Datasheet

PIC24FJ128GC010 FAMILY
DS30009312B-page 426  2012-2013 Microchip Technology Inc.
37.1 DC Characteristics
FIGURE 37-1: PIC24FJ128GC010 FAMILY VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL)
TABLE 37-1: THERMAL OPERATING CONDITIONS
Rating Symbol Min Typ Max Unit
PIC24FJ128GC010 Family:
Operating Junction Temperature Range TJ -40 — +100 °C
Operating Ambient Temperature Range TA -40 — +85 °C
Power Dissipation:
Internal Chip Power Dissipation: P
INT = VDD x (IDD –  IOH)
P
D PINT + PI/O W
I/O Pin Power Dissipation:
PI/O =  ({VDD – VOH} x IOH) +  (VOL x IOL)
Maximum Allowed Power Dissipation P
DMAX (TJMAX – TA)/JA W
Frequency
Voltage (VDD)
(Note 1)
32 MHz
3.6V
3.6V
(Note 1)
Note 1: Lower recommended operating boundary is 2.0V or V
BOR (when BOR is enabled). For best
analog performance, operation above 2.2V is suggested, but not required.
PIC24FJXXXGC0XX
TABLE 37-2: THERMAL PACKAGING CHARACTERISTICS
Characteristic Symbol Typ Max Unit Note
Package Thermal Resistance, 12x12x1 mm 100-pin TQFP JA 45.0 — °C/W (Note 1)
Package Thermal Resistance, 10x10x1 mm 64-pin TQFP 
JA 48.3 — °C/W (Note 1)
Package Thermal Resistance, 9x9x0.9 mm 64-pin QFN 
JA 28.0 — °C/W (Note 1)
Package Thermal Resistance, 10x10x1.1 mm 121-pin BGA 
JA 40.2 — °C/W (Note 1)
Note 1: Junction to ambient thermal resistance, Theta-
JA (JA) numbers are achieved by package simulations.