Datasheet

dsPIC30F1010/202X

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

dsPIC30F2020AT-30 I/ SO-ES

Example:

dsPIC30F2020AT-30I/SO = 30 MIPS, Industrial temp., SOIC package, Rev. A

Trademark

Architecture

Flash

E = Extended High Temp -40°C to +125°C

I = Industrial -40°C to +85°C

Temperature

Device ID

Package

MM = QFN

PT = TQFP

SP = SPDIP

SO = SOIC

S = Die (Waffle Pack)

W = Die (Wafers)

Memory Size in Bytes

0 = ROMless

1 = 1K to 6K

2 = 7K to 12K

3 = 13K to 24K

4 = 25K to 48K

5 = 49K to 96K

6 = 97K to 192K

7 = 193K to 384K

8 = 385K to 768K

9 = 769K and Up

Custom ID (3 digits) or

T = Tape and Reel

A,B,C… = Revision Level

Engineering Sample (ES)

Speed

20 = 20 MIPS