User Manual
Stereo Module
2015 Microchip Technology Inc.
Page 34
P
reliminary
Edition
8.0 PACKAGING AND STORAGE INFORMATION
The module is packaged into trays (see following page) of sixty three (63) modules in a 7 x 9 format.
These trays are then sealed into bags. Ten sealed bags are then placed in a box of 630 pieces with a
dimension of 36 * 16 * 9.5 cm
3
.
The shelf life of each module in a sealed bag is 12 months at <40°C and <90% relative humidity.
After a bag is opened, devices that will be subjected to reflow solder or other high temperature
processes must be mounted within 168 hours (7 days) at factory conditions of <30°C and <60% relative
humidity.