User manual

MGC3130 Hillstar Development Kit User’s Guide
DS40001721A-page 26  2013 Microchip Technology Inc.
FIGURE 3-4: ELECTRODE LAYOUT
The electrode PCB is based on a 4-layer PCB design using FR4 material. Three
functional layers are used:
• Layer 1 (Top): Rx electrodes
• Layer 3: Tx electrode and Rx feeding lines
• Layer 4 (Bottom): Ground
Layer 2 is not used.
TABLE 3-2: HILLSTAR ELECTRODE DIMENSIONS
Length Width Design
Horizontal Electrodes (Rx) 91.7 mm 5 mm solid
Vertical Electrodes (Rx) 70.5 mm 5 mm solid
Center Electrode (Rx) 85.7 mm 50.5 mm 3% cross-hatched
Tx Electrode (refer to Figure 3-4)
Part I (under center electrode)
Part II (outside Part I)
120 mm
85.7 mm
120 mm
85 mm
50.5 mm
85 mm
50% cross-hatched
20% cross-hatched
Ground Area 120 mm 85 mm solid