Datasheet
MGC3130
DS40001667C-page 34 Advance Information 2012-2013 Microchip Technology Inc.
7.5 Bill of Materials (3.3V VDD
3.465V)
Modifying, removing or adding components may
adversely affect MGC3130 performance.
7.6 Standard Schematic Step-Up
Setup (2.5V V
DD 3.465V)
FIGURE 7-2: SCHEMATIC STEP-UP SETUP FOR 2.5V VDD 3.465V VOLTAGE RANGE
TABLE 7-1: BILL OF MATERIALS FOR 3.3V V
DD 3.465V
Label Qty Value Description
R1, R4, R5, R6, R7, R8 3 10 k Res Thick Film 10 k
C1 1 100 nF Capacitor – Ceramic, 0.1 µF, 10%, 6.3V
C2 1 4.7 µF Capacitor – Ceramic, 4.7 µF, 10%, 6.3V
C3 1 4.7 µF Capacitor – Ceramic, 4.7 µF, 10%, 6.3V
R2, R3 2 1.8 k Res Thick Film 1.8 k
R9, R10, R11, R12, R13 5 10 k Res Thick Film 10 k
MGC3130
VDD
VSS1
VSS3
VDD
100 nF
4.7 μF
4.7 μF
MCLR
SDA
SCL
GPIO/IRQ
HOST
VDD
1.8 kΩ
1.8 kΩ
RESET
10 kΩ
VDD
TXD
RX0
RX1
RX2
RX3
RX4
VINDS
VCAPS
VCAPA
VCAPD
EXP
NC
NC
NC
VSS2
EIO7
IS2
SI0
SI1
EIO0
EIO1
EIO6
NC
10 μF
4.7 μH
IS2
IS1
North Electrode
South Electrode
East Electrode
WestElectrode
Center Electrode
C1
L1
C4
D1
C3
C2
R1
R2
R3
R9 (10 kΩ)
R10 (10 kΩ)
R11 (10 kΩ)
R12 (10 kΩ)
R13 (10 kΩ)
VDD
10 kΩ
R4
10 kΩ
10 kΩ
10 kΩ
10 kΩ
IS1
IS2
VDD VDD
R6
R8
R5 (n.p)
R7 (n.p)
n.p: not populated
Interface Selection
EIO2
EIO3
Gesture Port
EIO7
EIO1
EIO6
EIO2
EIO3