User manual

PIC18 Wireless Development Board Schematic
© 2011-2012 Microchip Technology Inc. Preliminary DS70654B-page 36
A.3 PIC18 WIRELESS DEVELOPMENT BOARD PCB LAYOUT
The PIC18 Wireless Development Board is a two-layer, FR4, 0.062 inch, plated
through-hole PCB construction.
Figure A-4 through Figure A-7 illustrates the PCB
layout of the PIC18 Wireless Development Board.
FIGURE A-4: PIC18 WIRELESS DEVELOPMENT BOARD TOP
SILK-SCREEN
FIGURE A-5: PIC18 WIRELESS DEVELOPMENT BOARD TOP COPPER