Datasheet
Table Of Contents
- dsPIC30F6011/6012/6013/6014 High-Performance Digital Signal Controllers
- 1.0 Device Overview
- 2.0 CPU Architecture Overview
- 3.0 Memory Organization
- 3.1 Program Address Space
- FIGURE 3-1: program space memory map FOR dsPIC30F6011/6013
- FIGURE 3-2: program space memory map FOR dsPIC30F6012/6014
- TABLE 3-1: Program Space Address Construction
- FIGURE 3-3: DATA ACCESS FROM PROGRAM SPACE ADDRESS GENERATION
- 3.1.1 Data Access From Program Memory using Table Instructions
- 3.1.2 Data Access From Program Memory using Program Space Visibility
- 3.2 Data Address Space
- 3.1 Program Address Space
- 4.0 Address Generator Units
- 5.0 Interrupts
- 6.0 Flash Program Memory
- 6.1 In-Circuit Serial Programming (ICSP)
- 6.2 Run-Time Self-Programming (RTSP)
- 6.3 Table Instruction Operation Summary
- 6.4 RTSP Operation
- 6.5 Control Registers
- 6.6 Programming Operations
- 7.0 Data EEPROM Memory
- 8.0 I/O Ports
- 8.1 Parallel I/O (PIO) Ports
- 8.2 Configuring Analog Port Pins
- FIGURE 8-2: Block Diagram of a ShAred PORT Structure
- TABLE 8-1: PORTA Register MAp for dsPIC30F6013/6014
- TABLE 8-2: PORTB Register MAp for dsPIC30F6011/6012/6013/6014
- TABLE 8-3: PORTC Register MAp for dsPIC30F6011/6012
- TABLE 8-4: PORTC Register MAp for dsPIC30F6013/6014
- TABLE 8-5: PORTD Register MAp for dsPIC30F6011/6012
- TABLE 8-6: PORTD Register MAp for dsPIC30F6013/6014
- TABLE 8-7: PORTF Register MAp for dsPIC30F6011/6012
- TABLE 8-8: PORTF Register MAp for dsPIC30F6013/6014
- TABLE 8-9: PORTG Register MAp for dsPIC30F6011/6012/6013/6014
- 8.3 Input Change Notification Module
- TABLE 8-10: Input change notification register map for dsPIC30F6011/6012 (Bits 15-8)
- TABLE 8-11: Input Change notification register map FOR dsPIC30F6011/6012 (Bits 7-0)
- TABLE 8-12: Input change notification register map for dsPIC30F6013/6014 (Bits 15-8)
- TABLE 8-13: Input Change notification register map FOR dsPIC30F6013/6014 (Bits 7-0)
- 9.0 Timer1 Module
- 10.0 Timer2/3 Module
- 11.0 Timer4/5 Module
- 12.0 Input Capture Module
- 13.0 Output Compare Module
- FIGURE 13-1: Output Compare Mode Block DiagrAm
- 13.1 Timer2 and Timer3 Selection Mode
- 13.2 Simple Output Compare Match Mode
- 13.3 Dual Output Compare Match Mode
- 13.4 Simple PWM Mode
- 13.5 Output Compare Operation During CPU Sleep Mode
- 13.6 Output Compare Operation During CPU Idle Mode
- 13.7 Output Compare Interrupts
- 14.0 SPI Module
- 15.0 I2C Module
- 15.1 Operating Function Description
- 15.2 I2C Module Addresses
- 15.3 I2C 7-bit Slave Mode Operation
- 15.4 I2C 10-bit Slave Mode Operation
- 15.5 Automatic Clock Stretch
- 15.6 Software Controlled Clock Stretching (STREN = 1)
- 15.7 Interrupts
- 15.8 Slope Control
- 15.9 IPMI Support
- 15.10 General Call Address Support
- 15.11 I2C Master Support
- 15.12 I2C Master Operation
- 15.13 I2C Module Operation During CPU Sleep and Idle Modes
- 16.0 Universal Asynchronous Receiver Transmitter (UART) Module
- 17.0 CAN Module
- 18.0 Data Converter Interface (DCI) Module
- 18.1 Module Introduction
- 18.2 Module I/O Pins
- 18.3 DCI Module Operation
- 18.3.1 MODULE ENABLE
- 18.3.2 Word Size Selection Bits
- 18.3.3 Frame SYNC GEnerator
- 18.3.4 Frame Sync Mode Control Bits
- 18.3.5 Master frame sync Operation
- 18.3.6 Slave Frame Sync Operation
- 18.3.7 Bit Clock Generator
- 18.3.8 Sample Clock Edge control Bit
- 18.3.9 Data Justification Control bit
- 18.3.10 Transmit Slot Enable Bits
- 18.3.11 Receive Slot Enable Bits
