Datasheet

© 2010 Microchip Technology Inc. DS70141F-page 209
dsPIC30F3010/3011
24.0 PACKAGING INFORMATION
24.1 Package Marking Information
28-Lead PDIP (Skinny DIP)
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
YYWWNNN
Example
dsPIC30F3010
0810017
28-Lead SOIC
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
YYWWNNN
Example
dsPIC30F3010
0810017
XXXXXXXXXX
44-Lead QFN
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
dsPIC
Example
0810017
30I/ML
Example
dsPIC30F3011
0810017
40-Lead PDIP
XXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXX
YYWWNNN
30I/SP
3
e
3
e
3
e
3
e
30I/SO
30F3011
30I/P
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
* This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
44-Lead TQFP
XXXXXXXXXX
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
Example
dsPIC
0810017
30I/PT
30F3011
3
e