Datasheet

PIC24F16KL402 FAMILY
DS31037B-page 200  2011 Microchip Technology Inc.
26.1 DC Characteristics
FIGURE 26-1: PIC24F16KL402 FAMILY VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL)
TABLE 26-1: THERMAL OPERATING CONDITIONS
Rating Symbol Min Typ Max Unit
Operating Junction Temperature Range T
J -40 — +125 °C
Operating Ambient Temperature Range TA -40 — +85 °C
Power Dissipation:
Internal Chip Power Dissipation:
P
INT = VDD x (IDD –  IOH)
PD PINT + PI/O W
I/O Pin Power Dissipation:
P
I/O =  ({VDD – VOH} x IOH) +  (VOL x IOL)
Maximum Allowed Power Dissipation P
DMAX (TJ – TA)/JA W
Frequency
Voltage (VDD)
1.80V
32 MHz
3.60V
3.00V
3.60V
8 MHz
3.00V
Note: For frequencies between 8 MHz and 32 MHz, FMAX = 20 MHz * (VDD – 1.8) + 8 MHz.
TABLE 26-2: THERMAL PACKAGING CHARACTERISTICS
Characteristic Symbol Typ Max Unit Notes
Package Thermal Resistance, 20-Pin SPDIP 
JA 62.4 — °C/W 1
Package Thermal Resistance, 28-Pin SPDIP JA 60 — °C/W 1
Package Thermal Resistance, 20-Pin SSOP 
JA 108 — °C/W 1
Package Thermal Resistance, 28-Pin SSOP JA 71 — °C/W 1
Package Thermal Resistance, 20-Pin SOIC JA 75 — °C/W 1
Package Thermal Resistance, 28-Pin SOIC 
JA 80.2 — °C/W 1
Package Thermal Resistance, 20-Pin QFN 
JA 43 — °C/W 1
Package Thermal Resistance, 28-Pin QFN 
JA 32 — °C/W 1
Package Thermal Resistance, 14-Pin SPDIP 
JA
62.4
—°C/W 1
Package Thermal Resistance, 14-Pin TSSOP 
JA 108 — °C/W 1
Note 1: Junction to ambient thermal resistance, Theta-
JA (JA) numbers are achieved by package simulations.