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Explorer 16/32 Development Board

A Perfect Platform for Discovering the Full Capabilities of

PIC® MCUs and dsPIC® DSCs

Summary

The Explorer 16/32 Development Board is a flexible

development system for Microchip’s 16-bit and 32-bit

PIC® microcontrollers. It is a refreshed and cost-effective

version of Explorer 16 Development Board (DM240001)

with several new features. This board supports devices

from the PIC24 and PIC32 MCU families and dsPIC® DSC

families as Processor Plug-In Modules (PIMs), allowing you

to develop various applications quickly.

The Explorer 16/32 Development Board provides a perfect

platform to prototype applications using several function

expansion capabilities through its wide ecosystem support.

The board can be a starting point for all your embedded

projects by developing a rapid proof of concept before

migrating to actual design.

Key Features

■ 100-pin plug-in module socket

■ Integrated PICkit™-On-Board (PKOB)

Programmer/Debugger

■ MPLAB® ICD3 and MPLAB REAL ICE™ In-Circuit

Debugger/Programmer support for advanced operations

■ Multiple power options

• USB power for convenience

• 9–15V DC supply for higher power requirement

■ Communication

• USB host/device support

• Serial (UART/I

C) communication via on-board

USB-serial bridge

■ Wide ecosystem with mikroBUS™, PICtail™ Plus and

Pmod™ interfaces

■ Alphanumeric LCD, push buttons, LEDs, potentiometer,

temperature sensor, debug connectors and more

16-bit PIC24

MCUs and

dsPIC DSCs

Larger

Ecosystem

32-bit

PIC32 MCUs

Backwards

Compatible

Enhanced

Features

What’s New in the Explorer 16/32 Development Board

Classic Explorer 16

Development Board

New Explorer 16/32

Development Board

Device Families Supported Via PIMs PIC24, dsPIC® DSC, PIC32 PIC24, dsPIC DSC, PIC32

9–15V DC Power Supply Support

ü ü

PICkit™ 3, MPLAB® ICD3 and MPLAB REAL ICE™ In-Circuit

Programmer/Debugger Support

ü ü

LCD, User LEDs, Push Buttons, Potentiometer, Temperature Sensor

ü ü

PICtail™ Plus Daughter Cards

ü (Using optional PICtail

Plus Expansion Board)

USB Power Support –

Integrated PICkit™-On-Board Programmer/Debugger –

On-Board USB for Application –

On-Board USB to Serial Communication Bridge –

Current Measurement Capability –

mikroBUS™ Interface and Pmod™ Footprint –

Backwards Compatibility

The new Explorer 16/32 Development Board is backwards

compatible with the classic Explorer 16 Development Board

in using existing codes, libraries, prototypes, PIMs and

all the PICtail Plus daughter cards interfaced via the side

PICtail Plus connector. Reuse the PICtail Plus daughter

cards interfaced via the vertical PICtail Plus connector by

using an additional PICtail Plus Expansion Board.

Flexible Convenient

Ready to Start

Summary of content (56 pages)

