Datasheet

dsPIC30F3010/3011
DS70141F-page 170 © 2010 Microchip Technology Inc.
23.1 DC Characteristics
TABLE 23-1: OPERATING MIPS VS. VOLTAGE
VDD Range Temp Range
Max MIPS
dsPIC30F301X-30I dsPIC30F301X-20E
4.5-5.5V -40°C to 85°C 30 —
4.5-5.5V -40°C to 125°C — 20
3.0-3.6V -40°C to 85°C 20 —
3.0-3.6V -40°C to 125°C — 15
2.5-3.0V -40°C to 85°C 10 —
TABLE 23-2: THERMAL OPERATING CONDITIONS
Rating Symbol Min Typ Max Unit
dsPIC30F301X-30I
Operating Junction Temperature Range T
J -40 — +125 °C
Operating Ambient Temperature Range T
A -40 — +85 °C
dsPIC30F301X-20E
Operating Junction Temperature Range T
J -40 — +150 °C
Operating Ambient Temperature Range T
A -40 — +125 °C
Power Dissipation:
Internal chip power dissipation:
P
D PINT + PI/O W
I/O Pin power dissipation:
Maximum Allowed Power Dissipation P
DMAX (TJ – TA)/θJA W
P
INT
V
DD
I
DD
I
OH
∑
–()×=
P
I/O
V
DD
V
OH
–
{}
I
OH
×()
∑
V
OL
I
OL
×
()
∑
+=
TABLE 23-3: THERMAL PACKAGING CHARACTERISTICS
Characteristic Symbol Typ Max Unit Notes
Package Thermal Resistance, 28-pin SPDIP (SP) θJA 42 — °C/W 1
Package Thermal Resistance, 28-pin SOIC (SO) θ
JA 49 — °C/W 1
Package Thermal Resistance, 40-pin PDIP (P) θ
JA 37 — °C/W 1
Package Thermal Resistance, 44-pin TQFP (PT, 10x10x1 mm) θ
JA 45 — °C/W 1
Package Thermal Resistance, 44-pin QFN (ML) θ
JA 28 — °C/W 1
Note 1: Junction to ambient thermal resistance, Theta-ja (θ
JA) numbers are achieved by package simulations.