MGC3130 Single-Zone 3D Tracking and Gesture Controller Data Sheet Introduction: Key Features: The MGC3130 is a three-dimensional (3D) gesture recognition and tracking controller chip based on Microchip’s patented GestIC® technology. It enables user command input with natural hand and finger movements. Utilizing the principles of electrical nearfield sensing, the MGC3130 contains all the building blocks to develop robust 3D input sensing systems.
MGC3130 Package Type The device is available in 28-lead QFN packaging (see Figure 1). FIGURE 1: 28-PIN DIAGRAM (MGC3130) VDD VSS1 NC TXD MCLR EIO7/SI3 EIO6/SI2 28 27 26 25 24 23 22 QFN VCAPS 1 21 EIO5/SI1 VINDS 2 20 EIO4/SI0 VSS2 3 19 EIO3 RX0 4 18 NC RX1 5 17 NC RX2 6 16 NC RX3 7 15 IS2 MGC3130 DS40001667C-page 2 10 11 12 13 VSS3 VCAPD EIO0 EIO1 14 9 VCAPA Advance Information EIO2 8 RX4 EXP-29 2012-2013 Microchip Technology Inc.
MGC3130 TABLE 1: Pin Name 28-PIN QFN PINOUT DESCRIPTION Pin Number Pin Type Buffer Type Description VCAPS 1 P — External filter capacitor (10 µF) connection for internal STEP-UP converter (optional). VINDS 2 P — External inductor (4.7 µH) + Schottky diode connection for internal STEP-UP converter usage (optional). VSS2 3 P — Ground reference for the STEP-UP converter.
MGC3130 Table of Contents 1.0 Theory of Operation: Electrical Near-Field (E-Field Sensing).................................................................................................... 5 2.0 Feature Description.................................................................................................................................................................... 7 3.0 System Architecture..........................................................................................................
MGC3130 1.0 THEORY OF OPERATION: ELECTRICAL NEAR-FIELD (E-FIELD) SENSING FIGURE 1-1: EQUIPOTENTIAL LINES OF AN UNDISTORTED E-FIELD FIGURE 1-2: EQUIPOTENTIAL LINES OF A DISTORTED E-FIELD Microchip’s GestIC is a 3D sensor technology which utilizes an electric field (E-field) for advanced proximity sensing. It allows realization of new user interface applications by detection, tracking and classification of a user’s hand or finger motion in free space.
MGC3130 1.1 GestIC Technology Benefits • GestIC E-field sensors are not impacted by ambient influences such as light or sound, which have a negative impact to the majority of other 3D technologies. • The GestIC technology has a high immunity to noise, provides high update rates and resolution, low latency and is also not affected by clothing, surface texture or reflectivity.
MGC3130 2.0 FEATURE DESCRIPTION 2.2.1.2 2.1 Gesture Definition The Colibri Suite’s gesture recognition model detects and classifies hand movement patterns performed inside the sensing area. A hand gesture is the movement of the hand to express an idea or meaning. The GestIC technology accurately allows sensing of a user’s free space hand motion for contact free position tracking, as well as three-dimensional (3D) gesture recognition based on classified movement patterns. 2.
MGC3130 The Tap and Double Tap signalize short taps and double taps on each system electrode. The Tap length and Double Tap interval are adjustable. - Single Tap Delay: A Single Tap is detected when touching the surface of an electrode first and after the hand is pulled out of the touch area. The Single Tap is only detected when the timing between the touch and the release of the touch event is smaller than the adjusted delay. Increasing the time allows the user more time to perform the tap.
MGC3130 2.2.1.3 • Calibration Scan(1): The Approach Detection feature includes the possibility to perform additional Calibration Scans for the continuous adaptation of the electrode system to environmental changes. A Calibration Scan is performed during the Scan phase of the MGC3130’s Self Wake-up mode. Five Rx channels are active to calibrate the sensor signals. The Calibration Scan is usually performed in configurable intervals from 2s to 1024s.
MGC3130 3.0 SYSTEM ARCHITECTURE 3.2 GestIC Library The MGC3130 is the first product based on Microchip’s GestIC technology. It is developed as a mixed-signal configurable controller. The entire system solution is composed by three main building blocks (see Figure 3-1): The embedded GestIC Library is optimized to ensure continuous and real-time free-space Position Tracking and Gesture Recognition concurrently.
MGC3130 3.3.1 ELECTRODE EQUIVALENT CIRCUIT The hand Position Tracking and Gesture Recognition capabilities of a GestIC system depends on the electrodes design and their material characteristics. A simplified equivalent circuit model of a generic GestIC electrode system is illustrated in Figure 3-2.
