Datasheet

dsPIC30F6010A/6015
DS70150E-page 178 © 2011 Microchip Technology Inc.
24 .1 DC C haract eri stics
TABLE 24-1: OPERATING MIPS VS. VOLTAGE FOR dsPIC30F6010A
VDD Range
(in Volts)
Temp Range
(in °C)
Max MIPS
dsPIC30F6010A-30I dsPIC30F6010A-20E
4.5-5.5 -40 to +85 30 —
4.5-5.5 -40 to +125 — 20
3.0-3.6 -40 to +85 20 —
3.0-3.6 -40 to +125 — 15
2.5-3.0 -40 to +85 10 —
TABLE 24-2: OPERATING MIPS VS. VOLTAGE FOR dsPIC30F6015
VDD Range
(in Volts)
Temp Range
(in °C)
Max MIPS
dsPIC30F6015-30I dsPIC30F6015-20E
4.5-5.5 -40 to +85 30 —
4.5-5.5 -40 to +125 — 20
3.0-3.6 -40 to +85 20 —
3.0-3.6 -40 to +125 — 15
2.5-3.0 -40 to +85 10 —
TABLE 24-3: THERMAL OPERATING CONDITIONS
Rating Symbol Min Typ Max Unit
dsPIC30F6010A-30I/dsPIC30F6015-30I
Operating Junction Temperature Range T
J -40 — +125 °C
Operating Ambient Temperature Range T
A -40 — +85 °C
dsPIC30F6010A-20E/dsPIC30F6015-20E
Operating Junction Temperature Range T
J -40 — +150 °C
Operating Ambient Temperature Range T
A -40 — +125 °C
Power Dissipation:
Internal chip power dissipation:
P
D PINT + PI/O W
I/O Pin Power Dissipation:
Maximum Allowed Power Dissipation P
DMAX (TJ – TA)/θJA W
P
INT
V
DD
I
DD
I
OH
∑
–
⎝⎠
⎛⎞
×=
P
I/O
V
DD
V
OH
–
{}
I
OH
×()
∑
V
OL
I
OL
×
()
∑
+=
TABLE 24-4: THERMAL PACKAGING CHARACTERISTICS
Characteristic Symbol Typ Max Unit Notes
Package Thermal Resistance, 80-pin TQFP (14x14x1mm)
θJA 36 — °C/W 1
Package Thermal Resistance, 80-pin TQFP (12x12x1mm)
θJA 39 — °C/W 1
Package Thermal Resistance, 64-pin TQFP (10x10x1mm)
θJA 39 — °C/W 1
Note 1: Junction to ambient thermal resistance, Theta-ja (
θJA) numbers are achieved by package simulations.