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Explorer 16/32 Development Board A Perfect Platform for Discovering the Full Capabilities of PIC® MCUs and dsPIC® DSCs Summary The Explorer 16/32 Development Board is a flexible development system for Microchip’s 16-bit and 32-bit PIC® microcontrollers. It is a refreshed and cost-effective version of Explorer 16 Development Board (DM240001) with several new features.
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Wide Ecosystem for All Your Application Needs The Explorer 16/32 Development Board provides a complete platform for all you embedded design. Designed to expand its capabilities as your needs grow, it can be operated as an all-in-one development platform or it can be customized to suit your specific needs. This can be achieved with the board’s wide ecosystem support that offer a variety of options for function expansion.
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LCD MODULE TSB1G7000-E PRODUCT : LCD MODULE MODEL NO. : TSB1G7000-E SUPPLIER : TRULY SEMICONDUCTORS LTD. DATE : July 29, 2008 Version :1.0 July 29, 2008 abcdef abcdef CERT. No. QAC0946535 CERT. No. HKG002005 (ISO9001) (ISO14001) SPECIFICATION Revision: 1.0 TSB1G7000-E This module uses ROHS material If there is no special request from customer, TRULY SEMICONDUCTORS Co., Ltd will not reserve the tooling of the product under the following conditions: 1.
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LCD MODULE TSB1G7000-E Version :1.0 July 29, 2008 REVISION RECORD REV NO. REV DATE CONTENTS 1.0 2008-7-29 First Release TRULY SEMICONDUCTORS LTD. REMARKS P.
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TSB1G7000-E LCD MODULE Version :1.
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TSB1G7000-E LCD MODULE Version :1.0 July 29, 2008 n GENERAL INFORMATION Item Contents LCD type Viewing direction Glass area (W ´ H) Viewing area (W´H) Dot size (W ´ H) Dot pitch (W ´ H) Driver IC Interface Type Input voltage Unit FSTN 6:00 66.0 ´ 27.7 61.0 ´ 15.7 0.55 ´ 0.60 0.60 ´ 0.65 NT7603 Parallel 3.3 / O’ Clock mm2 mm2 mm2 mm2 / / V n EXTERNAL DIMENSIONS 1 2.00 4 -R 5.65 0.30 1. 00 0.70±0.07 PITCH 3.45X16-0.50=54.70 61.00(V.A.) 1.
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SEG48 SEG49 SEG50 SEG51 SEG52 SEG53 SEG54 SEG55 SEG56 SEG57 SEG58 SEG59 SEG60 SEG61 SEG62 SEG63 SEG64 SEG65 SEG66 SEG67 SEG68 SEG69 SEG70 SEG71 SEG72 SEG73 SEG29 SEG30 SEG31 SEG32 SEG33 SEG34 SEG35 SEG36 SEG37 SEG38 SEG39 SEG40 SEG41 SEG42 SEG43 SEG44 SEG45 SEG46 SEG47 84 PAD SIZ E:42X9 0 CH IP SI ZE:12 20X50 10 Y :u M UNIT SEG8 SE G9 SEG10 SEG11 SEG12 SEG13 SEG14 SEG15 SEG16 SEG17 SEG18 SEG19 SEG20 SEG21 SEG22 SEG23 SEG24 SEG25 SEG26 SEG27 SEG28 150 19 4 8 3 ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~
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TSB1G7000-E LCD MODULE Version :1.0 July 29, 2008 nABSOLUTE MAXIMUM RATINGS Parameter Supply voltage for logic Input voltage Operating temperature Storage temperature Symbol VDD VIN TOP TST Humidity Min -0.3 -0.3 -10 -30 RH Max 7.0 VDD + 0.
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LCD MODULE TSB1G7000-E Version :1.0 July 29, 2008 nELECTRO-OPTICAL CHARACTERISTICS Item Symbol Condition Min Typ Max --762.3 Response time Tr+ Tf 508.2 θ=30° Contrast ratio Cr 5.35 10.7 --Ta=25℃ R% Reflectance --19.4 --Note 1. Contrast Ratio(CR) is defined mathematically : Contrast Ratio = LMAX LO Where LMAX :Luminace of maximal gray level LO : Luminace of gray level 0 Unit Remark Note ms --% FIG4. 2 1 4 FIG4. Note 2.
