Datasheet

dsPIC30F4011/4012
DS70135G-page 178 © 2010 Microchip Technology Inc.
24.1 DC Characteristics
TABLE 24-1: OPERATING MIPS VS. VOLTAGE
VDD Range Temp Range
Max MIPS
dsPIC30F401X-30I dsPIC30F401X-20E
4.5-5.5V -40°C to +85°C 30 —
4.5-5.5V -40°C to +125°C — 20
3.0-3.6V -40°C to +85°C 20 —
3.0-3.6V -40°C to +125°C — 15
2.5-3.0V -40°C to +85°C 10 —
TABLE 24-2: THERMAL OPERATING CONDITIONS
Rating Symbol Min Typ Max Unit
dsPIC30F401X-30I
Operating Junction Temperature Range T
J -40 — +125 °C
Operating Ambient Temperature Range T
A -40 — +85 °C
dsPIC30F401X-20E
Operating Junction Temperature Range T
J -40 — +150 °C
Operating Ambient Temperature Range T
A -40 — +125 °C
Power Dissipation:
Internal Chip Power Dissipation:
PINT = VDD X (IDD – ∑ IOH)
P
D PINT + PI/O W
I/O Pin power dissipation:
P
I/O = ∑ ({VDD – VOH} X IOH) + ∑ (VOL X IOL)
Maximum Allowed Power Dissipation P
DMAX (TJ – TA)/θJA W
TABLE 24-3: THERMAL PACKAGING CHARACTERISTICS
Characteristic Symbol Typ Max Unit Notes
Package Thermal Resistance, 28-pin SPDIP (SP) θ
JA 41 — °C/W 1
Package Thermal Resistance, 28-pin SOIC (SO) θ
JA 45 — °C/W 1
Package Thermal Resistance, 40-pin PDIP (P) θ
JA 37 — °C/W 1
Package Thermal Resistance, 44-pin TQFP, 10x10x1 mm (PT) θ
JA 40 — °C/W 1
Package Thermal Resistance, 44-pin QFN (ML) θ
JA 28 — °C/W 1
Note 1: Junction to ambient thermal resistance, Theta-ja (θ
JA) numbers are achieved by package simulations.