Datasheet

© 2011 Microchip Technology Inc. DS70116J-page 165
dsPIC30F5011/5013
TABLE 23-4: DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
DC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Param
No.
Symbol Characteristic Min Typ
(1)
Max Units Conditions
Operating Voltage
(2)
DC10 VDD Supply Voltage 2.5 — 5.5 V Industrial temperature
DC11 V
DD Supply Voltage 3.0 — 5.5 V Extended temperature
DC12 V
DR RAM Data Retention Voltage
(3)
1.75 — — V
DC16 V
POR VDD Start Voltage
to ensure internal
Power-on Reset signal
—VSS —V
DC17 SVDD VDD Rise Rate
to ensure internal
Power-on Reset signal
0.05 — — V/ms 0-5V in 0.1 sec
0-3V in 60 ms
Note 1: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
2: These parameters are characterized but not tested in manufacturing.
3: This is the limit to which V
DD can be lowered without losing RAM data.
TABLE 23-5: DC CHARACTERISTICS: OPERATING CURRENT (IDD)
DC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Parameter
No.
Typical
(1)
Max Units Conditions
Operating Current (I
DD)
(2)
DC30a 7.3 11 mA 25°C
3.3V
FRC (~2 MIPS)
DC30b 7.5 11.2 mA 85°C
DC30c 7.6 11.4 mA 125°C
DC30e 12.9 19.2 mA 25°C
5VDC30f 12.8 19.1 mA 85°C
DC30g 12.8 19.1 mA 125°C
DC31a 1.9 2.8 mA 25°C
3.3V
LPRC (~512 kHz)
DC31b 2.0 3 mA 85°C
DC31c 2.0 3 mA 125°C
DC31e 4.1 6.1 mA 25°C
5VDC31f 4.0 6 mA 85°C
DC31g 3.8 5.7 mA 125°C
Note 1: Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O
pin loading and switching rate, oscillator type, internal code execution pattern and temperature also have
an impact on the current consumption. The test conditions for all I
DD measurements are as follows: OSC1
driven with external square wave from rail to rail. All I/O pins are configured as Inputs and pulled to V
DD.
MCLR
= VDD, WDT, FSCM, LVD and BOR are disabled. CPU, SRAM, Program Memory and Data Memory
are operational. No peripheral modules are operating.