BM20/BM23 Bluetooth® 4.1 Stereo Audio Module Features: Complete, Fully Certified, Embedded 2.4 GHz Bluetooth® Version 4.1 Module Bluetooth Classic (BDR/EDR) Bluetooth SIG Certified Onboard embedded Bluetooth Stack Transparent UART mode for seamless serial data over UART interface Easy to configure with Windows GUI or direct by MCU Firmware can be field upgradable via UART Compact surface mount module: 29 x 15 x 3 2.
FIGURE 1: General Description: Stereo module is a fully-certified Bluetooth® Version 4.1 (BDR/EDR) module for designers who want to add Bluetooth® wireless audio and voice applications to their products. This Bluetooth SIG certified module provides a complete wireless solution with Bluetooth stack, integrated antenna, and worldwide radio certifications in a compact 3 surface mount package, 29x15x2.5 mm . 2015 Microchip Technology Inc.
Stereo Module Table of Contents 1.0 DEVICE OVERVIEW .................................................................................................................................. 4 2.0 APPLICATION INFORMATION ............................................................................................................... 10 3.0 ELECTRICAL CHARACTERISTICS ....................................................................................................... 18 4.0 PRINTED ANTENNA INFORMATION...............
Stereo Module 1.0 DEVICE OVERVIEW The stereo module series include BM20 and BM23. The chip integrates Bluetooth 4.1 radio transceiver, PMU and DSP. Figure 1-1and 1-2 shows the application block diagram. FIGURE 1‐1: BM20 Typical Application The following depicts an example of BM20 module operate as an independent system or connected to an MCU.
Stereo Module 1.1 INTERFACE DESCRIPTION BM20 pin diagram is shown in Figure 1-3. The pin descriptions are shown in Table 1-1 FIGURE 1-3: BM20 PIN DIAGRAM TABLE 1‐1: BM20 PIN DESCRIPTION Pin No. Pin type Name Description IO pin, default pull-high input (Note 1) 1 I/O P0_0 1. Slide Switch Detector, active low. 2. UART TX_IND, active low. Embedded ROM/External Flash enable 2 I EAN H: Embedded; L: External Flash IO pin, default pull-high input (Note 1) 3 I P3_0 Line-in Detector (default), active low.
Stereo Module Pin No. Pin type Name Description 9 O SPKL 10 P VDDA 11 I MIC1_P L-channel analog headphone output Positive power supply/reference voltage for CODEC, no need to add power to this pin.
Stereo Module Pin No. Pin type Name Description 36 I P2_4 IO pin, default pull-high input System Configuration, L: Boot Mode with P2_0 low combination 37 P GND Ground Pin 38 - NC No Connection 39 - NC No Connection 40 - NC No Connection * I: signal input pin * O: signal output pin * I/O: signal input/output pin * P: power pin Note 1: These button or functions can be setup by “IS20XXS_UI” tool. 2015 Microchip Technology Inc.
Stereo Module BM23 pin diagram is shown in Figure 1-4. The pin descriptions are shown in Table 1-2 FIGURE 1-4: BM23 PIN DIAGRAM TABLE 1‐2: BM23 PIN DESCRIPTION Pin No. Pin Type Name 1 I/O P0_0 2 3 4 5 6 7 I/O I/O I/O I O I/O RFS0 TFS0 SLK0 DR0 DT0 P0_4 8 I EAN 9 I MIC1_P 10 11 12 13 14 I P P I I MIC1_N MIC_BIAS VDDA AIR AIL 2015 Microchip Technology Inc.
Stereo Module Pin No. I/O Name Description 15 P GND 16 I RST_N 17 -- NC -- 18 -- NC -- 19 P VDDIO 20 I/O P1_5 IO pin, default pull-high input 21 I/O P0_1 22 P ADAP_IN IO pin, default pull-high input 5V power adaptor input 23 P BAT_IN 3.3~4.
Stereo Module 2.0 APPLICATION INFORMATION 2.1 OPERATION WITH EXTERNAL MCU Stereo module support UART command set to make an external MCU to control module. Here is the connection interface between BMXX and MCU. FIGURE 2-1: INTERFACE BETWEEN MCU AND BMXX MODULE MCU_ WAKEUP UART_RX UART_TX P0_0 UART interface UART interface BT_ WAKEUP HCI_TXD XX HCI_RXD MFB MCU can control module by UART interface and wakeup module by PWR pin. Stereo module provide wakeup MCU function by connect to P0_0 pin of module.
Stereo Module Here are some suggestions of UART control signal timing sequence: FIGURE 2-2: POWER ON/OFF SEQUENCE 2015 Microchip Technology Inc.
Stereo Module FIGURE 2-3: TIMING SEQUENCE OF RX INDICATION AFTER POWER ON FIGURE 2-4: TIMING SEQUENCE OF POWER OFF 2015 Microchip Technology Inc.
Stereo Module FIGURE 2-5: TIMING SEQUENCE OF POWER ON (NACK) FIGURE 2-6: RESET TIMING SEQUENCE IF MODULE HANGS UP 2015 Microchip Technology Inc.
Stereo Module FIGURE 2-7: TIMING SEQUENCE OF POWER DROP PROTECTION Power 2.9V ~ BAT_IN +4V RST_N from Reset IC If BT’s BAT use adaptor translates voltage by LDO, we recommend use “Reset IC” to avoid power off suddenly. Rest IC spec output pin must be “Open Drain”、delay time ≦ 10ms Recommend part: TCM809SVNB713 or G691L263T73 2015 Microchip Technology Inc.
