Datasheet

dsPIC30F2011/2012/3012/3013
DS70139G-page 150 © 2010 Microchip Technology Inc.
20.1 DC Characteristics
TABLE 20-1: OPERATING MIPS VS. VOLTAGE
VDD Range Temp Range
Max MIPS
dsPIC30FXXX-30I dsPIC30FXXX-20E
4.5-5.5V -40°C to 85°C 30 —
4.5-5.5V -40°C to 125°C — 20
3.0-3.6V -40°C to 85°C 20 —
3.0-3.6V -40°C to 125°C — 15
2.5-3.0V -40°C to 85°C 10 —
TABLE 20-2: THERMAL OPERATING CONDITIONS
Rating Symbol Min Typ Max Unit
dsPIC30F201x-30I
dsPIC30F301x-30I
Operating Junction Temperature Range T
J -40 — +125 °C
Operating Ambient Temperature Range T
A -40 — +85 °C
dsPIC30F201x-20E
dsPIC30F301x-20E
Operating Junction Temperature Range TJ -40 — +150 °C
Operating Ambient Temperature Range T
A -40 — +125 °C
Power Dissipation:
Internal chip power dissipation:
P
D PINT + PI/O W
I/O Pin power dissipation:
Maximum Allowed Power Dissipation P
DMAX (TJ - TA) / θJA W
P
INT
V
DD
I
DD
I
OH
∑
–()×=
P
I/O
V
DD
V
OH
–
{}
I
OH
×()
∑
V
OL
I
OL
×
()
∑
+=
TABLE 20-3: THERMAL PACKAGING CHARACTERISTICS
Characteristic Symbol Typ Max Unit Notes
Package Thermal Resistance, 18-pin PDIP (P) θ
JA 44 — °C/W 1
Package Thermal Resistance, 18-pin SOIC (SO) θ
JA 57 — °C/W 1
Package Thermal Resistance, 28-pin SPDIP (SP) θ
JA 42 — °C/W 1
Package Thermal Resistance, 28-pin (SOIC) θJA 49 — °C/W 1
Package Thermal Resistance, 44-pin QFN θ
JA 28 — °C/W 1
Note 1: Junction to ambient thermal resistance, Theta-ja (θ
JA) numbers are achieved by package simulations.