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LCD MODULE TSB1G7000-E Version :1.0 July 29, 2008 n INTERFACE DESCRIPTION Pin No. 1 2 3 4 Symbol VSS NC VDD RS Level 0V --+3.
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LCD MODULE TSB1G7000-E Version :1.0 July 29, 2008 n RELIABILITY TEST No. 1 2 3 4 Test Item High Temperature Storage Low Temperature Storage High Temperature Operating Low Temperature Operating 5 Temperature Cycle 6 Damp Proof Test 7 Vibration Test 8 Dropping test 9 ESD test Test Condition Inspection after test 70±2℃/200 hours -30±2℃/200 hours 60±2℃/200 hours -10±2℃/200 hours -10±2℃~25~60±2℃×10cycles (30min.) (5min.) (30min.) 50℃±5℃×90%RH/120 hours Frequency：10Hz~55Hz~10Hz Amplitude：1.
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LCD MODULE TSB1G7000-E Version :1.0 July 29, 2008 n INSPECTION CRITERION TRULY ® PAGE 1 OF OUTGOING QUALITY STANDARD TITLE:FUNCTIONAL TEST & INSPECTION CRITERIA 7 Mono COG Product This specification is made to be used as the standard acceptance/rejection criteria for Mono COG Product. 1 sample plan Sampling plan according to GB/T2828.1-2003/ISO 2859-1 ： 1999 and ANSI/ASQC Z1.4-1993, normal level 2 and based on: Major defect: AQL 0.65 Minor defect: AQL 1.5 2.
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LCD MODULE TRULY ® TSB1G7000-E Version :1.0 PAGE 2 OF OUTGOING QUALITY STANDARD TITLE:FUNCTIONAL TEST & INSPECTION CRITERIA July 29, 2008 7 Mono COG Product 4. Major Defect All functional defects such as open(or missing segment ), short and serious cosmetic defects Are classified as major defects. 5. Minor Defect Except the Major defects above, cosmetic defects such as spot, glass defect are classified as minor defects. Item No Items to be inspected 5.
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TSB1G7000-E LCD MODULE TRULY ® Version :1.0 PAGE 3 OF OUTGOING QUALITY STANDARD TITLE:FUNCTIONAL TEST & INSPECTION CRITERIA July 29, 2008 7 Mono COG Product 5. Cosmetic Defect Item No Items to be inspected 5.2 Line defect (Defects in line form) Classification of defects Inspection Standard Minor Size(mm) Acceptable Qty Zone L(Length) W(Width) L≤10.0 W≤0.01 Acceptable L≤3.0 W≤0.03 2 L＞3.0 W≤0.03 0 L≤2.5 0.03＜W≤0.05 2 L＞2.5 0.03＜W≤0.05 0 W＞0.
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TSB1G7000-E LCD MODULE TRULY ® Version :1.0 PAGE 4 OF OUTGOING QUALITY STANDARD TITLE:FUNCTIONAL TEST & INSPECTION CRITERIA July 29, 2008 7 Mono COG Product 5. Cosmetic Defect Item No Items to be inspected 5.4 Polarizer defect Classification of defects Inspection Standard 5.4.2 Seratches, bubble or dent on glass/polarizer/Reflector, bubble between polarizers & reflector/glass: Minor Acceptable Qty Zize(mm) Zone A Segment deformity C Acceptable Φ≤0.15 5.5 B 0.15＜Φ≤0.20 3 5 0.
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LCD MODULE TRULY ® TSB1G7000-E OUTGOING QUALITY STANDARD TITLE:FUNCTIONAL TEST & INSPECTION CRITERIA Version :1.0 PAGE 5 OF July 29, 2008 7 Mono COG Product 5. Cosmetic Defect Item No Items to be inspected 5.5 Segment deformity Classification of defects Inspection Standard 5.5.2 PIN Hole Acceptable if the following cases are fulfill: Minor 0.1≤Φ≤0.25 mm acceptable MAX 5/PCS where Φ =1/2(X+Y) 5.6 Glass defect 5.6.
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LCD MODULE TRULY ® TSB1G7000-E Version :1.0 PAGE 6 OF OUTGOING QUALITY STANDARD TITLE:FUNCTIONAL TEST & INSPECTION CRITERIA July 29, 2008 7 Mono COG Product 5. Cosmetic Defect Item No Items to be inspected 5.6 Glass defect Classification of defects Inspection Standard (ii) Chips between top/bottom glass. Acceptable for chips not extend to seal part. (ii) chips inside viewing area:spot chips located inside viewing area should be treated as spot defect. (iii) Crack on corner X Y Z ≤5.
