Datasheet

© 2010 Microchip Technology Inc. DS70141F-page 227
dsPIC30F3010/3011
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
dsPIC30F3010AT-30I/PF-000
Example:
dsPIC30F3010AT-30I/PT = 30 MIPS, Industrial temp., TQFP package, Rev. A
Trademark
Architecture
Flash
E = Extended High Temp -40°C to +125°C
I = Industrial -40°C to +85°C
Temperature
Device ID
Memory Size in Bytes
0 = ROMless
1 = 1K to 6K
2 = 7K to 12K
3 = 13K to 24K
4 = 25K to 48K
5 = 49K to 96K
6 = 97K to 192K
7 = 193K to 384K
8 = 385K to 768K
9 = 769K and Up
Custom ID (3 digits) or
T = Tape and Reel
A,B,C… = Revision Level
Engineering Sample (ES)
Speed
20 = 20 MIPS
30 = 30 MIPS
Package
PT = TQFP 10x10
PT = TQFP 12x12
P=DIP
SO = SOIC
SP = SPDIP
ML = QFN (8x8)
S = Die (Waffle Pack)
W = Die (Wafers)