Datasheet
Table Of Contents
- dsPIC30F6011/6012/6013/6014 High-Performance Digital Signal Controllers
- 1.0 Device Overview
- 2.0 CPU Architecture Overview
- 3.0 Memory Organization
- 3.1 Program Address Space
- FIGURE 3-1: program space memory map FOR dsPIC30F6011/6013
- FIGURE 3-2: program space memory map FOR dsPIC30F6012/6014
- TABLE 3-1: Program Space Address Construction
- FIGURE 3-3: DATA ACCESS FROM PROGRAM SPACE ADDRESS GENERATION
- 3.1.1 Data Access From Program Memory using Table Instructions
- 3.1.2 Data Access From Program Memory using Program Space Visibility
- 3.2 Data Address Space
- 3.1 Program Address Space
- 4.0 Address Generator Units
- 5.0 Interrupts
- 6.0 Flash Program Memory
- 6.1 In-Circuit Serial Programming (ICSP)
- 6.2 Run-Time Self-Programming (RTSP)
- 6.3 Table Instruction Operation Summary
- 6.4 RTSP Operation
- 6.5 Control Registers
- 6.6 Programming Operations
- 7.0 Data EEPROM Memory
- 8.0 I/O Ports
- 8.1 Parallel I/O (PIO) Ports
- 8.2 Configuring Analog Port Pins
- FIGURE 8-2: Block Diagram of a ShAred PORT Structure
- TABLE 8-1: PORTA Register MAp for dsPIC30F6013/6014
- TABLE 8-2: PORTB Register MAp for dsPIC30F6011/6012/6013/6014
- TABLE 8-3: PORTC Register MAp for dsPIC30F6011/6012
- TABLE 8-4: PORTC Register MAp for dsPIC30F6013/6014
- TABLE 8-5: PORTD Register MAp for dsPIC30F6011/6012
- TABLE 8-6: PORTD Register MAp for dsPIC30F6013/6014
- TABLE 8-7: PORTF Register MAp for dsPIC30F6011/6012
- TABLE 8-8: PORTF Register MAp for dsPIC30F6013/6014
- TABLE 8-9: PORTG Register MAp for dsPIC30F6011/6012/6013/6014
- 8.3 Input Change Notification Module
- TABLE 8-10: Input change notification register map for dsPIC30F6011/6012 (Bits 15-8)
- TABLE 8-11: Input Change notification register map FOR dsPIC30F6011/6012 (Bits 7-0)
- TABLE 8-12: Input change notification register map for dsPIC30F6013/6014 (Bits 15-8)
- TABLE 8-13: Input Change notification register map FOR dsPIC30F6013/6014 (Bits 7-0)
- 9.0 Timer1 Module
- 10.0 Timer2/3 Module
- 11.0 Timer4/5 Module
- 12.0 Input Capture Module
- 13.0 Output Compare Module
- FIGURE 13-1: Output Compare Mode Block DiagrAm
- 13.1 Timer2 and Timer3 Selection Mode
- 13.2 Simple Output Compare Match Mode
- 13.3 Dual Output Compare Match Mode
- 13.4 Simple PWM Mode
- 13.5 Output Compare Operation During CPU Sleep Mode
- 13.6 Output Compare Operation During CPU Idle Mode
- 13.7 Output Compare Interrupts
- 14.0 SPI Module
- 15.0 I2C Module
- 15.1 Operating Function Description
- 15.2 I2C Module Addresses
- 15.3 I2C 7-bit Slave Mode Operation
- 15.4 I2C 10-bit Slave Mode Operation
- 15.5 Automatic Clock Stretch
- 15.6 Software Controlled Clock Stretching (STREN = 1)
- 15.7 Interrupts
- 15.8 Slope Control
- 15.9 IPMI Support
- 15.10 General Call Address Support
- 15.11 I2C Master Support
- 15.12 I2C Master Operation
- 15.13 I2C Module Operation During CPU Sleep and Idle Modes
- 16.0 Universal Asynchronous Receiver Transmitter (UART) Module
- 17.0 CAN Module
- 18.0 Data Converter Interface (DCI) Module
- 18.1 Module Introduction
- 18.2 Module I/O Pins
- 18.3 DCI Module Operation
- 18.3.1 MODULE ENABLE
- 18.3.2 Word Size Selection Bits
- 18.3.3 Frame SYNC GEnerator
- 18.3.4 Frame Sync Mode Control Bits
- 18.3.5 Master frame sync Operation
- 18.3.6 Slave Frame Sync Operation
- 18.3.7 Bit Clock Generator
- 18.3.8 Sample Clock Edge control Bit
- 18.3.9 Data Justification Control bit
