Datasheet

dsPIC30F2010
DS70118J-page 148 © 2011 Microchip Technology Inc.
22.1 DC Characteristics
TABLE 22-1: OPERATING MIPS VS. VOLTAGE
VDD Range Temp Range
Max MIPS
dsPIC30F2010-30I dsPIC30F2010-20E
4.5-5.5V -40°C to 85°C 30 —
4.5-5.5V -40°C to 125°C — 20
3.0-3.6V -40°C to 85°C 20 —
3.0-3.6V -40°C to 125°C — 15
2.5-3.0V -40°C to 85°C 10 —
TABLE 22-2: THERMAL OPERATING CONDITIONS
Rating Symbol Min Typ Max Unit
dsPIC30F2010-30I
Operating Junction Temperature Range T
J -40 — +125 °C
Operating Ambient Temperature Range T
A -40 — +85 °C
dsPIC30F2010-20E
Operating Junction Temperature Range T
J -40 — +150 °C
Operating Ambient Temperature Range T
A -40 — +125 °C
Power Dissipation:
Internal chip power dissipation:
PD PINT + PI/O W
I/O Pin power dissipation:
Maximum Allowed Power Dissipation P
DMAX (TJ - TA)/θJA W
TABLE 22-3: THERMAL PACKAGING CHARACTERISTICS
Characteristic Symbol Typ Max Unit Notes
Package Thermal Resistance, 28-pin SOIC (SO) θJA 48.3 — °C/W 1
Package Thermal Resistance, 28-pin QFN
θJA 33.7 — °C/W 1
Package Thermal Resistance, 28-pin SPDIP (SP)
θJA 42 — °C/W 1
Note 1: Junction to ambient thermal resistance, Theta-ja (
θJA) numbers are achieved by package simulations.
P
INT
V
DD
I
DD
I
OH
∑
–
⎝⎠
⎛⎞
×=
P
I/O
V
DD
V
OH
–
{}
I
OH
×()
∑
V
OL
I
OL
×
()
∑
+=