Datasheet
Table Of Contents
- High-Performance Modified RISC CPU:
- DSP Features:
- Peripheral Features:
- Analog Features:
- Special Microcontroller Features:
- CMOS Technology:
- dsPIC30F6011A/6012A/6013A/6014A Controller Families
- Pin Diagrams
- Pin Diagrams (Continued)
- Pin Diagrams (Continued)
- Pin Diagrams (Continued)
- Table of Contents
- Most Current Data Sheet
- Errata
- Customer Notification System
- 1.0 Device Overview
- 2.0 CPU Architecture Overview
- 3.0 Memory Organization
- 3.1 Program Address Space
- FIGURE 3-1: program space memory map FOR dsPIC30F6011A/ 6013A
- FIGURE 3-2: program space memory map FOR dsPIC30F6012A/ 6014A
- TABLE 3-1: Program Space Address Construction
- FIGURE 3-3: DATA ACCESS FROM PROGRAM SPACE ADDRESS GENERATION
- 3.1.1 Data Access From Program Memory using Table Instructions
- 3.1.2 Data Access From Program Memory using Program Space Visibility
- 3.2 Data Address Space
- 3.1 Program Address Space
- 4.0 Address Generator Units
- 5.0 Interrupts
- 6.0 Flash Program Memory
- 6.1 In-Circuit Serial Programming (ICSP)
- 6.2 Run-Time Self-Programming (RTSP)
- 6.3 Table Instruction Operation Summary
- 6.4 RTSP Operation
- 6.5 Control Registers
- 6.6 Programming Operations
- 7.0 Data EEPROM Memory
- 8.0 I/O Ports
- 8.1 Parallel I/O (PIO) Ports
- 8.2 Configuring Analog Port Pins
- FIGURE 8-2: Block Diagram of a ShAred PORT Structure
- TABLE 8-1: PORTA Register MAp for dsPIC30F6013A/6014A(1)
- TABLE 8-2: PORTB Register MAp for dsPIC30F6011A/6012A/6013A/6014A(1)
- TABLE 8-3: PORTC Register MAp for dsPIC30F6011A/6012A(1)
- TABLE 8-4: PORTC Register MAp for dsPIC30F6013A/6014A(1)
- TABLE 8-5: PORTD Register MAp for dsPIC30F6011A/6012A(1)
- TABLE 8-6: PORTD Register MAp for dsPIC30F6013A/6014A(1)
- TABLE 8-7: PORTF Register MAp for dsPIC30F6011A/6012A(1)
- TABLE 8-8: PORTF Register MAp for dsPIC30F6013A/6014A(1)
- TABLE 8-9: PORTG Register MAp for dsPIC30F6011A/6012A/6013A/6014A(1)
- 8.3 Input Change Notification Module
- TABLE 8-10: Input change notification register map for dsPIC30F6011A/6012A (Bits 15-8)(1)
- TABLE 8-11: Input Change notification register map FOR dsPIC30F6011A/6012A (Bits 7-0)(1)
- TABLE 8-12: Input change notification register map for dsPIC30F6013A/6014A (Bits 15-8)(1)
- TABLE 8-13: Input Change notification register map FOR dsPIC30F6013A/6014A (Bits 7-0)(1)
- 9.0 Timer1 Module
- 10.0 Timer2/3 Module
- 11.0 Timer4/5 Module
- 12.0 Input Capture Module
- 13.0 Output Compare Module
- FIGURE 13-1: Output Compare Mode Block DiagrAm
- 13.1 Timer2 and Timer3 Selection Mode
- 13.2 Simple Output Compare Match Mode
- 13.3 Dual Output Compare Match Mode
- 13.4 Simple PWM Mode
- 13.5 Output Compare Operation During CPU Sleep Mode
- 13.6 Output Compare Operation During CPU Idle Mode
- 13.7 Output Compare Interrupts
- 14.0 SPI™ Module
- 15.0 I2C™ Module
- 15.1 Operating Function Description
- 15.2 I2C Module Addresses
- 15.3 I2C 7-bit Slave Mode Operation
- 15.4 I2C 10-bit Slave Mode Operation
- 15.5 Automatic Clock Stretch
- 15.6 Software Controlled Clock Stretching (STREN = 1)
- 15.7 Interrupts
- 15.8 Slope Control
- 15.9 IPMI Support
- 15.10 General Call Address Support
- 15.11 I2C Master Support
- 15.12 I2C Master Operation
- 15.13 I2C Module Operation During CPU Sleep and Idle Modes
- 16.0 Universal Asynchronous Receiver Transmitter (UART) Module
- 17.0 CAN Module
- 18.0 Data Converter Interface (DCI) Module
- 18.1 Module Introduction
- 18.2 Module I/O Pins
- 18.3 DCI Module Operation
- 18.3.1 MODULE ENABLE
- 18.3.2 Word Size Selection Bits