- 18.3.10 Transmit Slot Enable Bits
- 18.3.11 Receive Slot Enable Bits
- 18.3.12 Slot Enable Bits Operation with FRame SYNC
- 18.3.13 Synchronous data transfers
- 18.3.14 Buffer Length Control
- 18.3.15 Buffer Alignment With Data Frames
- 18.3.16 Transmit STATUS BITS
- 18.3.17 RECEIVE STATUS bits
- 18.3.18 SLOT Status Bits
- 18.3.19 CSDO Mode Bit
- 18.3.20 Digital Loopback mode
- 18.3.21 Underflow Mode Control Bit
- 18.4 DCI Module Interrupts
- 18.5 DCI Module Operation During CPU Sleep and Idle Modes
- 18.6 AC-Link Mode Operation
- 18.7 I2S Mode Operation
- 19.0 12-bit Analog-to-Digital Converter (A/D) Module
- FIGURE 19-1: 12-bit ADC Functional Block Diagram
- 19.1 ADC Result Buffer
- 19.2 Conversion Operation
- 19.3 Selecting the Conversion Sequence
- 19.4 Programming the Start of Conversion Trigger
- 19.5 Aborting a Conversion
- 19.6 Selecting the ADC Conversion Clock
- 19.7 ADC Speeds
- 19.8 A/D Acquisition Requirements
- 19.9 Module Power-down Modes
- 19.10 ADC Operation During CPU Sleep and Idle Modes
- 19.11 Effects of a Reset
- 19.12 Output Formats
- 19.13 Configuring Analog Port Pins
- 19.14 Connection Considerations
- 20.0 System Integration
- 20.1 Oscillator System Overview
- 20.2 Oscillator Configurations
- 20.3 Reset
- FIGURE 20-2: Reset SYSTEM BLOCK DIAGRAM
- 20.3.1 POR: Power-ON reset
- FIGURE 20-3: Time-out Sequence on Power-up (MCLR Tied to Vdd)
- FIGURE 20-4: Time-out Sequence on Power-up (MCLR not Tied to Vdd): Case 1
- FIGURE 20-5: Time-out Sequence on Power-up (MCLR not Tied to Vdd): Case 2
- 20.3.1.1 POR with Long Crystal Start-up Time (with FSCM Enabled)
- 20.3.1.2 Operating without FSCM and PWRT
- 20.3.2 BOR: Programmable Brown-out reset
- 20.4 Watchdog Timer (WDT)
- 20.5 Low-Voltage Detect
- 20.6 Power Saving Modes
- 20.7 Device Configuration Registers
- 20.8 Peripheral Module Disable (PMD) Registers
- 20.9 In-Circuit Debugger
- 21.0 Instruction Set Summary
- 22.0 Development Support
- 22.1 MPLAB Integrated Development Environment Software
- 22.2 MPASM Assembler
- 22.3 MPLAB C18 and MPLAB C30 C Compilers
- 22.4 MPLINK Object Linker/ MPLIB Object Librarian
- 22.5 MPLAB ASM30 Assembler, Linker and Librarian
- 22.6 MPLAB SIM Software Simulator
- 22.7 MPLAB ICE 2000 High-Performance In-Circuit Emulator
- 22.8 MPLAB REAL ICE In-Circuit Emulator System
- 22.9 MPLAB ICD 2 In-Circuit Debugger
- 22.10 MPLAB PM3 Device Programmer
- 22.11 PICSTART Plus Development Programmer
- 22.12 PICkit 2 Development Programmer
- 22.13 Demonstration, Development and Evaluation Boards
- 23.0 Electrical Characteristics
- 23.1 DC Characteristics
- TABLE 23-1: Operating MIPS vs. Voltage
- TABLE 23-2: Thermal Operating Conditions
- TABLE 23-3: Thermal Packaging Characteristics
- TABLE 23-4: DC Temperature and Voltage specifications
- TABLE 23-5: DC Characteristics: Operating Current (Idd)
- TABLE 23-6: DC Characteristics: Idle Current (iidle)
- TABLE 23-7: DC Characteristics: Power-Down Current (Ipd)
- TABLE 23-8: DC Characteristics: I/O Pin Input Specifications
- TABLE 23-9: DC Characteristics: I/O Pin Output Specifications
- FIGURE 23-1: Low-Voltage Detect Characteristics
- TABLE 23-10: Electrical Characteristics: LVDL
- FIGURE 23-2: Brown-out Reset Characteristics
- TABLE 23-11: Electrical Characteristics: BOR
- TABLE 23-12: DC Characteristics: Program and EEPROM
- 23.2 AC Characteristics and Timing Parameters
