a Word of Data EEPROM
    - EXAMPLE 7-3: Data EEPROM Word erase
- 7.3 Writing to the Data EEPROM
  - 7.3.1 Writing a Word of Data EEPROM
    - EXAMPLE 7-4: Data EEPROM Word Write
  - 7.3.2 Writing a block of Data EEPROM
    - EXAMPLE 7-5: data eeprom block write
- 7.4 Write Verify
- 7.5 Protection Against Spurious Write
8.0 I/O Ports
- 8.1 Parallel I/O (PIO) Ports
  - FIGURE 8-1: Block Diagram of a Dedicated PORT Structure
- 8.2 Configuring Analog Port Pins
- 8.3 Input Change Notification Module
9.0 Timer1 Module
- FIGURE 9-1: 16-bit Timer1 Module Block diagram
- 9.1 Timer Gate Operation
- 9.2 Timer Prescaler
- 9.3 Timer Operation During Sleep Mode
- 9.4 Timer Interrupt
- 9.5 Real-Time Clock
10.0 Timer2/3 Module
- FIGURE 10-1: 32-bit TIMER2/3 BLOCK DIAGRAM
- FIGURE 10-2: 16-bit TIMER2 BLOCK DIAGRAM
- FIGURE 10-3: 16-bit TIMER3 BLOCK DIAGRAM
- 10.1 Timer Gate Operation
- 10.2 ADC Event Trigger
- 10.3 Timer Prescaler
- 10.4 Timer Operation During Sleep Mode
- 10.5 Timer Interrupt
  - TABLE 10-1: Timer2/3 register map(1)
11.0 Timer4/5 Module
- FIGURE 11-1: 32-bit TIMER4/5 BLOCK DIAGRAM
- FIGURE 11-2: 16-bit TIMER4 BLOCK DIAGRAM
- FIGURE 11-3: 16-bit TIMER5 BLOCK DIAGRAM
- TABLE 11-1: Timer4/5 register map(1)
12.0 Input Capture Module
- 12.1 Simple Capture Event Mode
- 12.2 Input Capture Operation During Sleep and Idle Modes
  - 12.2.1 Input Capture in CPU Sleep Mode
  - 12.2.2 Input Capture in CPU Idle Mode
- 12.3 Input Capture Interrupts
  - TABLE 12-1: Input Capture Register Map(1)
13.0 Output Compare Module
- FIGURE 13-1: Output Compare Mode Block DiagrAm
- 13.1 Timer2 and Timer3 Selection Mode
- 13.2 Simple Output Compare Match Mode
- 13.3 Dual Output Compare Match Mode
  - 13.3.1 Single Pulse Mode
  - 13.3.2 Continuous Pulse Mode
- 13.4 Simple PWM Mode
  - 13.4.1 Input Pin Fault Protection for PWM
  - 13.4.2 PWM Period
    - EQUATION 13-1:
- 13.5 Output Compare Operation During CPU Sleep Mode
- 13.6 Output Compare Operation During CPU Idle Mode
- 13.7 Output Compare Interrupts
  - TABLE 13-1: Output Compare Register Map(1)
14.0 SPI™ Module
- 14.1 Operating Function Description
  - 14.1.1 Word and Byte Communication
  - 14.1.2 SDOx Disable
- 14.2 Framed SPI Support
  - FIGURE 14-1: SPI BLOCK DIAGRAM
  - FIGURE 14-2: SPI Master/Slave Connection
- 14.3 Slave Select Synchronization
- 14.4 SPI Operation During CPU Sleep Mode
- 14.5 SPI Operation During CPU Idle Mode
  - TABLE 14-1: SPI1 Register Map(1)
  - TABLE 14-2: SPI2 Register Map(1)
15.0 I2C™ Module
- 15.1 Operating Function Description
- 15.2 I2C Module Addresses
  - TABLE 15-1: 7-bit I2C™ Slave Addresses supported by dsPIC30F
- 15.3 I2C 7-bit Slave Mode Operation
  - 15.3.1 Slave Transmission
  - 15.3.2 Slave Reception
- 15.4 I2C 10-bit Slave Mode Operation
  - 15.4.1 10-bit Mode Slave Transmission
  - 15.4.2 10-bit Mode Slave Reception
- 15.5 Automatic Clock Stretch
- 15.6 Software Controlled Clock Stretching (STREN = 1)
- 15.7 Interrupts
- 15.8 Slope Control
- 15.9 IPMI Support
- 15.10 General Call Address Support
- 15.11 I2C Master Support
- 15.12 I2C Master Operation
- 15.13 I2C Module Operation During CPU Sleep and Idle Modes
  - 15.13.1 I2C Operation During CPU Sleep MoDE
  - 15.13.2 I2C Operation During CPU Idle Mode
    - TABLE 15-2: I2C™ Register Map(1)
16.0 Universal Asynchronous Receiver Transmitter (UART) Module
- 16.1 UART Module Overview
  - FIGURE 16-1: UART Transmitter Block Diagram
  - FIGURE 16-2: UART Receiver Block Diagram
- 16.2 Enabling and Setting Up UART
- 16.3 Transmitting Data
- 16.4 Receiving Data
- 16.5 Reception Error Handling
- 16.6 Address Detect Mode
- 16.7 Loopback Mode
- 16.8 Baud Rate Generator
- 16.9 Auto-Baud Support
- 16.10 UART Operation During CPU Sleep and Idle Modes
  - 16.10.1 UART Operation During CPU Sleep Mode
  - 16.10.2 UART Operation During CPU Idle Mode
    - TABLE 16-1: UART1 Register Map(1)