- 18.3.3 Frame SYNC GEnerator
- 18.3.4 Frame Sync Mode Control Bits
- 18.3.5 Master frame sync Operation
- 18.3.6 Slave Frame Sync Operation
- 18.3.7 Bit Clock Generator
- 18.3.8 Sample Clock Edge control Bit
- 18.3.9 Data Justification Control bit
- 18.3.10 Transmit Slot Enable Bits
- 18.3.11 Receive Slot Enable Bits
- 18.3.12 Slot Enable Bits Operation with FRame SYNC
- 18.3.13 Synchronous data transfers
- 18.3.14 Buffer Length Control
- 18.3.15 Buffer Alignment With Data Frames
- 18.3.16 Transmit STATUS BITS
- 18.3.17 RECEIVE STATUS bits
- 18.3.18 SLOT Status Bits
- 18.3.19 CSDO Mode Bit
- 18.3.20 Digital Loopback mode
- 18.3.21 Underflow Mode Control Bit
- 18.4 DCI Module Interrupts
- 18.5 DCI Module Operation During CPU Sleep and Idle Modes
- 18.6 AC-Link Mode Operation
- 18.7 I2S Mode Operation
- 19.0 12-bit Analog-to-Digital Converter (ADC) Module
- FIGURE 19-1: 12-bit ADC Functional Block Diagram
- 19.1 ADC Result Buffer
- 19.2 Conversion Operation
- 19.3 Selecting the Conversion Sequence
- 19.4 Programming the Start of Conversion Trigger
- 19.5 Aborting a Conversion
- 19.6 Selecting the ADC Conversion Clock
- 19.7 ADC Speeds
- 19.8 ADC Acquisition Requirements
- 19.9 Module Power-down Modes
- 19.10 ADC Operation During CPU Sleep and Idle Modes
- 19.11 Effects of a Reset
- 19.12 Output Formats
- 19.13 Configuring Analog Port Pins
- 19.14 Connection Considerations
- 20.0 System Integration
- 20.1 Oscillator System Overview
- 20.2 Oscillator Configurations
- 20.3 Oscillator Control Registers
- 20.4 Reset
- 20.5 Watchdog Timer (WDT)
- 20.6 Low-Voltage Detect
- 20.7 Power-Saving Modes
- 20.8 Device Configuration Registers
- 20.9 Peripheral Module Disable (PMD) Registers
- 20.10 In-Circuit Debugger
- 21.0 Instruction Set Summary
- 22.0 Development Support
- 22.1 MPLAB Integrated Development Environment Software
- 22.2 MPLAB C Compilers for Various Device Families
- 22.3 HI-TECH C for Various Device Families
- 22.4 MPASM Assembler
- 22.5 MPLINK Object Linker/ MPLIB Object Librarian
- 22.6 MPLAB Assembler, Linker and Librarian for Various Device Families
- 22.7 MPLAB SIM Software Simulator
- 22.8 MPLAB REAL ICE In-Circuit Emulator System
- 22.9 MPLAB ICD 3 In-Circuit Debugger System
- 22.10 PICkit 3 In-Circuit Debugger/ Programmer and PICkit 3 Debug Express
- 22.11 PICkit 2 Development Programmer/Debugger and PICkit 2 Debug Express
- 22.12 MPLAB PM3 Device Programmer
- 22.13 Demonstration/Development Boards, Evaluation Kits, and Starter Kits
- 23.0 Electrical Characteristics
- Absolute Maximum Ratings(†)
- 23.1 DC Characteristics
- TABLE 23-1: Operating MIPS vs. Voltage
- TABLE 23-2: Thermal Operating Conditions
- TABLE 23-3: Thermal Packaging Characteristics
- TABLE 23-4: DC Temperature and Voltage specifications
- TABLE 23-5: DC Characteristics: Operating Current (Idd)
- TABLE 23-6: DC Characteristics: Idle Current (iidle)
- TABLE 23-7: DC Characteristics: Power-Down Current (Ipd)
- TABLE 23-8: DC Characteristics: I/O Pin Input Specifications
- TABLE 23-9: DC Characteristics: I/O Pin Output Specifications
- FIGURE 23-1: Low-Voltage Detect Characteristics
- TABLE 23-10: Electrical Characteristics: LVDL
- FIGURE 23-2: Brown-out Reset Characteristics
- TABLE 23-11: Electrical Characteristics: BOR
- TABLE 23-12: DC Characteristics: Program and EEPROM
- 23.2 AC Characteristics and Timing Parameters
- TABLE 23-13: Temperature and Voltage Specifications – AC
- FIGURE 23-3: Load Conditions for Device Timing Specifications
- FIGURE 23-4: External Clock Timing
- TABLE 23-14: External Clock Timing Requirements
