Datasheet
Table Of Contents
- High-Performance Modified RISC CPU:
- DSP Features:
- Peripheral Features:
- Analog Features:
- Special Microcontroller Features:
- CMOS Technology:
- dsPIC30F6011A/6012A/6013A/6014A Controller Families
- Pin Diagrams
- Pin Diagrams (Continued)
- Pin Diagrams (Continued)
- Pin Diagrams (Continued)
- Table of Contents
- Most Current Data Sheet
- Errata
- Customer Notification System
- 1.0 Device Overview
- 2.0 CPU Architecture Overview
- 3.0 Memory Organization
- 3.1 Program Address Space
- FIGURE 3-1: program space memory map FOR dsPIC30F6011A/ 6013A
- FIGURE 3-2: program space memory map FOR dsPIC30F6012A/ 6014A
- TABLE 3-1: Program Space Address Construction
- FIGURE 3-3: DATA ACCESS FROM PROGRAM SPACE ADDRESS GENERATION
- 3.1.1 Data Access From Program Memory using Table Instructions
- 3.1.2 Data Access From Program Memory using Program Space Visibility
- 3.2 Data Address Space
- 3.1 Program Address Space
- 4.0 Address Generator Units
- 5.0 Interrupts
- 6.0 Flash Program Memory
- 6.1 In-Circuit Serial Programming (ICSP)
- 6.2 Run-Time Self-Programming (RTSP)
- 6.3 Table Instruction Operation Summary
- 6.4 RTSP Operation
- 6.5 Control Registers
- 6.6 Programming Operations
- 7.0 Data EEPROM Memory
- 8.0 I/O Ports
- 8.1 Parallel I/O (PIO) Ports
- 8.2 Configuring Analog Port Pins
- FIGURE 8-2: Block Diagram of a ShAred PORT Structure
- TABLE 8-1: PORTA Register MAp for dsPIC30F6013A/6014A(1)
- TABLE 8-2: PORTB Register MAp for dsPIC30F6011A/6012A/6013A/6014A(1)
- TABLE 8-3: PORTC Register MAp for dsPIC30F6011A/6012A(1)
- TABLE 8-4: PORTC Register MAp for dsPIC30F6013A/6014A(1)
- TABLE 8-5: PORTD Register MAp for dsPIC30F6011A/6012A(1)
- TABLE 8-6: PORTD Register MAp for dsPIC30F6013A/6014A(1)
- TABLE 8-7: PORTF Register MAp for dsPIC30F6011A/6012A(1)
- TABLE 8-8: PORTF Register MAp for dsPIC30F6013A/6014A(1)
- TABLE 8-9: PORTG Register MAp for dsPIC30F6011A/6012A/6013A/6014A(1)
- 8.3 Input Change Notification Module
- TABLE 8-10: Input change notification register map for dsPIC30F6011A/6012A (Bits 15-8)(1)
- TABLE 8-11: Input Change notification register map FOR dsPIC30F6011A/6012A (Bits 7-0)(1)
- TABLE 8-12: Input change notification register map for dsPIC30F6013A/6014A (Bits 15-8)(1)
- TABLE 8-13: Input Change notification register map FOR dsPIC30F6013A/6014A (Bits 7-0)(1)
- 9.0 Timer1 Module
- 10.0 Timer2/3 Module
- 11.0 Timer4/5 Module
- 12.0 Input Capture Module
- 13.0 Output Compare Module
- FIGURE 13-1: Output Compare Mode Block DiagrAm
- 13.1 Timer2 and Timer3 Selection Mode
- 13.2 Simple Output Compare Match Mode
- 13.3 Dual Output Compare Match Mode
- 13.4 Simple PWM Mode
- 13.5 Output Compare Operation During CPU Sleep Mode
- 13.6 Output Compare Operation During CPU Idle Mode
- 13.7 Output Compare Interrupts
- 14.0 SPI™ Module
- 15.0 I2C™ Module
- 15.1 Operating Function Description
- 15.2 I2C Module Addresses
- 15.3 I2C 7-bit Slave Mode Operation
- 15.4 I2C 10-bit Slave Mode Operation
- 15.5 Automatic Clock Stretch
- 15.6 Software Controlled Clock Stretching (STREN = 1)
- 15.7 Interrupts
- 15.8 Slope Control
- 15.9 IPMI Support
- 15.10 General Call Address Support
- 15.11 I2C Master Support
- 15.12 I2C Master Operation
- 15.13 I2C Module Operation During CPU Sleep and Idle Modes
- 16.0 Universal Asynchronous Receiver Transmitter (UART) Module
- 17.0 CAN Module
- 18.0 Data Converter Interface (DCI) Module
- 18.1 Module Introduction
- 18.2 Module I/O Pins
- 18.3 DCI Module Operation
- 18.3.1 MODULE ENABLE
