Datasheet

dsPIC30F3014/4013
DS70138G-page 172  2010 Microchip Technology Inc.
23.1 DC Characteristics
TABLE 23-1: OPERATING MIPS vs. VOLTAGE
VDD Range Temp Range
Max MIPS
dsPIC30FXXX-30I dsPIC30FXXX-20E
4.5-5.5V -40°C to 85°C 30 —
4.5-5.5V -40°C to 125°C — 20
3.0-3.6V -40°C to 85°C 15 —
3.0-3.6V -40°C to 125°C — 10
2.5-3.0V -40°C to 85°C 10 —
TABLE 23-2: THERMAL OPERATING CONDITIONS
Rating Symbol Min Typ Max Unit
dsPIC30F3014-30I
dsPIC30F4013-30I
Operating Junction Temperature Range T
J
-40 — +125 °C
Operating Ambient Temperature Range T
A
-40 — +85 °C
dsPIC30F3014-20E
dsPIC30F4013-20E
Operating Junction Temperature Range T
J
-40 — +150 °C
Operating Ambient Temperature Range T
A
-40 — +125 °C
Power Dissipation:
Internal chip power dissipation:
P
D PINT + PI/O W
I/O Pin power dissipation:
Maximum Allowed Power Dissipation P
DMAX (TJ – TA)/JA W
P
INT
V
DD
I
DD
I
OH

–=
P
I/O
VDD VOH–

IOH


V
OL
I
OL



+=
TABLE 23-3: THERMAL PACKAGING CHARACTERISTICS
Characteristic Symbol Typ Max Unit Notes
Package Thermal Resistance, 40-pin DIP (P) 
JA —47°C/W1
Package Thermal Resistance, 44-pin TQFP (10x10x1mm) JA —39.3°C/W1
Package Thermal Resistance, 44-pin QFN 
JA —27.8°C/W1
Note 1: Junction to ambient thermal resistance, Theta-ja (
JA) numbers are achieved by package simulations.