- 18.3.12 Slot Enable Bits Operation with FRame SYNC
- 18.3.13 Synchronous data transfers
- 18.3.14 Buffer Length Control
- 18.3.15 Buffer Alignment With Data Frames
- 18.3.16 Transmit STATUS BITS
- 18.3.17 RECEIVE STATUS bits
- 18.3.18 SLOT Status Bits
- 18.3.19 CSDO Mode Bit
- 18.3.20 Digital Loopback mode
- 18.3.21 Underflow Mode Control Bit
- 18.4 DCI Module Interrupts
- 18.5 DCI Module Operation During CPU Sleep and Idle Modes
- 18.6 AC-Link Mode Operation
- 18.7 I2S Mode Operation
- 19.0 12-bit Analog-to-Digital Converter (A/D) Module
- FIGURE 19-1: 12-bit ADC Functional Block Diagram
- 19.1 ADC Result Buffer
- 19.2 Conversion Operation
- 19.3 Selecting the Conversion Sequence
- 19.4 Programming the Start of Conversion Trigger
- 19.5 Aborting a Conversion
- 19.6 Selecting the ADC Conversion Clock
- 19.7 ADC Speeds
- 19.8 A/D Acquisition Requirements
- 19.9 Module Power-down Modes
- 19.10 ADC Operation During CPU Sleep and Idle Modes
- 19.11 Effects of a Reset
- 19.12 Output Formats
- 19.13 Configuring Analog Port Pins
- 19.14 Connection Considerations
- 20.0 System Integration
- 20.1 Oscillator System Overview
- 20.2 Oscillator Configurations
- 20.3 Reset
- FIGURE 20-2: Reset SYSTEM BLOCK DIAGRAM
- 20.3.1 POR: Power-ON reset
- FIGURE 20-3: Time-out Sequence on Power-up (MCLR Tied to Vdd)
- FIGURE 20-4: Time-out Sequence on Power-up (MCLR not Tied to Vdd): Case 1
- FIGURE 20-5: Time-out Sequence on Power-up (MCLR not Tied to Vdd): Case 2
- 20.3.1.1 POR with Long Crystal Start-up Time (with FSCM Enabled)
- 20.3.1.2 Operating without FSCM and PWRT
- 20.3.2 BOR: Programmable Brown-out reset
- 20.4 Watchdog Timer (WDT)
- 20.5 Low-Voltage Detect
- 20.6 Power Saving Modes
- 20.7 Device Configuration Registers
- 20.8 Peripheral Module Disable (PMD) Registers
- 20.9 In-Circuit Debugger
- 21.0 Instruction Set Summary
- 22.0 Development Support
- 22.1 MPLAB Integrated Development Environment Software
- 22.2 MPASM Assembler
- 22.3 MPLAB C18 and MPLAB C30 C Compilers
- 22.4 MPLINK Object Linker/ MPLIB Object Librarian
- 22.5 MPLAB ASM30 Assembler, Linker and Librarian
- 22.6 MPLAB SIM Software Simulator
- 22.7 MPLAB ICE 2000 High-Performance In-Circuit Emulator
- 22.8 MPLAB REAL ICE In-Circuit Emulator System
- 22.9 MPLAB ICD 2 In-Circuit Debugger
- 22.10 MPLAB PM3 Device Programmer
- 22.11 PICSTART Plus Development Programmer
- 22.12 PICkit 2 Development Programmer
- 22.13 Demonstration, Development and Evaluation Boards
- 23.0 Electrical Characteristics
- 23.1 DC Characteristics
- TABLE 23-1: Operating MIPS vs. Voltage
- TABLE 23-2: Thermal Operating Conditions
- TABLE 23-3: Thermal Packaging Characteristics
- TABLE 23-4: DC Temperature and Voltage specifications
- TABLE 23-5: DC Characteristics: Operating Current (Idd)
- TABLE 23-6: DC Characteristics: Idle Current (iidle)
- TABLE 23-7: DC Characteristics: Power-Down Current (Ipd)
- TABLE 23-8: DC Characteristics: I/O Pin Input Specifications
- TABLE 23-9: DC Characteristics: I/O Pin Output Specifications
- FIGURE 23-1: Low-Voltage Detect Characteristics
- TABLE 23-10: Electrical Characteristics: LVDL
- FIGURE 23-2: Brown-out Reset Characteristics
- TABLE 23-11: Electrical Characteristics: BOR
- TABLE 23-12: DC Characteristics: Program and EEPROM
- 23.2 AC Characteristics and Timing Parameters
- TABLE 23-13: Temperature and Voltage Specifications – AC
- FIGURE 23-3: Load Conditions for Device Timing Specifications
- FIGURE 23-4: External Clock Timing
