Datasheet

dsPIC30F5011/5013
DS70116J-page 164 © 2011 Microchip Technology Inc.
23.1 DC Characteristics
TABLE 23-1: OPERATING MIPS VS. VOLTAGE
VDD Range Temp Range
Max MIPS
dsPIC30F501X-30I dsPIC30F501X-20I dsPIC30F501X-20E
4.75-5.5V -40°C to 85°C 30 20 —
4.75-5.5V -40°C to 125°C — — 20
3.0-3.6V -40°C to 85°C 15 10 —
3.0-3.6V -40°C to 125°C — — 10
2.5-3.0V -40°C to 85°C 7.5 7.5 —
TABLE 23-2: THERMAL OPERATING CONDITIONS
Rating Symbol Min Typ Max Unit
dsPIC30F501x-30I
Operating Junction Temperature Range T
J
-40 — +125 °C
Operating Ambient Temperature Range T
A
-40 — +85 °C
dsPIC30F501x-20I
Operating Junction Temperature Range T
J
-40 — +150 °C
Operating Ambient Temperature Range T
A
-40 — +85 °C
dsPIC30F501x-20E
Operating Junction Temperature Range T
J
-40 — +150 °C
Operating Ambient Temperature Range T
A
-40 — +125 °C
Power Dissipation:
Internal chip power dissipation:
P
D
P
INT
+ P
I/O
W
I/O Pin power dissipation:
Maximum Allowed Power Dissipation P
DMAX (T
J
- T
A
) / θ
JA
W
TABLE 23-3: THERMAL PACKAGING CHARACTERISTICS
Characteristic Symbol Typ Max Unit Notes
Package Thermal Resistance, 64-pin TQFP (10x10x1mm)
θ
JA
39 — °C/W 1
Package Thermal Resistance, 80-pin TQFP (12x12x1mm)
θ
JA
39 — °C/W 1
Note 1: Junction to ambient thermal resistance, Theta-ja (
θ
JA
) numbers are achieved by package simulations.
P
INT
V
DD
I
DD
I
OH
∑
–
⎝⎠
⎛⎞
×=
P
I/O
V
DD
V
OH
–{}I
OH
×()
∑
V
OL
I
OL
×()
∑
+=