- TABLE 23-13: Temperature and Voltage Specifications – AC
- FIGURE 23-3: Load Conditions for Device Timing Specifications
- FIGURE 23-4: External Clock Timing
- TABLE 23-14: External Clock Timing Requirements
- TABLE 23-15: PLL Clock Timing Specifications (Vdd = 2.5 to 5.5V)
- TABLE 23-16: PLL JITTER
- TABLE 23-17: Internal Clock Timing examples
- TABLE 23-18: AC Characteristics: Internal RC Accuracy(2)
- TABLE 23-19: Internal RC Accuracy
- FIGURE 23-5: CLKO and I/O Timing Characteristics
- TABLE 23-20: CLKO and I/O Timing Requirements
- FIGURE 23-6: Reset, Watchdog Timer, Oscillator Start-up Timer and Power-up Timer Timing Character...
- TABLE 23-21: Reset, Watchdog Timer, Oscillator Start-up Timer, Power-up Timer and Brown-out Reset...
- FIGURE 23-7: band gap Start-up Time Characteristics
- TABLE 23-22: band gap Start-up Time Requirements
- FIGURE 23-8: Type A, B and C Timer External Clock Timing Characteristics
- TABLE 23-23: TYPE A TIMER (Timer1) External Clock Timing Requirements(1)
- TABLE 23-24: TYPE B TIMER (Timer2 and Timer4) External Clock Timing Requirements(1)
- TABLE 23-25: TYPE C TIMER (Timer3 and Timer5) External Clock Timing Requirements(1)
- FIGURE 23-9: INPUT CAPTURE (CAPx) TIMING Characteristics
- TABLE 23-26: Input Capture timing requirements
- FIGURE 23-10: Output Compare Module (OCx) Timing Characteristics
- TABLE 23-27: Output Compare Module timing requirements
- FIGURE 23-11: OC/PWM Module Timing Characteristics
- TABLE 23-28: Simple OC/PWM MODE Timing Requirements
- FIGURE 23-12: DCI Module (Multichannel, I2S modes) Timing Characteristics
- TABLE 23-29: DCI Module (Multichannel, I2S modes) Timing Requirements
- FIGURE 23-13: DCI Module (AC-link mode) Timing Characteristics
- TABLE 23-30: DCI Module (AC-Link Mode) Timing Requirements
- FIGURE 23-14: SPI Module Master Mode (CKE = 0) Timing Characteristics
- TABLE 23-31: SPI Master mode (cke = 0) Timing requirements
- FIGURE 23-15: SPI Module Master Mode (CKE = 1) Timing Characteristics
- TABLE 23-32: SPI Module Master mode (cke = 1) Timing requirements
- FIGURE 23-16: SPI Module Slave Mode (CKE = 0) Timing Characteristics
- TABLE 23-33: SPI Module Slave mode (cke = 0) Timing requirements
- FIGURE 23-17: SPI Module Slave Mode (CKE = 1) Timing Characteristics
- TABLE 23-34: SPI Module Slave mode (cke = 1) Timing requirements
- FIGURE 23-18: I2C™ Bus Start/Stop Bits Timing Characteristics (Master mode)
- FIGURE 23-19: I2C™ Bus Data Timing Characteristics (Master mode)
- TABLE 23-35: I2C™ Bus Data Timing Requirements (Master Mode)
- FIGURE 23-20: I2C™ Bus Start/Stop Bits Timing Characteristics (slave mode)
- FIGURE 23-21: I2C™ Bus Data Timing Characteristics (slave mode)
- TABLE 23-36: I2C™ Bus Data Timing Requirements (Slave Mode)
- FIGURE 23-22: CAN Module I/O Timing Characteristics
- TABLE 23-37: CAN Module I/O Timing Requirements
- TABLE 23-38: 12-bit aDC Module Specifications
- FIGURE 23-23: 12-Bit A/D Conversion Timing Characteristics (asam = 0, ssrc = 000)
- TABLE 23-39: 12-BIT A/D Conversion TiminG rEQUIREMENTS
- 23.1 DC Characteristics
- 24.0 Packaging Information
- Appendix A: Revision History
- Index
- The Microchip Web Site
- Customer Change Notification Service
- Customer Support
- Reader Response
- Product Identification System
- Worldwide Sales and Service

dsPIC30F6011/6012/6013/6014
DS70117F-page 150 © 2006 Microchip Technology Inc.