- TABLE 23-15: PLL Clock Timing Specifications (Vdd = 2.5 to 5.5 V)
- TABLE 23-16: PLL Jitter
- TABLE 23-17: Internal Clock Timing examples
- TABLE 23-18: AC Characteristics: Internal FRC Accuracy
- TABLE 23-19: AC Characteristics: Internal LPRC accuracy
- FIGURE 23-5: CLKOUT and I/O Timing Characteristics
- TABLE 23-20: CLKOUT and I/O Timing Requirements
- FIGURE 23-6: Reset, Watchdog Timer, Oscillator Start-up Timer and Power-up Timer Timing Characteristics
- TABLE 23-21: Reset, Watchdog Timer, Oscillator Start-up Timer, Power-up Timer and Brown-out Reset Timing Requirements
- FIGURE 23-7: band gap Start-up Time Characteristics
- TABLE 23-22: band gap Start-up Time Requirements
- FIGURE 23-8: Type A, B and C Timer External Clock Timing Characteristics
- TABLE 23-23: TYPE A TIMER (Timer1) External Clock Timing Requirements(1)
- TABLE 23-24: TYPE B TIMER (Timer2 and Timer4) External Clock Timing Requirements(1)
- TABLE 23-25: TYPE C TIMER (Timer3 and Timer5) External Clock Timing Requirements(1)
- FIGURE 23-9: INPUT CAPTURE (CAPx) TIMING Characteristics
- TABLE 23-26: Input Capture timing requirements
- FIGURE 23-10: Output Compare Module (OCx) Timing Characteristics
- TABLE 23-27: Output Compare Module timing requirements
- FIGURE 23-11: OC/PWM Module Timing Characteristics
- TABLE 23-28: Simple OC/PWM MODE Timing Requirements
- FIGURE 23-12: DCI Module (Multichannel, I2S modes) Timing Characteristics
- TABLE 23-29: DCI Module (Multichannel, I2S modes) Timing Requirements
- FIGURE 23-13: DCI Module (AC-link mode) Timing Characteristics
- TABLE 23-30: DCI Module (AC-Link Mode) Timing Requirements
- FIGURE 23-14: SPI Module Master Mode (CKE = 0) Timing Characteristics
- TABLE 23-31: SPI Master mode (cke = 0) Timing requirements
- FIGURE 23-15: SPI Module Master Mode (CKE =1) Timing Characteristics
- TABLE 23-32: SPI Module Master mode (cke = 1) Timing requirements
- FIGURE 23-16: SPI Module Slave Mode (CKE = 0) Timing Characteristics
- TABLE 23-33: SPI Module Slave mode (cke = 0) Timing requirements
- FIGURE 23-17: SPI Module Slave Mode (CKE = 1) Timing Characteristics
- TABLE 23-34: SPI Module Slave mode (cke = 1) Timing requirements
- FIGURE 23-18: I2C™ Bus Start/Stop Bits Timing Characteristics (Master mode)
- FIGURE 23-19: I2C™ Bus Data Timing Characteristics (Master mode)
- TABLE 23-35: I2C™ Bus Data Timing Requirements (Master Mode)
- FIGURE 23-20: I2C™ Bus Start/Stop Bits Timing Characteristics (slave mode)
- FIGURE 23-21: I2C™ Bus Data Timing Characteristics (slave mode)
- TABLE 23-36: I2C™ Bus Data Timing Requirements (Slave Mode)
- FIGURE 23-22: CAN Module I/O Timing Characteristics
- TABLE 23-37: CAN Module I/O Timing Requirements
- TABLE 23-38: 12-bit ADC Module Specifications
- FIGURE 23-23: 12-Bit ADC Timing Characteristics (asam = 0, ssrc = 000)
- TABLE 23-39: 12-BIT ADC TiminG rEQUIREMENTS
- 24.0 Packaging Information
- Appendix A: Revision History
- Index
- The Microchip Web Site
- Customer Change Notification Service
- Customer Support
- Reader Response
- Product Identification System

© 2011 Microchip Technology Inc. DS70143E-page 155
dsPIC30F6011A/6012A/6013A/6014A
20.4.1.1 POR with Long Crystal Start-up Time
(with FSCM Enabled)
The oscillator start-up circuitry is not linked to the POR
circuitry. Some crystal circuits (especially low frequency
crystals) will have a relatively long start-up time. There-
fore, one or more of the following conditions is possible
after the POR timer and the PWRT have expired:
• The oscillator circuit has not begun to oscillate.