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LCD MODULE TRULY ® TSB1G7000-E OUTGOING QUALITY STANDARD TITLE:FUNCTIONAL TEST & INSPECTION CRITERIA Version :1.0 PAGE 7 OF July 29, 2008 7 Mono COG Product 5. Cosmetic Defect Item No Items to be inspected 5.7 Distance between foreign 5.8 Total number of dot Inspection Standard Classification of defects The distance between the foreign dot must exceed 30mm. The total number of luminous dot, dart defect, contamination particle, bubble, scratch defect, pinhole must not exceed 4/piece.
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LCD MODULE TSB1G7000-E Version :1.0 July 29, 2008 nPRECAUTIONS FOR USING LCD MODULES Handing Precautions (1) The display panel is made of glass and polarizer. As glass is fragile. It tends to become or chipped during handling especially on the edges. Please avoid dropping or jarring. Do not subject it to a mechanical shock by dropping it or impact. (2) If the display panel is damaged and the liquid crystal substance leaks out, be sure not to get any in your mouth.
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LCD MODULE TSB1G7000-E Version :1.0 July 29, 2008 Handling precaution for LCM LCM is easy to be damaged. Please note below and be careful for handling. Correct handling: As above picture, please handle with anti-static gloves around LCM edges. Incorrect handling: Please don’t touch IC directly. Please don’t hold the surface of panel. Please don’t hold the surface of IC. TRULY SEMICONDUCTORS LTD. Please don’t stack LCM. Please don’t stretch interface of output, such as FPC cable.
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LCD MODULE TSB1G7000-E Version :1.0 July 29, 2008 Storage Precautions When storing the LCD modules, the following precaution is necessary. (1) Store them in a sealed polyethylene bag. If properly sealed, there is no need for the dessicant. (2) Store them in a dark place. Do not expose to sunlight or fluorescent light, keep the temperature between 0°C and 35°C, and keep the relative humidity between 40%RH and 60%RH. (3) The polarizer surface should not come in contact with any other objects.
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LCD MODULE TSB1G7000-E Version :1.0 July 29, 2008 Precaution for soldering the LCM No ROHS product ROHS product Manual soldering 290°C ~350°C. Time : 3-5S. Machine drag soldering 330°C ~350°C. Speed : 4-8 mm/s. 340°C ~370°C. Time : 3-5S. 350°C ~370°C. Time : 4-8 mm/s. Machine press soldering 300°C ~330°C. Time : 3-6S. Press: 0.8~1.2Mpa 330°C ~360°C. Time : 3-6S. Press: 0.8~1.2Mpa (1) If soldering flux is used, be sure to remove any remaining flux after finishing to soldering operation.
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LCD MODULE TSB1G7000-E Version :1.0 July 29, 2008 Module repairs will be invoiced to the customer upon mutual agreement. Modules must be returned with sufficient description of the failures or defects. Any connectors or cable installed by the customer must be removed completely without damaging the PCB eyelet, conductors and terminals. n PRIOR CONSULT MATTER 1.①For Truly standard products, we keep the right to change material, process ...