    - TABLE 16-2: UART2 Register Map(1)
17.0 CAN Module
- 17.1 Overview
- 17.2 Frame Types
  - FIGURE 17-1: CAN Buffers and Protocol Engine Block Diagram
- 17.3 Modes of Operation
- 17.4 Message Reception
- 17.5 Message Transmission
- 17.6 Baud Rate Setting
18.0 Data Converter Interface (DCI) Module
- 18.1 Module Introduction
- 18.2 Module I/O Pins
- 18.3 DCI Module Operation
- 18.4 DCI Module Interrupts
- 18.5 DCI Module Operation During CPU Sleep and Idle Modes
  - 18.5.1 DCI Module Operation During CPU Sleep Mode
  - 18.5.2 DCI Module Operation During CPU Idle Mode
- 18.6 AC-Link Mode Operation
  - 18.6.1 16-bit AC-link Mode
  - 18.6.2 20-bit AC-Link Mode
- 18.7 I2S Mode Operation
  - 18.7.1 I2S Frame and data word Length Selection
  - 18.7.2 I2S DATA Justification
    - TABLE 18-2: DCI Register Map(1)
19.0 12-bit Analog-to-Digital Converter (ADC) Module
- FIGURE 19-1: 12-bit ADC Functional Block Diagram
- 19.1 ADC Result Buffer
- 19.2 Conversion Operation
- 19.3 Selecting the Conversion Sequence
- 19.4 Programming the Start of Conversion Trigger
- 19.5 Aborting a Conversion
- 19.6 Selecting the ADC Conversion Clock
  - EQUATION 19-1: ADC CONVERSION CLOCK
  - EXAMPLE 19-1: ADC Conversion Clock and Sampling Rate Calculation
- 19.7 ADC Speeds
- 19.8 ADC Acquisition Requirements
  - FIGURE 19-4: 12-bit ADC Analog Input Model
- 19.9 Module Power-down Modes
- 19.10 ADC Operation During CPU Sleep and Idle Modes
  - 19.10.1 ADC Operation During CPU Sleep Mode
  - 19.10.2 ADC Operation During CPU Idle Mode
- 19.11 Effects of a Reset
- 19.12 Output Formats
  - FIGURE 19-5: ADC output data formats
- 19.13 Configuring Analog Port Pins
- 19.14 Connection Considerations
  - TABLE 19-2: ADC Register Map(1)
20.0 System Integration
- 20.1 Oscillator System Overview
  - TABLE 20-1: Oscillator Operating Modes
  - FIGURE 20-1: OSCILLATOR SYSTEM BLOCK DIAGRAM
- 20.2 Oscillator Configurations
- 20.3 Oscillator Control Registers
- 20.4 Reset
  - 20.4.1 POR: Power-ON reset
  - 20.4.2 BOR: Programmable Brown-out reset
- 20.5 Watchdog Timer (WDT)
  - 20.5.1 Watchdog Timer Operation
  - 20.5.2 Enabling and Disabling the WDT
- 20.6 Low-Voltage Detect
- 20.7 Power-Saving Modes
  - 20.7.1 Sleep Mode
  - 20.7.2 Idle Mode
- 20.8 Device Configuration Registers
- 20.9 Peripheral Module Disable (PMD) Registers
- 20.10 In-Circuit Debugger
  - TABLE 20-7: System Integration Register Map For dsPIC30F601XA (1)
  - TABLE 20-8: DEVICE Configuration Register Map(1)
21.0 Instruction Set Summary
- TABLE 21-1: Symbols used in Opcode Descriptions
- TABLE 21-2: Instruction Set OVERVIEW
22.0 Development Support
- 22.1 MPLAB Integrated Development Environment Software
- 22.2 MPLAB C Compilers for Various Device Families
- 22.3 HI-TECH C for Various Device Families
- 22.4 MPASM Assembler
- 22.5 MPLINK Object Linker/ MPLIB Object Librarian
- 22.6 MPLAB Assembler, Linker and Librarian for Various Device Families
- 22.7 MPLAB SIM Software Simulator
- 22.8 MPLAB REAL ICE In-Circuit Emulator System
- 22.9 MPLAB ICD 3 In-Circuit Debugger System
- 22.10 PICkit 3 In-Circuit Debugger/ Programmer and PICkit 3 Debug Express
- 22.11 PICkit 2 Development Programmer/Debugger and PICkit 2 Debug Express
- 22.12 MPLAB PM3 Device Programmer
- 22.13 Demonstration/Development Boards, Evaluation Kits, and Starter Kits
23.0 Electrical Characteristics
- Absolute Maximum Ratings(†)
- 23.1 DC Characteristics
- 23.2 AC Characteristics and Timing Parameters
24.0 Packaging Information
- 24.1 Package Marking Information
Appendix A: Revision History
- Revision A (January 2005)
- Revision B (September 2005)
- Revision C (October 2006)
- Revision D (March 2008)
- Revision E (February 2011)
  - TABLE A-1: Major Section Updates
Index
The Microchip Web Site
Customer Change Notification Service
Customer Support
Reader Response
Product Identification System

