Datasheet

dsPIC30F1010/202X
DS70178C-page 268 Preliminary © 2006 Microchip Technology Inc.
28-Lead Plastic Quad Flat, No Lead Package (MM) - 6x6x0.9 mm Body (QFN-S)
With 0.40 mm Contact Length
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
BOTTOM VIEW
TOP VIEW
N
2
1
2
1
E
E2
EXPOSED
PAD
D2
e
b
K
N
D
A
A1
L
A3
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length §
Contact-to-Exposed Pad §
Units
Dimension Limits
N
e
A
A1
A3
E
E2
D
D2
b
L
K
0.80
0.00
3.65
3.65
0.23
0.30
0.20
28
0.65 BSC
0.90
0.02
0.20 REF
6.00 BSC
3.70
6.00 BSC
3.70
0.38
0.40
—
1.00
0.05
4.70
4.70
0.43
0.50
—
MIN
NOM MAX
MILLIMETERS
Notes:
1. Pin 1 visual index feature may vary, but must be
located within the hatched area.
2. § Significant Characteristic
3. Package is saw singulated
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing No. C04–124, Sept. 8, 2006