MGC3130 Note: 3.3.2 are separated by a thin isolating layer. The Rx electrodes are typically arranged in a frame configuration as shown in Figure 3-3. The frame defines the inside sensing area with maximum dimensions of 14x14 centimeters. An optional fifth electrode in the center of the frame may be used to improve the distance measurement and add simple touch functionality. Ideal designs have low CRxTx and CRxG to ensure higher sensitivity of the electrode system.
MGC3130 4.0 FUNCTIONAL DESCRIPTION Microchip Technology’s MGC3130 configurable controller uses up to five E-field receiving electrodes. Featuring a Signal Processing Unit (SPU), a wide range of 3D gesture applications are being preprocessed on the MGC3130, which allows short development cycles. Always-on 3D sensing, even for battery-driven mobile devices, is enabled due to the chip’s low-power design and variety of programmable power modes.
MGC3130 4.1 Reset Block The Reset block combines all Reset sources. It controls the device system’s Reset signal (SYSRST). The following is a list of device Reset sources: • MCLR: Master Clear Reset pin • SWR: Software Reset available through GestIC Library • WDTR: Watchdog Timer Reset A simplified block diagram of the Reset block is illustrated in Figure 4-2. FIGURE 4-2: SYSTEM RESET BLOCK DIAGRAM MCLR Glitch Filter • VDDA Domain: This domain is powered by VDDA = 3.0V.
MGC3130 4.2.2 POWER SUPERVISORS During the Power-up sequence, the system is kept under Reset condition for approximately 200 µs (Reset delay: tRSTDLY) after the VDD =1.5V voltage is reached (1.2V minimum). During this delay, the system Reset will remain low and the VDD should reach typically 2V. When the Reset delay is elapsed, the system Reset is released (high) and the system starts Power-up/Timeout (tPWRT) sequence.
MGC3130 Standard applications (without STEP-UP) (3.3V VDD 3.465V): The system starts when (see Figure 4-5): • Power-up/Time-out period (tPWRT) is elapsed • VDD = 3.3V is already reached before the end of tPWRT timing The power-up sequence begins by increasing the voltage on the VDD pin (from 0V). If the slope of the VDD rise time is faster than 4.5 V/ms, the system starts correctly. If the slope is less than 4.
MGC3130 4.2.3 CLOCKS 4.2.4.2 Deep Sleep Mode The MGC3130 is embedding two internal oscillators, high speed and low speed. The High-Speed Oscillator (HSO) is factory-trimmed, achieving high accuracy. During the Deep Sleep mode, VDDM and VDDA are turned off, and VDDC is still powered to retain the data of the SPU. • High-Speed Oscillator (HSO): The mode includes the following characteristics: The MGC3130 is clocked by an internal HSO running at 22.5 MHz ±10% and consuming very low power.
MGC3130 4.2.4.4 MGC3130 Power Profile The MGC3130 power profile is illustrated in Figure 4-6.
MGC3130 FIGURE 4-7: CURRENT CONSUMPTION FOR VARYING TIME INTERVALS BETWEEN APPROACH SCANS AND CALIBRATION SCANS 1,40 1,21 Current Consumption [mA] 1,20 1,00 0,86 0,80 0,77 no Calibration Scan 0,60 Calibration Scan every 2s 0,57 Calibration Scan every 10s 0,40 0,20 0,20 0,11 0,00 0 FIGURE 4-8: 50 100 150 200 Time Interval between Approach Scans[ms] CURRENT CONSUMPTION FOR A FIXED TIME INTERVAL BETWEEN APPROACH SCANS OF 20 ms Current Consumption (mA) 1,40 1,21 1,20 1,07 1,00 0,99 0,95 0
MGC3130 4.2.4.5 Operation Modes Summary Table 4-2 summarizes the MGC3130 operation modes. TABLE 4-2: OPERATION MODES SUMMARY Mode Entry Exit I2 Processing C™0/IRQ0/Approach/ MCLR/WDTR/SW Reset Self Wake-up Time-out/GestIC® Library Message GestIC® Library Message Deep Sleep 4.2.
