User Manual

Stereo Module

2015 Microchip Technology Inc.
Page 33
P
reliminary
Edition
7.2 REFLOW PROFILE
FIGURE 7-5: REFLOW PROFILE
Soldering Recommendations
Stereo module was assembled using standard lead-free reflow profile IPC/JEDEC J-STD-020. The
module can be soldered to the main PCB using standard leaded and lead-free solder reflow
profiles. To avoid damaging of the module, the recommendations are listed as follows:
• Refer to Microchip Technology Application Note AN233 Solder Reflow
Recommendation (DS00233) for the soldering reflow recommendations
• Do not exceed peak temperature (T
P
) of 250 degree C
• Refer to the solder paste data sheet for specific reflow profile recommendations
• Use no-clean flux solder paste
• Do not wash as moisture can be trapped under the shield
• Use only one flow. If the PCB requires multiple flows, apply the module on the final flow.
Slope: 1~2℃/sec max.
(217℃ to peak)
Ramp down rate :
Max. 3℃/sec.
Preheat: 150~200℃
25℃
217℃
peak: 260 +5/-0℃
60 ~ 180 sec. 60 ~150sec
20~40 sec.
Time (sec)