- 18.3.2 Word Size Selection Bits
- 18.3.3 Frame SYNC GEnerator
- 18.3.4 Frame Sync Mode Control Bits
- 18.3.5 Master frame sync Operation
- 18.3.6 Slave Frame Sync Operation
- 18.3.7 Bit Clock Generator
- 18.3.8 Sample Clock Edge control Bit
- 18.3.9 Data Justification Control bit
- 18.3.10 Transmit Slot Enable Bits
- 18.3.11 Receive Slot Enable Bits
- 18.3.12 Slot Enable Bits Operation with FRame SYNC
- 18.3.13 Synchronous data transfers
- 18.3.14 Buffer Length Control
- 18.3.15 Buffer Alignment With Data Frames
- 18.3.16 Transmit STATUS BITS
- 18.3.17 RECEIVE STATUS bits
- 18.3.18 SLOT Status Bits
- 18.3.19 CSDO Mode Bit
- 18.3.20 Digital Loopback mode
- 18.3.21 Underflow Mode Control Bit
- 18.4 DCI Module Interrupts
- 18.5 DCI Module Operation During CPU Sleep and Idle Modes
- 18.6 AC-Link Mode Operation
- 18.7 I2S Mode Operation
- 19.0 12-bit Analog-to-Digital Converter (ADC) Module
- FIGURE 19-1: 12-bit ADC Functional Block Diagram
- 19.1 ADC Result Buffer
- 19.2 Conversion Operation
- 19.3 Selecting the Conversion Sequence
- 19.4 Programming the Start of Conversion Trigger
- 19.5 Aborting a Conversion
- 19.6 Selecting the ADC Conversion Clock
- 19.7 ADC Speeds
- 19.8 ADC Acquisition Requirements
- 19.9 Module Power-down Modes
- 19.10 ADC Operation During CPU Sleep and Idle Modes
- 19.11 Effects of a Reset
- 19.12 Output Formats
- 19.13 Configuring Analog Port Pins
- 19.14 Connection Considerations
- 20.0 System Integration
- 20.1 Oscillator System Overview
- 20.2 Oscillator Configurations
- 20.3 Oscillator Control Registers
- 20.4 Reset
- 20.5 Watchdog Timer (WDT)
- 20.6 Low-Voltage Detect
- 20.7 Power-Saving Modes
- 20.8 Device Configuration Registers
- 20.9 Peripheral Module Disable (PMD) Registers
- 20.10 In-Circuit Debugger
- 21.0 Instruction Set Summary
- 22.0 Development Support
- 22.1 MPLAB Integrated Development Environment Software
- 22.2 MPLAB C Compilers for Various Device Families
- 22.3 HI-TECH C for Various Device Families
- 22.4 MPASM Assembler
- 22.5 MPLINK Object Linker/ MPLIB Object Librarian
- 22.6 MPLAB Assembler, Linker and Librarian for Various Device Families
- 22.7 MPLAB SIM Software Simulator
- 22.8 MPLAB REAL ICE In-Circuit Emulator System
- 22.9 MPLAB ICD 3 In-Circuit Debugger System
- 22.10 PICkit 3 In-Circuit Debugger/ Programmer and PICkit 3 Debug Express
- 22.11 PICkit 2 Development Programmer/Debugger and PICkit 2 Debug Express
- 22.12 MPLAB PM3 Device Programmer
- 22.13 Demonstration/Development Boards, Evaluation Kits, and Starter Kits
- 23.0 Electrical Characteristics
- Absolute Maximum Ratings(†)
- 23.1 DC Characteristics
- TABLE 23-1: Operating MIPS vs. Voltage
- TABLE 23-2: Thermal Operating Conditions
- TABLE 23-3: Thermal Packaging Characteristics
- TABLE 23-4: DC Temperature and Voltage specifications
- TABLE 23-5: DC Characteristics: Operating Current (Idd)
- TABLE 23-6: DC Characteristics: Idle Current (iidle)
- TABLE 23-7: DC Characteristics: Power-Down Current (Ipd)
- TABLE 23-8: DC Characteristics: I/O Pin Input Specifications
- TABLE 23-9: DC Characteristics: I/O Pin Output Specifications
- FIGURE 23-1: Low-Voltage Detect Characteristics
- TABLE 23-10: Electrical Characteristics: LVDL
- FIGURE 23-2: Brown-out Reset Characteristics
- TABLE 23-11: Electrical Characteristics: BOR
- TABLE 23-12: DC Characteristics: Program and EEPROM
- 23.2 AC Characteristics and Timing Parameters
- TABLE 23-13: Temperature and Voltage Specifications – AC
- FIGURE 23-3: Load Conditions for Device Timing Specifications