MGC3130 Power-up Phases • Reset or Deep Sleep: The system is kept in Reset or is in Deep Sleep mode • Power-up: Phase when the system starts up after Reset/Deep Sleep has been released • Processing operation: Processing mode is started • Power-up Time-out TABLE 4-3: POWER-UP TIME-OUT (tPWRT) Delay in LSO Cycles Signal Symbol After Reset After Deep Sleep (STEP-UP On) After Deep Sleep (STEP-UP Off) tVREF 0 0 0 tHSO 2 2 2 STEP-UP tSTEP-UP 4 4 x SPU CLK tSPUCLK 30 30 8 Power-Up Time-Ou
MGC3130 Power-down Phases FIGURE 4-11: • Processing Operation: Processing mode is activated • Request: Request to enter Deep Sleep mode • Power-down: Power-down state (all analog signals are down) • Deep Sleep: Deep Sleep mode has been entered LSO: Low-Speed Oscillator clock HSO: High-Speed Oscillator clock VREF Enable: Voltage Reference enable signal HSO Enable: High-Speed Oscillator enable signal STEP-UP enable: STEP-UP converter enable signal 4.
MGC3130 5.0 APPLICATION ARCHITECTURE MGC3130 supports two different implementations: single-zone design and dual-zone design. Note: 5.1 Currently, only single-zone I2C™ Slave mode is supported. Other modes are planned for future releases of GestIC® Library. Please contact your Microchip representative for further details. Single-Zone Design The standard MGC3130 implementation is a singlezone design. This configuration is based on one MGC3130 connected to an application host.
MGC3130 6.0 INTERFACE DESCRIPTION The MGC3130 supports interfaces: I2C and SPI. communication Currently, only single-zone I2C™ Slave mode with I2C0 is supported. Other modes are planned for future releases of GestIC® Library. Please contact your Microchip representative for further details. Note: 6.1 two Interface Selection The MGC3130 interface selection pin, IS2, is used to select I2C slave address. There are two different addresses. TABLE 6-1: IS2 0 1 6.
MGC3130 FIGURE 6-1: GESTURE PORT MAPPING Colibri Suite Events Action Selection [0:2] Permanent high Permanent low Toggle Pulse (5ms) High active Low active Flick South -> North Circle ClockWise Touch Tap Double Tap Sensor Touch Selection [0:1] Circle Counter-ClockWise Gesture Sensor Touch EventInput Selection [0:1] Flick East -> West Flick North -> South Electrode Selection [0:2] Flick West -> East Gesture Selection [0:2] EventOutput1..
MGC3130 TABLE 6-3: COLIBRI SUITE EVENTS Gesture Port Mapping Parameter Description Gesture Selection Selects the gestures which will be used as event. Gesture Selection can be: • Flick West/East • Flick East/West • Flick North/South • Flick South/North • Circle clockwise • Circle Counter clockwise Sensor Touch Selection Selects the sensor touch which will be used as event.
MGC3130 FIGURE 6-2: GESTURE PORT ACTION Event Permanent high Event Permanent low Event Pulse (5ms) Event Event Event Toggle Touch detected Touch released Touch detected Touch released High active Low active TABLE 6-4: GPIO PORT ACTION MAPPING Action Event Gesture Permanent Permanent High Low X X Toggle X Pulse (5 ms) High Active Low Active X Touch X X X X Single Tap X X X X Double Tap X X X X Wake-up after Approach Detection X X 2012-2013 Microchip Technology Inc.
MGC3130 6.6 Communication Interfaces The MGC3130 supports two I2C interfaces. Only I2C0 is used in a single-zone configuration.
MGC3130 I2C master receives eight data bits (MSB first) presented on SDA by the MGC3130, at eight sequential I2C master clock (SCL) cycles. The data is latched out on SCL falling edges to ensure it is valid during the subsequent SCL high time. 7. If data transfer is not complete, then: - I2C master acknowledges (ACK) reception of the eight data bits by presenting a low on SDA, followed by a low-high-low on SCL. - Go to step 5. 8.
MGC3130 TABLE 6-9: USAGE OF TRANSFER STATUS LINE MGC3130 Host Controller TS Line Status Released (H) Released (H) High Host finished reading data (Transfer end). No more data to be transferred to the host. MGC3130 is allowed to update the data buffer. Asserted (L) Released (H) Low Data from MGC3130 is available to be sent, but the host has not yet started reading.
MGC3130 6.6.3 SPI SPI features: • • • • One Port: SCLK, CS, MOSI, MISO Master and Slave mode Up to 3 MHz Support of all clock edge and polarity options Note: Currently, only single-zone I2C™ Slave mode with I2C0 is supported. Other modes are planned for future releases of GestIC® Library. Please contact your Microchip representative for further details. SPI Hardware Interface A summary of the hardware interface pins is shown below in Table 6-10.
