Datasheet

LCD MODULE TSB1G7000-E Version :1.0 July 29, 2008
TRULY SEMICONDUCTORS LTD.
P.9
n RELIABILITY TEST
No.
Test Item Test Condition Inspection after test
1 High Temperature Storage 70±2/200 hours
2 Low Temperature Storage -30±2/200 hours
3 High Temperature Operating 60±2/200 hours
4 Low Temperature Operating -10±2/200 hours
5 Temperature Cycle
-10±2~25~60±2×10cycles
(30min.) (5min.) (30min.)
6 Damp Proof Test
50℃±5℃×90%RH/120 hours
7 Vibration Test
Frequency10Hz~55Hz~10Hz
Amplitude1.5mm,
XYZ direction for total 3hours
(Packing condition)
8
Dropping test
Drop to the ground from 1m height, one
time, every side of carton.
(Packing condition)
9
ESD test
Voltage:±4KV R: 330Ω C: 150pF
Air discharge, 5time
Inspection after 2~4hours
storage at room
temperature, the sample
shall be free from defects:
1.Air bubble in the LCD;
2.Sealleak;
3.Non-display;
4.missing segments;
5.Glass crack;
6.Current Idd is twice
higher than initial value.
Remark:
1.The test samples should be applied to only one test item.
2.Sample size for each test item is 5~10pcs.
3.For Damp Proof Test, Pure water(Resistance10MΩ) should be used.
4.In case of malfunction defect caused by ESD damage, if it would be recovered to normal state after resetting, it
would be judge as a good part.
Using ionizer(an antistatic blower) is recommended at working area in order to reduce electro-static voltage.
When removing protection film from LCM panel, peel off the tag slowly( recommended more than one second)
while blowing with ionizer toward the peeling face to minimize ESD which may damage electrical circuit.
5.EL evaluation should be excepted from reliability test with humidity and temperature: Some defects such as
black spot/blemish can happen by natural chemical reaction with humidity and Fluorescence EL has.
6.Please use automatic switch menu(or roll menu) testing mode when test operating mode.