- FIGURE 23-4: External Clock Timing
- TABLE 23-14: External Clock Timing Requirements
- TABLE 23-15: PLL Clock Timing Specifications (Vdd = 2.5 to 5.5 V)
- TABLE 23-16: PLL Jitter
- TABLE 23-17: Internal Clock Timing examples
- TABLE 23-18: AC Characteristics: Internal FRC Accuracy
- TABLE 23-19: AC Characteristics: Internal LPRC accuracy
- FIGURE 23-5: CLKOUT and I/O Timing Characteristics
- TABLE 23-20: CLKOUT and I/O Timing Requirements
- FIGURE 23-6: Reset, Watchdog Timer, Oscillator Start-up Timer and Power-up Timer Timing Characteristics
- TABLE 23-21: Reset, Watchdog Timer, Oscillator Start-up Timer, Power-up Timer and Brown-out Reset Timing Requirements
- FIGURE 23-7: band gap Start-up Time Characteristics
- TABLE 23-22: band gap Start-up Time Requirements
- FIGURE 23-8: Type A, B and C Timer External Clock Timing Characteristics
- TABLE 23-23: TYPE A TIMER (Timer1) External Clock Timing Requirements(1)
- TABLE 23-24: TYPE B TIMER (Timer2 and Timer4) External Clock Timing Requirements(1)
- TABLE 23-25: TYPE C TIMER (Timer3 and Timer5) External Clock Timing Requirements(1)
- FIGURE 23-9: INPUT CAPTURE (CAPx) TIMING Characteristics
- TABLE 23-26: Input Capture timing requirements
- FIGURE 23-10: Output Compare Module (OCx) Timing Characteristics
- TABLE 23-27: Output Compare Module timing requirements
- FIGURE 23-11: OC/PWM Module Timing Characteristics
- TABLE 23-28: Simple OC/PWM MODE Timing Requirements
- FIGURE 23-12: DCI Module (Multichannel, I2S modes) Timing Characteristics
- TABLE 23-29: DCI Module (Multichannel, I2S modes) Timing Requirements
- FIGURE 23-13: DCI Module (AC-link mode) Timing Characteristics
- TABLE 23-30: DCI Module (AC-Link Mode) Timing Requirements
- FIGURE 23-14: SPI Module Master Mode (CKE = 0) Timing Characteristics
- TABLE 23-31: SPI Master mode (cke = 0) Timing requirements
- FIGURE 23-15: SPI Module Master Mode (CKE =1) Timing Characteristics
- TABLE 23-32: SPI Module Master mode (cke = 1) Timing requirements
- FIGURE 23-16: SPI Module Slave Mode (CKE = 0) Timing Characteristics
- TABLE 23-33: SPI Module Slave mode (cke = 0) Timing requirements
- FIGURE 23-17: SPI Module Slave Mode (CKE = 1) Timing Characteristics
- TABLE 23-34: SPI Module Slave mode (cke = 1) Timing requirements
- FIGURE 23-18: I2C™ Bus Start/Stop Bits Timing Characteristics (Master mode)
- FIGURE 23-19: I2C™ Bus Data Timing Characteristics (Master mode)
- TABLE 23-35: I2C™ Bus Data Timing Requirements (Master Mode)
- FIGURE 23-20: I2C™ Bus Start/Stop Bits Timing Characteristics (slave mode)
- FIGURE 23-21: I2C™ Bus Data Timing Characteristics (slave mode)
- TABLE 23-36: I2C™ Bus Data Timing Requirements (Slave Mode)
- FIGURE 23-22: CAN Module I/O Timing Characteristics
- TABLE 23-37: CAN Module I/O Timing Requirements
- TABLE 23-38: 12-bit ADC Module Specifications
- FIGURE 23-23: 12-Bit ADC Timing Characteristics (asam = 0, ssrc = 000)
- TABLE 23-39: 12-BIT ADC TiminG rEQUIREMENTS
- 24.0 Packaging Information
- Appendix A: Revision History
- Index
- The Microchip Web Site
- Customer Change Notification Service
- Customer Support
- Reader Response
- Product Identification System

© 2011 Microchip Technology Inc. DS70143E-page 117
dsPIC30F6011A/6012A/6013A/6014A
17.6.2 PRESCALER SETTING
There is a programmable prescaler with integral values
ranging from 1 to 64, in addition to a fixed divide-by-2
for clock generation. The time quantum (T
Q) is a fixed
unit of time derived from the oscillator period, and is
given by Equation 17-1.
