Datasheet

 2012-2013 Microchip Technology Inc. Advance Information DS40001667C-page 35
MGC3130
7.7 Bill of Materials (2.5V  VDD 
3.465V)
Modifying, removing, or adding components may
adversely affect MGC3130 performance.
7.8 Layout Recommendation
This section will provide a brief description of layout
hints for a proper system design.
The PCB layout requirements for MGC3130 follow the
general rules for a mixed signal design. In addition,
there are certain requirements to be considered for the
sensor signals and electrode feeding lines.
The chip should be placed as close as possible to the
electrodes to keep their feeding lines as short as
possible. Furthermore, it is recommended to keep
MGC3130 away from electrical and thermal sources
within the system.
Analog and digital signals should be separated from
each other during PCB layout in order to minimize
crosstalk.
The individual electrode feeding lines should be kept as
far as possible apart from each other.
V
DD lines should be routed as wide as possible. For
designs using the STEP-UP circuitry, the additional
components required should be placed as close as
possible to the MGC3130.
MGC3130 requires a proper ground connection on all
V
SS pins, including the exposed pad (pin 29).
TABLE 7-2: BILL OF MATERIALS FOR 2.5V  VDD  3.465V
Label Qty Value Description
R1, R4, R5, R6, R7, R8 3 10 k Res Thick Film 10 k
C1 1 100 nF Capacitor – Ceramic, 0.1 µF, 10%, 6.3V
C2 1 4.7 µF Capacitor – Ceramic, 4.7 µF, 10%, 6.3V
C3 1 4.7 µF Capacitor – Ceramic, 4.7 µF, 10%, 6.3V
R2, R3 2 1.8 k Res Thick Film 1.8 k
C4 1 10 µF Capacitor – Ceramic, 10 µF, 20%, 6.3V
L1 1 4.7 µH Inductor, 4.7 µH 20%
D1 1
—
Diode Schottky, 20V, 0.5A
R9, R10, R11, R12, R13 5 10 k Res Thick Film 10 k