• The Oscillator Start-up Timer has NOT expired (if
a crystal oscillator is used).
• The PLL has not achieved a LOCK (if PLL is
used).
If the FSCM is enabled and one of the above conditions
is true, then a clock failure trap will occur. The device
will automatically switch to the FRC oscillator and the
user can switch to the desired crystal oscillator in the
trap ISR.
20.4.1.2 Operating without FSCM and PWRT
If the FSCM is disabled and the Power-up Timer
(PWRT) is also disabled, then the device will exit rapidly
from Reset on power-up. If the clock source is FRC,
LPRC, EXTRC or EC, it will be active immediately.
If the FSCM is disabled and the system clock has not
started, the device will be in a frozen state at the Reset
vector until the system clock starts. From the user’s
perspective, the device will appear to be in Reset until
a system clock is available.
20.4.2 BOR: PROGRAMMABLE
BROWN-OUT RESET
The BOR (Brown-out Reset) module is based on an
internal voltage reference circuit. The main purpose of
the BOR module is to generate a device Reset when a
brown-out condition occurs. Brown-out conditions are
generally caused by glitches on the AC mains (i.e.,
missing portions of the AC cycle waveform due to bad
power transmission lines or voltage sags due to exces-
sive current draw when a large inductive load is turned
on).
The BOR module allows selection of one of the
following voltage trip points:
• 2.6V-2.71V
• 4.1V-4.4V
• 4.58V-4.73V
A BOR will generate a Reset pulse which will reset the
device. The BOR will select the clock source, based on
the device Configuration bit values (FOS<2:0> and
FPR<4:0>). Furthermore, if an oscillator mode is
selected, the BOR will activate the Oscillator Start-up
Timer (OST). The system clock is held until OST
expires. If the PLL is used, then the clock will be held
until the LOCK bit (OSCCON<5>) is ‘1’.
Concurrently, the POR time-out (T
POR) and the PWRT
time-out (T
PWRT) will be applied before the internal
Reset is released. If TPWRT = 0 and a crystal oscillator
is being used, then a nominal delay of TFSCM = 100 μs
is applied. The total delay in this case is
(T
POR +TFSCM).
The BOR status bit (RCON<1>) will be set to indicate
that a BOR has occurred. The BOR circuit, if enabled,
will continue to operate while in Sleep or Idle modes
and will reset the device should V
DD fall below the BOR
threshold voltage.
FIGURE 20-6: EXTERNAL POWER-ON
RESET CIRCUIT (FOR
SLOW V
DD POWER-UP)
Note: The BOR voltage trip points indicated here
are nominal values provided for design
guidance only.
Note: Dedicated supervisory devices, such as
the MCP1XX and MCP8XX, may also be
used as an external Power-on Reset
circuit.
Note 1: External Power-on Reset circuit is
required only if the V
DD power-up slope
is too slow. The diode D helps discharge
the capacitor quickly when VDD powers
down.
2: R should be suitably chosen so as to
make sure that the voltage drop across
R does not violate the device’s electrical
specification.
3: R1 should be suitably chosen so as to
limit any current flowing into MCLR
from
external capacitor C, in the event of
MCLR
/VPP pin breakdown due to Elec-
trostatic Discharge (ESD) or Electrical
Overstress (EOS).
C
R1
R
D
V
DD
dsPIC30F
MCLR