User Manual

Soldering Recommendations
Stereo module was assembled using standard lead-free reflow profile IPC/JEDEC J-STD-020. The
module can be soldered to the main PCB using standard leaded and lead-free solder reflow profiles. To
avoid damaging of the module, the recommendations are listed as follows:
• Refer to Microchip Technology Application Note AN233 Solder Reflow Recommendation (DS00233)
for the soldering reflow recommendations
• Do not exceed peak temperature (T
P
) of 250 degree C
• Refer to the solder paste data sheet for specific reflow profile recommendations
• Use no-clean flux solder paste
• Do not wash as moisture can be trapped under the shield
• Use only one flow. If the PCB requires multiple flows, apply the module on the final flow.
ORDERING INFORMATION
TABLE 4‐1: ORDERING INFORMATION
Part Number
Description
BM7
8
SPPS
5N
C2
-
00
0
---
Bluetooth® 4.0 Dual Mode, Class 2, Surface Mount module with integral
antenna, with shield
BM7
8
SPP0
5N
C2
-
000
---
Bluetooth® 4.0 Dual Mode, Class 2, Surface Mount module, external
antenna, no shield