- TABLE 23-14: External Clock Timing Requirements
- TABLE 23-15: PLL Clock Timing Specifications (Vdd = 2.5 to 5.5V)
- TABLE 23-16: PLL JITTER
- TABLE 23-17: Internal Clock Timing examples
- TABLE 23-18: AC Characteristics: Internal RC Accuracy(2)
- TABLE 23-19: Internal RC Accuracy
- FIGURE 23-5: CLKO and I/O Timing Characteristics
- TABLE 23-20: CLKO and I/O Timing Requirements
- FIGURE 23-6: Reset, Watchdog Timer, Oscillator Start-up Timer and Power-up Timer Timing Character...
- TABLE 23-21: Reset, Watchdog Timer, Oscillator Start-up Timer, Power-up Timer and Brown-out Reset...
- FIGURE 23-7: band gap Start-up Time Characteristics
- TABLE 23-22: band gap Start-up Time Requirements
- FIGURE 23-8: Type A, B and C Timer External Clock Timing Characteristics
- TABLE 23-23: TYPE A TIMER (Timer1) External Clock Timing Requirements(1)
- TABLE 23-24: TYPE B TIMER (Timer2 and Timer4) External Clock Timing Requirements(1)
- TABLE 23-25: TYPE C TIMER (Timer3 and Timer5) External Clock Timing Requirements(1)
- FIGURE 23-9: INPUT CAPTURE (CAPx) TIMING Characteristics
- TABLE 23-26: Input Capture timing requirements
- FIGURE 23-10: Output Compare Module (OCx) Timing Characteristics
- TABLE 23-27: Output Compare Module timing requirements
- FIGURE 23-11: OC/PWM Module Timing Characteristics
- TABLE 23-28: Simple OC/PWM MODE Timing Requirements
- FIGURE 23-12: DCI Module (Multichannel, I2S modes) Timing Characteristics
- TABLE 23-29: DCI Module (Multichannel, I2S modes) Timing Requirements
- FIGURE 23-13: DCI Module (AC-link mode) Timing Characteristics
- TABLE 23-30: DCI Module (AC-Link Mode) Timing Requirements
- FIGURE 23-14: SPI Module Master Mode (CKE = 0) Timing Characteristics
- TABLE 23-31: SPI Master mode (cke = 0) Timing requirements
- FIGURE 23-15: SPI Module Master Mode (CKE = 1) Timing Characteristics
- TABLE 23-32: SPI Module Master mode (cke = 1) Timing requirements
- FIGURE 23-16: SPI Module Slave Mode (CKE = 0) Timing Characteristics
- TABLE 23-33: SPI Module Slave mode (cke = 0) Timing requirements
- FIGURE 23-17: SPI Module Slave Mode (CKE = 1) Timing Characteristics
- TABLE 23-34: SPI Module Slave mode (cke = 1) Timing requirements
- FIGURE 23-18: I2C™ Bus Start/Stop Bits Timing Characteristics (Master mode)
- FIGURE 23-19: I2C™ Bus Data Timing Characteristics (Master mode)
- TABLE 23-35: I2C™ Bus Data Timing Requirements (Master Mode)
- FIGURE 23-20: I2C™ Bus Start/Stop Bits Timing Characteristics (slave mode)
- FIGURE 23-21: I2C™ Bus Data Timing Characteristics (slave mode)
- TABLE 23-36: I2C™ Bus Data Timing Requirements (Slave Mode)
- FIGURE 23-22: CAN Module I/O Timing Characteristics
- TABLE 23-37: CAN Module I/O Timing Requirements
- TABLE 23-38: 12-bit aDC Module Specifications
- FIGURE 23-23: 12-Bit A/D Conversion Timing Characteristics (asam = 0, ssrc = 000)
- TABLE 23-39: 12-BIT A/D Conversion TiminG rEQUIREMENTS
- 23.1 DC Characteristics
- 24.0 Packaging Information
- Appendix A: Revision History
- Index
- The Microchip Web Site
- Customer Change Notification Service
- Customer Support
- Reader Response
- Product Identification System
- Worldwide Sales and Service

© 2006 Microchip Technology Inc. DS70117F-page 125
dsPIC30F6011/6012/6013/6014
18.0 DATA CONVERTER
INTERFACE (DCI) MODULE
18.1 Module Introduction
The dsPIC30F Data Converter Interface (DCI) module
allows simple interfacing of devices, such as audio
coder/decoders (Codecs), A/D converters and D/A