Address SDA R/W A7 A6 A5 A4 A3 A2 A1 1 2 3 4 5 6 7 ACK Data 1 ACK D7 D6 D5 D4 D3 D2 D1 D0 1 2 3 4 5 6 7 8 Data MGC3130 DS40001667C-page 32 I2C™ MASTER READ BIT TIMING DIAGRAM FIGURE 6-4: ACK D7 D6 D5 D4 D3 D2 D1 D0 1 2 3 4 5 6 7 8 SCL S 8 9 9 9 P Address Bits Latched in Start Bit Data Bits Valid Out Data Bits Valid Out SCL may be stretched Stop Bit SCL may be stretched Advance Information I2C™ MASTER WRITE BIT TIMING DIAGRAM FIGURE 6-5
MGC3130 7.0 HARDWARE INTEGRATION 7.1 ESD Considerations 7.3 Irradiated High-Frequency Noise The MGC3130 provides Electrostatic Discharge (ESD) Voltage protection up to 2 kV (HBM). Additional ESD countermeasures may be implemented individually to meet application-specific requirements. In order to suppress irradiated high-frequency signals, the five Rx channels of the chip are connected to the electrodes via serial 10 kresistors, as close as possible to MGC3130.
MGC3130 7.5 Bill of Materials (3.3V VDD 3.465V) Modifying, removing or adding components may adversely affect MGC3130 performance. TABLE 7-1: BILL OF MATERIALS FOR 3.3V VDD 3.465V Label Qty Value Description R1, R4, R5, R6, R7, R8 3 10 k Res Thick Film 10 k C1 1 100 nF Capacitor – Ceramic, 0.1 µF, 10%, 6.3V C2 1 4.7 µF Capacitor – Ceramic, 4.7 µF, 10%, 6.3V C3 1 4.7 µF Capacitor – Ceramic, 4.7 µF, 10%, 6.3V R2, R3 2 1.8 k Res Thick Film 1.
MGC3130 7.7 Bill of Materials (2.5V VDD 3.465V) Modifying, removing, or adding components may adversely affect MGC3130 performance. TABLE 7-2: BILL OF MATERIALS FOR 2.5V VDD 3.465V Label Qty Value Description R1, R4, R5, R6, R7, R8 3 10 k Res Thick Film 10 k C1 1 100 nF Capacitor – Ceramic, 0.1 µF, 10%, 6.3V C2 1 4.7 µF Capacitor – Ceramic, 4.7 µF, 10%, 6.3V C3 1 4.7 µF Capacitor – Ceramic, 4.7 µF, 10%, 6.3V R2, R3 2 1.8 k Res Thick Film 1.
MGC3130 8.0 DEVELOPMENT SUPPORT Microchip provides software and development tools for the MGC3130: hardware • Software: - MGC3130 Software Package – Aurea GUI and GestIC Library - MGC3130 Software Development Kit (SDK) - MGC3130 PIC18F14K50 Host Reference Code • Schematics: - MGC3130 Hillstar Hardware References • Evaluation and Development Kits: - MGC3130 – Sabrewing Single-Zone Evaluation Kit (DM160217) - MGC3130 Single-Zone Development Kit Hillstar (DM160218) 8.
MGC3130 9.0 ELECTRICAL SPECIFICATIONS 9.1 Absolute Maximum Ratings(†) Ambient temperature under bias......................................................................................................... -20°C to +85°C Storage temperature ........................................................................................................................ -55°C to +125°C Voltage on pins with respect to VSS on VDD pin ...................................................................................
MGC3130 10.0 PACKAGING INFORMATION 10.1 Package Marking Information 28-Lead QFN (5x5x0.9 mm) PIN 1 Example PIN 1 Legend: XX...X Y YY WW NNN e3 * Note: DS40001667C-page 38 MGC3130 -I/MQ e3 1318017 Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free.
MGC3130 10.2 Package Details The following sections give the technical details of the packages. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2012-2013 Microchip Technology Inc.
MGC3130 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS40001667C-page 40 Advance Information 2012-2013 Microchip Technology Inc.
MGC3130 28-Lead Plastic Quad Flat, No Lead Package (MQ) – 5x5 mm Body [QFN] Land Pattern With 0.55 mm Contact Length Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Microchip Technology Drawing C04-2140A 2012-2013 Microchip Technology Inc.
MGC3130 APPENDIX A: DATA SHEET REVISION HISTORY Revision A (11/2012) Initial release of this data sheet. Revision B (08/2013) Updated the Power Features section; Updated Table 1; Updated section 2, Feature Description; Updated section 4.2.
MGC3130 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers.
MGC3130 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. [X](1) PART NO.
Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature.
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