EQUATION 17-1: TIME QUANTUM FOR
CLOCK GENERATION
17.6.3 PROPAGATION SEGMENT
This part of the bit time is used to compensate physical
delay times within the network. These delay times con-
sist of the signal propagation time on the bus line and
the internal delay time of the nodes. The Prop Seg can
be programmed from 1 T
Q to 8 TQ by setting the
PRSEG<2:0> bits (CiCFG2<2:0>).
17.6.4 PHASE SEGMENTS
The phase segments are used to optimally locate the
sampling of the received bit within the transmitted bit
time. The sampling point is between Phase1 Seg and
Phase2 Seg. These segments are lengthened or short-
ened by resynchronization. The end of the Phase1 Seg
determines the sampling point within a bit period. The
segment is programmable from 1 T
Q to 8 TQ. Phase2
Seg provides delay to the next transmitted data transi-
tion. The segment is programmable from 1 TQ to 8 TQ,
or it may be defined to be equal to the greater of
Phase1 Seg or the information processing time (2 T
Q).
The Phase1 Seg is initialized by setting bits
SEG1PH<2:0> (CiCFG2<5:3>), and Phase2 Seg is
initialized by setting SEG2PH<2:0> (CiCFG2<10:8>).
The following requirement must be fulfilled while setting
the lengths of the phase segments:
Prop Seg + Phase1 Seg > = Phase2 Seg
17.6.5 SAMPLE POINT
The sample point is the point of time at which the bus
level is read and interpreted as the value of that respec-
tive bit. The location is at the end of Phase1 Seg. If the
bit timing is slow and contains many T
Q, it is possible to
specify multiple sampling of the bus line at the sample
point. The level determined by the CAN bus then corre-
sponds to the result from the majority decision of three
values. The majority samples are taken at the sample
point and twice before with a distance of T
Q/2. The
CAN module allows the user to choose between sam-
pling three times at the same point or once at the same
point, by setting or clearing the SAM bit (CiCFG2<6>).
Typically, the sampling of the bit should take place at
about 60-70% through the bit time, depending on the
system parameters.
17.6.6 SYNCHRONIZATION
To compensate for phase shifts between the oscillator
frequencies of the different bus stations, each CAN
controller must be able to synchronize to the relevant
signal edge of the incoming signal. When an edge in
the transmitted data is detected, the logic will compare
the location of the edge to the expected time (Synchro-
nous Segment). The circuit will then adjust the values
of Phase1 Seg and Phase2 Seg. There are 2
mechanisms used to synchronize.
17.6.6.1 Hard Synchronization
Hard synchronization is only done whenever there is a
‘recessive’ to ‘dominant’ edge during bus Idle indicating
the start of a message. After hard synchronization, the
bit time counters are restarted with the Sync Seg. Hard
synchronization forces the edge which has caused the
hard synchronization to lie within the synchronization
segment of the restarted bit time. If a hard synchroniza-
tion is done, there will not be a resynchronization within
that bit time.
17.6.6.2 Resynchronization
As a result of resynchronization, Phase1 Seg may be
lengthened or Phase2 Seg may be shortened. The
amount of lengthening or shortening of the phase buf-
fer segment has an upper bound known as the syn-
chronization jump width, and is specified by the
SJW<1:0> bits (CiCFG1<7:6>). The value of the syn-
chronization jump width will be added to Phase1 Seg or
subtracted from Phase2 Seg. The resynchronization
jump width is programmable between 1 T
Q and 4 TQ.
The following requirement must be fulfilled while setting
the SJW<1:0> bits:
Phase2 Seg > Synchronization Jump Width
Note: F
CAN must not exceed 30 MHz. If
CANCKS = 0, then F
CY must not exceed
7.5 MHz.
TQ = 2 (BRP<5:0> + 1) / FCAN