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NT7603 Single-Chip 16C X 2L Dot-Matrix LCD Controller / Driver Features ! Internal LCD drivers 16 common signal drivers 80 segment signal drivers ! Maximum display dimensions 16 characters X 2 lines or 32 characters X 1 line ! Interfaces with 4-bit or 8-bit MPU ! Versatile display functions provided on chip: Display Clear, Cursor Home, Display ON/OFF, Cursor ON/OFF, Character Blinking, Cursor Shift, and Display Shift ! Three duty factors, selected by PROGRAM: 1/8, 1/11, and 1/16 ! Displays Data RAM (DD RAM)
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NT7603 Pad Configuration 149 84 150 83 166 67 1 66 Item Pad No. Chip size - Pad pitch 1 - 166 Size X Y 5156 1349 70 2 Unit µm V2.
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NT7603 Block Diagram V1 V2 V3 V4 V5 OPT_R0 OPT_R1 OPT_LCD VDD GND 8 OSC1 OSC2 INSTRUCTION DECODE TEST TIMING GENERATOR 7 8 INSTRUCTION REGISTER (IR) ADDRESS COUNTER TESTM LCD DRIVER VOLTAGE GENERATOR 7 RS 7 7 7 R/W 7 CURSOR ADDRESS COUNTER E DISPLAY DATA RAM (DD RAM) 80 X 8 BITS I/O BUFFER 4 16 COMMON SIGNAL DRIVER 16 COM1 I COM16 80-BIT LATCH CIRCUIT 80 SEGMENT SIGNAL DRIVER 80 SEG1 I SEG80 8 8 DB7 ~ DB4 16-BIT SHIFT REGISTER DATA REGISTER (DR) DB3 ~ DB0 4 BUSY FLAG (BF)
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NT7603 Pad Description (Total 166 pads for COG type) Pad No. Designation I/O External Connection 1 - 15 GND P Power supply 16 OSC1 I For external clock operation, clock inputs to OSC1 17 OSC2 O Clock output 18 V1 P Power supply Power supply for LCD driver.
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NT7603 Functional Description The NT7603 is a dot-matrix LCD controller and driver LSI. It operates with either a 4-bit or an 8-bit microprocessor (MPU). The NT7603 receives both instructions and data from the MPU. Some instructions set operation modes, such as the function mode, data entry mode, and display mode; as well as some control LCD display functions, such as clear display, restore display, shift display, and cursor. Other instructions include reading and writing both data and addresses.
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NT7603 Absolute Maximum Ratings* *Comments Power Supply Voltage (VDD) . . . . . . . . . . -0.3V to + 7.0V Power Supply Voltage (V1 to V5) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GND to VDD + 0.3V Input Voltage (VI) . . . . . . . . . . . . . . . -0.3V to VDD + 0.3V Operating Temperature (TOPR) . . . . . . .-20°C to + 70°C Storage Temperature (TSTG) . . . . . . . .
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NT7603 DC Electrical Characteristics (continued) (VDD = 3.0V, GND = 0V, TA = 25°C) Symbol Parameter Min. Typ. Max. Unit 2.8 3.0 5.5 V Conditions Applicable Pin VDD Operating Voltage VIH1 "H" Level Input Voltage (1) 0.8 VDD - VDD V DB0 - DB7, RS, R/W, VIL1 "L" Level Input Voltage (1) -0.3 - 0.2 VDD V E,OSC1 VOH1 "H" Level Output Voltage (1) VDD - 0.4 - - V IOH = -0.8mA DB0 - DB7 VOL1 "L" Level Output Voltage (1) - - GND + 0.4 V IOL = 0.
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NT7603 AC Characteristics Read Cycle (VDD = 5.0V, GND = 0V, TA = 25°C) Symbol Parameter Min. Typ. Max. Unit Conditions tCYCE Enable Cycle Time 500 - - ns Figure 1 tWHE Enable "H" Level Pulse Width 300 - - ns Figure 1 - - 25 ns Figure 1 - - ns Figure 1 10 - - ns Figure 1 - - 190 ns Figure 1 20 - - ns Figure 1 Min. Typ. Max.
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NT7603 AC Characteristics (continued) Read Cycle (VDD = 3.0V, GND = 0V, TA = 25°C) Symbol Parameter Min. Typ. Max. Unit Conditions tCYCE Enable Cycle Time 500 - - ns Figure 1 tWHE Enable "H" Level Pulse Width 300 - - ns Figure 1 - - 25 ns Figure 1 - - ns Figure 1 10 - - ns Figure 1 - - 190 ns Figure 1 20 - - ns Figure 1 Min. Typ. Max.