dsPIC30F6011A/6012A/6013A/6014A

TABLE 23-11: ELECTRICAL CHARACTERISTICS: BOR

DC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ T

A ≤ +125°C for Extended

Param

No.

Symbol Characteristic Min Typ

(1)

Max Units Conditions

BO10 V

BOR BOR Voltage

(2)

VDD transition high to

low

BORV = 11

(3)

— — — V Not in operating

range

BORV = 10 2.6 — 2.71 V

BORV = 01 4.1 — 4.4 V

BORV = 00 4.58 — 4.73 V

BO15 V

BHYS —5—mV

Note 1: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and

are not tested.

2: These parameters are characterized but not tested in manufacturing.

3: ’11’ values not in usable operating range.

TABLE 23-12: DC CHARACTERISTICS: PROGRAM AND EEPROM

DC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No.

Symbol Characteristic Min Typ

(1)

Max Units Conditions

Data EEPROM Memory

(2)

D120 ED Byte Endurance 100K 1M — E/W -40° C ≤ TA ≤ +85°C

D121 VDRW VDD for Read/Write VMIN — 5.5 V Using EECON to read/write

VMIN = Minimum operating

voltage

D122 TDEW Erase/Write Cycle Time 0.8 2 2.6 ms RTSP

D123 T

RETD Characteristic Retention 40 100 — Year Provided no other specifications

are violated

D124 IDEW IDD During Programming — 10 30 mA Row Erase

Program FLASH Memory

(2)

D130 EP Cell Endurance 10K 100K — E/W -40° C ≤ TA ≤ +85°C

D131 VPR VDD for Read VMIN —5.5VVMIN = Minimum operating

voltage

D132 V

EB VDD for Bulk Erase 4.5 — 5.5 V

D133 VPEW VDD for Erase/Write 3.0 — 5.5 V

D134 T

PEW Erase/Write Cycle Time 0.8 2 2.6 ms RTSP

D135 T

RETD Characteristic Retention 40 100 — Year Provided no other specifications

are violated

D137 I

PEW IDD During Programming — 10 30 mA Row Erase

D138 I

EB IDD During Programming — 10 30 mA Bulk Erase

Note 1: Data in “Typ” column is at 5V, 25°C unless otherwise stated.

2: These parameters are characterized but not tested in manufacturing.