User's Manual

Table Of Contents
© 2014 Microchip Technology Inc. Preliminary DS60001270C-page 21
CY920
4.0 Wi-Fi SPECIFICATION
Table 4-1 describes the Wi-Fi specifications of the
CY920 module.
TABLE 4-1: Wi-Fi
®
SPECIFICATIONS
(1, 2, 4, 5, 6)
Feature Description
WLAN Standards
IEEE 802.11a
IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
Frequency
Band/Channels
2.412 - 2.472 GHz (2.4 GHz ISM Band, 13 Channels)
Channel 1 - Channel 13
5.180 - 5.240 GHz (U-NII lower band)
5.260 - 5.320 GHz (U-NII middle band), see Note 3
5.500 - 5.700 GHz (U-NII middle band extended), see Note 3
5.745 - 5.825 GHz (U-NII upper band/ISM band)
North America FCC, Japan Telec, Europe ETSI
Modulation
802.11a mode (OFDM: IEEE 802.11a)
802.11b mode (DS-SS: IEEE 802.11b)
802.11g mode (OFDM: IEEE 802.11g)
802.11n mode (OFDM: IEEE 802.11n)
Transmission Speed
802.11a mode
54 Mbps, 48 Mbps, 36 Mbps, 24 Mbps, 18 Mbps, 12 Mbps, 9 Mbps, 6 Mbps
802.11b mode
11 Mbps, 5.5 Mbps, 2 Mbps, 1 Mbps
802.11g mode
54 Mbps, 48 Mbps, 36 Mbps, 24 Mbps, 18 Mbps, 12 Mbps, 9 Mbps, 6 Mbps
802.11n mode
MCS0 to MCS7(20 MHz and 40 MHz supported)
Normal and short GI supported (PHY data rates up to 150 Mbps for 40 MHz mode + short GI)
Note 1: With respect to T
X power, different (higher/lower) RF output power settings may be used for specific
regions, antennas and/or enclosures, in which case recertification may be required.
2: 802.11n Greenfield is not supported. (Greenfield forces 802.11n operation even in the presence of
802.11b/g AP)
3: Dynamic Frequency Selection (DFS) is supported by the hardware. Firmware support for DFS may not be
in initial firmware releases, but will follow in a later firmware release.
4: 802.11n 20 MHz and 40 MHz bandwidth is supported.
5: The availability of some specific channels and/or operational frequency bands are country dependent and
are firmware programmed at the Host product factory to match the intended destination. The firmware
setting is not accessible to the end user of the Host product.
6: Specifications are based on nominal test settings during module production at room temperature.