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NT7603 Timing Waveforms Read Operation VIH1 VIL1 tAS RS VIH1 VIL1 tAH R/W tWHE VIH1 VIL1 E tFE VIL1 tDHR tRE tRD VOH1 VOL1 DB0 ~ DB7 VIL1 VOH1 VOL1 VAILD DATA tCYCE Figure 1. Bus Read Operation Sequence (Reading out data from NT7603 to 8-bit MPU) Write Operation VIH1 VIL1 RS VIH1 VIL1 tAS R/W tAH VIL1 tWHE tFE VIH1 VIL1 E VIL1 tDHW tRE tDS VIH1 VIL1 DB0 ~ DB7 VAILD DATA VIL1 VIH1 VIL1 tCYCE Figure 2.
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NT7603 Note 1: The NT7603 has two clock options: A. Internal Oscillator (Built-in RC) OSC1 OSC2 OPEN OPEN B. External Clock Operation OSC1 OSC2 PULSE INPUT OPEN Note 2: Input/Output Terminals: A. Input Terminal Applicable Terminal: E (No Pull Up MOS) VDD PMOS NMOS Applicable Terminal: RS, R/W (with Pull Up MOS) VDD VDD Pull Up MOS PMOS PMOS NMOS 11 V2.
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NT7603 B. Output Terminal Applicable Terminal: TESTM VDD PMOS NMOS C I/O Terminal Applicable Terminal: DB0 to DB7 VDD VDD Pull Up MOS PMOS PMOS VDD ENABLE PMOS NMOS DATA NMOS (OUTPUT CIRCUIT) (TRISTATE) Note 3: ITO Options: Set Option = 0: Place ITO on the Option Pad Set Option = 1: No ITO on the Option Pad No ITO: ITO On: GND OUTPUT PAD GND_OUT OPTION PAD GND OUTPUT PAD OPTION OPTION PAD OPTION GND_OUT (Internal pull up) (Internal pull up) ITO Option = 1 Option = 0 12 V2.
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NT7603 Table 1. NT7603H-BDT01 Correspondence between Character Codes and Character Patterns (NOVATEK Standard 192 Character CG ROM) 13 V2.
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NT7603 Instruction Set Code Function Instruction RS RW DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display Clear 0 0 0 0 0 0 0 0 0 1 Display/ Cursor Home 0 0 0 0 0 0 0 0 1 * Entry Mode Set 0 0 0 0 0 0 0 1 I/D S Display ON/OFF 0 0 0 0 0 0 1 D C B Display/ Cursor Shift 0 0 0 0 0 1 S/C R/L * * Function Set 0 0 0 0 1 DL N F * * RAM Address Set 0 0 0 1 DD RAM Address Set Busy Flag/ Address Counter Read CG RAM/ DD RAM Data Write CG RAM/ DD RAM
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NT7603 Interface to LCD (1) Character Font and Number of Lines The NT7603 provides a 5 X 7 dot character font 1-line mode, a 5 X 10 dot character font 1-line mode and a 5 X 7 dot character font 2-line mode, as shown in the table below. Three types of common signals are available as displayed in the table. The number of lines and the font type can be selected by the program.
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NT7603 (b) 5 X 10 Font - 16 character X 1 line (1/11 duty cycle, 1/4 bias) LCD PANEL COM1 COM8 NT7603 SEG1 SEG80 COM11 COM9 (c) 5 X 8 Font - 16 character X 2 line (1/16 duty cycle, 1/5 bias) LCD PANEL COM1 COM8 NT7603 SEG1 SEG80 COM16 COM9 16 V2.
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NT7603 (d) 5 X 8 Font - 32 character X 1 line (1/16 duty cycle, 1/5bias) LCD PANEL COM1 COM8 SEG1 NT7603 SEG80 COM16 COM9 (3) Orientation type of NT7603: Place the chip on the upper glass (IC face up) C1, S1 C8, S1 LCD PANEL C9, S80 1 NT7603 17 C16, S80 V2.
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NT7603 (4) Bias Power Connection NT7603 provides 1/4 or 1/5 bias for various duty cycle applications. The built-in power division resistor divide voltage is described in the following table.