converters. The following interfaces are supported:
• Framed Synchronous Serial Transfer (Single or
Multi-Channel)
• Inter-IC Sound (I
2
S) Interface
• AC-Link Compliant mode
The DCI module provides the following general
features:
• Programmable word size up to 16 bits
• Support for up to 16 time slots, for a maximum
frame size of 256 bits
• Data buffering for up to 4 samples without CPU
overhead
18.2 Module I/O Pins
There are four I/O pins associated with the module.
When enabled, the module controls the data direction
of each of the four pins.
18.2.1 CSCK PIN
The CSCK pin provides the serial clock for the DCI
module. The CSCK pin may be configured as an input
or output using the CSCKD control bit in the DCICON1
SFR. When configured as an output, the serial clock is
provided by the dsPIC30F. When configured as an
input, the serial clock must be provided by an external
device.
18.2.2 CSDO PIN
The serial data output (CSDO) pin is configured as an
output only pin when the module is enabled. The
CSDO pin drives the serial bus whenever data is to be
transmitted. The CSDO pin is tri-stated or driven to ‘0’
during CSCK periods when data is not transmitted,
depending on the state of the CSDOM control bit. This
allows other devices to place data on the serial bus
during transmission periods not used by the DCI
module.
18.2.3 CSDI PIN
The serial data input (CSDI) pin is configured as an
input only pin when the module is enabled.
18.2.3.1 COFS PIN
The Codec frame synchronization (COFS) pin is used
to synchronize data transfers that occur on the CSDO
and CSDI pins. The COFS pin may be configured as an
input or an output. The data direction for the COFS pin
is determined by the COFSD control bit in the
DCICON1 register.
The DCI module accesses the shadow registers while
the CPU is in the process of accessing the memory
mapped buffer registers.
18.2.4 BUFFER DATA ALIGNMENT
Data values are always stored left justified in the buff-
ers since most Codec data is represented as a signed
2’s complement fractional number. If the received word
length is less than 16 bits, the unused LSbs in the
receive buffer registers are set to ‘0’ by the module. If
the transmitted word length is less than 16 bits, the
unused LSbs in the transmit buffer register are ignored
by the module. The word length setup is described in
subsequent sections of this document.
18.2.5 TRANSMIT/RECEIVE SHIFT
REGISTER
The DCI module has a 16-bit shift register for shifting
serial data in and out of the module. Data is shifted in/
out of the shift register MSb first, since audio PCM data
is transmitted in signed 2’s complement format.
18.2.6 DCI BUFFER CONTROL
The DCI module contains a buffer control unit for trans-
ferring data between the shadow buffer memory and
the serial shift register. The buffer control unit is a sim-
ple 2-bit address counter that points to word locations
in the shadow buffer memory. For the receive memory
space (high address portion of DCI buffer memory), the
address counter is concatenated with a ‘0’ in the MSb
location to form a 3-bit address. For the transmit mem-
ory space (high portion of DCI buffer memory), the
address counter is concatenated with a ‘1’ in the MSb
location.
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the “dsPIC30F Family Reference
Manual” (DS70046).
Note: The DCI buffer control unit always
accesses the same relative location in the
transmit and receive buffers, so only one
address counter is provided.