If the oscillator has a very slow start-up time coming out
of POR, BOR or Sleep, it is possible that the PWRT
timer will expire before the oscillator has started. In
such cases, the FSCM will be activated and the FSCM
will initiate a clock failure trap, and the COSC<1:0> bits
are loaded with FRC oscillator selection. This will effec-
tively shut off the original oscillator that was trying to
start.
The user may detect this situation and restart the
oscillator in the clock fail trap ISR.
Upon a clock failure detection, the FSCM module will
initiate a clock switch to the FRC oscillator as follows:
1. The COSC bits (OSCCON<13:12>) are loaded
with the FRC oscillator selection value.
2. CF bit is set (OSCCON<3>).
3. OSWEN control bit (OSCCON<0>) is cleared.
For the purpose of clock switching, the clock sources
are sectioned into four groups:
1. Primary
2. Secondary
3. Internal FRC
4. Internal LPRC
The user can switch between these functional groups
but cannot switch between options within a group. If the
primary group is selected, then the choice within the
group is always determined by the FPR<3:0>
Configuration bits.
The OSCCON register holds the control and status bits
related to clock switching.
• COSC<1:0>: Read-only status bits always reflect
the current oscillator group in effect.
• NOSC<1:0>: Control bits which are written to
indicate the new oscillator group of choice.
- On POR and BOR, COSC<1:0> and
NOSC<1:0> are both loaded with the
Configuration bit values FOS<1:0>.
• LOCK: The LOCK status bit indicates a PLL lock.
• CF: Read only status bit indicating if a clock fail
detect has occurred.
• OSWEN: Control bit changes from a ‘0’ to a ‘1’
when a clock transition sequence is initiated.
Clearing the OSWEN control bit will abort a clock
transition in progress (used for hang-up
situations).
If Configuration bits FCKSM<1:0> = 1x, then the clock
switching and Fail-Safe Clock monitoring functions are
disabled. This is the default Configuration bit setting.
If clock switching is disabled, then the FOS<1:0> and
FPR<3:0> bits directly control the oscillator selection
and the COSC<1:0> bits do not control the clock selec-
tion. However, these bits will reflect the clock source
selection.
20.2.8 PROTECTION AGAINST
ACCIDENTAL WRITES TO OSCCON
A write to the OSCCON register is intentionally made
difficult because it controls clock switching and clock
scaling.
To write to the OSCCON low byte, the following code
sequence must be executed without any other
instructions in between:
Byte write is allowed for one instruction cycle. Write the
desired value or use bit manipulation instruction.
To write to the OSCCON high byte, the following
instructions must be executed without any other
instructions in between:
Byte write is allowed for one instruction cycle. Write the
desired value or use bit manipulation instruction.
Note: The application should not attempt to
switch to a clock of frequency lower than
100 KHz when the fail-safe clock monitor is
enabled. If such clock switching is
performed, the device may generate an
oscillator fail trap and switch to the Fast RC
oscillator.
Byte Write “0x46” to OSCCON low
Byte Write “0x57” to OSCCON low
Byte Write “0x78” to OSCCON high
Byte Write “0x9A” to OSCCON high