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NT7603 (4) LCD Waveform A-type, 1/8 Duty Cycle, 1/4 Bias 800 CLOCKS COM1 1 2 3 4 5 8 1 2 VDD V1 V2 (V3) V4 V5 1 Frame 1 sec × 800 × 8 = 11 .9ms 540K 1 Frame = Frame Frequency = 1 = 84 .3Hz 11 .9ms A-type, 1/11 Duty Cycle, 1/4 Bias 800 CLOCKS COM1 1 2 3 4 5 11 1 2 VDD V1 V2 (V3) V4 V5 1 Frame 1 sec 1 Frame = × 800 × 11 = 16.3ms 540K Frame Frequency = 1 = 61.4Hz 16.
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NT7603 B-type, 1/8 Duty Cycle, 1/4 Bias 800 CLOCKS COM1 1 2 3 4 5 6 7 8 9 16 1 2 VDD V1 V2 (V3) V4 V5 1 Frame 1sec × 800 × 8 = 11.9ms 540K 1 Frame = Frame Frequency = 1 = 84.3Hz 11.9ms B-type, 1/11 Duty Cycle, 1/4 Bias 800 CLOCKS COM1 1 2 3 4 5 6 7 8 9 10 11 12 21 22 1 2 VDD V1 V2 (V3) V4 V5 1 Frame 1Frame = 1sec × 800 × 11 = 16.3ms 540K Frame Frequency = 1 = 61.4Hz 16.
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NT7603 Low Voltage Reset The Low voltage reset function is used to monitor the supply voltage and applies an internal reset at the time when low voltage is detected. Functions of the Low Voltage Reset Circuit The Low voltage reset circuit has the following functions: # Generates an internal reset signal when VDD ≤ VLVR # Cancels the internal reset signal when VDD > VLVR Here, VDD: power supply voltage, VLVR: Low voltage reset detect voltage, about 2.0V.
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NT7603 Example (for reference only) Interface with 8-bit MPU (read status) RS R/W E Internal signal Internal operation DB7 DATA BUSY BUSY Instruction NO BUSY DATA Busy flag check Instruction Interface with 4-bit MPU (read status) RS R/W E Internal signal DB7 Internal operation D7 Instruction D3 AC3 AC3 BUSY Busy flag check 22 NO BUSY D7 D3 Instruction V2.
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NT7603 Interface with 8-bit MPU (read data) RS R/W E DB7~DB0 D7~D0 D7~D0 D7~D0 Read Data Write Data D7~D0 Write Instruction Interface with 4-bit MPU (read data) RS R/W E DB7~DB4 D7~D4 D3~D0 Write Data D7~D4 D3~D0 D7~D4 D3~D0 Read Data D7~D4 D3~D0 Write Instruction 23 V2.
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NT7603 Initializing by instruction 1.
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NT7603 2.
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NT7603 Ordering Information Part No. CG ROM Package Shipment Style NT7603H-BDB01 192 CGROM (ref P13) COG CHIP FORM Bumped Die on Blue tape NT7603H-BDT01 192 CGROM (ref P13) COG CHIP FORM Bumped Die on chip Tray NT7603-BDW01 192 CGROM (ref P13) COG CHIP FORM Bumped Die on Wafer 26 V2.
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NT7603 Unit: µm Pad Configuration of NT7603 Chip Window: 1220 X 5010 µm 2 A2 A1 A1 N B1 150 N M 149 N B3 84 M B1 83 M L B4 Y r L L r B2 0,0 L B1 M N 1 166 C1 X 66 B3 C2 B 1 67 C1 C2 A1 230 C1 66 A2 5010 C2 511.55 B1 50 r 35 B2 1220 M 42 B3 70 N 90 B4 500.2 L 70 PAD Location NO.
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NT7603 NO.
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NT7603 NO.
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NT7603 Y Tray Information e f H20-210*60-34 T W1 X W2 X SECTION Y-Y c d 7*20 Y g h W1 W2 a e b g h f T SECTION X-X unit: mm Tray Outline Dimensions Symbol Dimensions in mm Symbol Dimensions in mm a 5.33 g 0.85 b 5.93 h 4.05 c 1.52 W1 50.70 d 2.12 W2 45.50 e 1.75 T 45.75 f 1.45 30 V2.
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NT7603 Product Spec. Change Notice NT7603 Specification Revision History Version 2.3 Content Modify 4-bits Interface check busy sequence (page 22) (Document mistake corrected) Adding 8-bits and 4-bits interface read data sequence (page 23) Date Juy.2003 Adding Note 3 and modified fosc from 270KHz to 540KHz (Page 14, Document mistake corrected) 2.