Stereo Module 2.2 I2S Signal Application for BM23 2 BM23 support I S digital audio signal interface to connect your external CODEC/DSP. It provide 8k Hz, 44.1k Hz and 48k Hz sampling rate; it also support 16 bits and 24bits data format. The I2S setting can be set up by UI and DSP tools. . The external CODEC/DSP needs to be connected to SLK0, RFS0, TFS0, DR0, and DT0 (pins 4, 2, 3, 5, and 6 respectively).
Stereo Module The clock and data timing as below: FIGURE 2-11: TIMING FOR I2S MODES (both master and slave) FIGURE 2-12: TIMING FOR PCM MODES (both master and slave) 2.3 RESET (RST_N) RST is module reset pin which is active LOW. To reset the module, the RST_N must hold LOW for at least 63ns. 2.
Stereo Module 2.5 EXTERNAL CONFIGURATION Stereo module can be configured and firmware programmed using an external configuration and programming tool available from Microchip. Figure 2‐7 shows the configuration and firmware programming interface on BM23. It is recommended to include a pin header on the main PCB for development. Configuration and firmware programming modes are entered accordingly to the system configuration I/O pins as shown in Table 2-1. Pin P20, P24 and EAN pin have internal pull‐up.
Stereo Module 3.0 ELECTRICAL CHARACTERISTICS Table 3-1: ABSOLUTE MAXIMUM SPECIFICATION Symbol BAT_IN ADAP_IN TSTORE TOPERATION Parameter Input voltage for battery Input voltage for adaptor Storage temperature Operation temperature Min 0 0 -65 -20 Max 4.3 7.0 +150 +70 Unit V V ºC ºC Table 3-2: RECOMMENDED OPERATING CONDITION Symbol BAT_IN ADAP_IN TOPERATION Parameter Input voltage for battery Input voltage for adaptor Operation temperature Min 3 4.5 -20 Typical 3.7 5 +25 Max 4.2 5.
Stereo Module Table 3-4: BATTERY CHARGER Parameter Min Typical Max Unit ADAP_IN Input Voltage 4.5 5.0 5.5 V 3 4.5 mA 170 200 240 mA 160 180 240 mA 330 350 420 mA 180 220 270 mA Supply current to charger only Maximum Battery Fast Charge Current Note: ENX2=0 Maximum Battery Fast Charge Current Note: ENX2=1 Headroom > 0.7V (ADAP_IN=5V) Headroom = 0.3V (ADAP_IN=4.5V) Headroom > 0.7V (ADAP_IN=5V) Headroom = 0.3V (ADAP_IN=4.
Stereo Module Table 3-6: AUDIO CODEC ANALOGUE TO DIGITAL CONVERTER T= 25oC, Vdd=3.0V, 1KHz sine wave input, Bandwidth = 20Hz~20KHz Parameter (Condition) Min. Resolution Output Sample Rate Signal to Noise Ratio Note: 1 (SNR @MIC or Line-in mode) Digital Gain Digital Gain Resolution Typ. 8 Max. Unit 16 48 Bits KHz 88 -54 MIC Boost Gain dB 4.85 2~6 dB dB 20 dB Analog Gain 60 Analog Gain Resolution 2.
Stereo Module Table 3-7: AUDIO CODEC DIGITAL TO ANALOGUE CONVERTER T= 25oC, V dd=3.0V, 1KHz sine wave input, Bandwidth = 20Hz~20KHz Parameter (Condition) Min. Over-sampling rate Resolution Output Sample Rate Signal to Noise Ratio Note: 1 (SNR @cap-less mode) for 48kHz Signal to Noise Ratio Note: 1 (SNR @single-end mode) for 48kHz Digital Gain Typ. Max. Unit 20 48 fs Bits KHz 128 16 8 96 dB 98 dB -54 Digital Gain Resolution 4.
Stereo Module Table 3-9: RECEIVER SECTION FOR BDR AND EDR Modulation Sensitivity at 0.1% BER Sensitivity at 0.01% BER Min Typ Max Bluetooth specification Unit GFSK -90 ≤-70 dBm π/4 DQPSK -91 ≤-70 dBm 8DPSK -82 ≤-70 dBm Note: (1) Test condition: VCC_RF= 1.28V, temperature=25 ºC. (2) These parameters are characterized but not tested in manufacturing. Table 3-10: SYSTEM CURRENT CONSUMPTION OF ANALOG AUDIO OUTPUT System Status System Off Mode Typ. Max. Unit 2 5 uA Standby Mode 0.
Stereo Module 4.0 PRINTED ANTENNA INFORMATION 4.1 MODULE RADIATION PATTERN The stereo module contains a PCB printed antenna. The PCB printed antenna radiation pattern is shown in Figure 4-2. FIGURE 4-1: ANTENNA KEEP OUT AREA EXAMPLES FIGURE 4-2: ANTENNA 3D RADIATION PATTERN @2441 MHz 2015 Microchip Technology Inc.
Stereo Module 4.2 MODULE PLACEMENT RULE On the main PCB, the areas under the antenna should not contain any top, inner layer, or bottom copper as shown in Figure 4‐1. A low‐impedance ground plane will ensure the best radio performance (best range, lowest noise). The ground plane can be extended beyond the minimum recommended as need for the main PCB EMC noise reduction. For the best range performance, keep all external metal away from the ceramic chip antenna at least 15 mm.
VBUS DD+ ID GND LINE INPUT 3 5 4 2 1 3 1 4 2 10 1 1 P3_0 C15 0. 1u/16V AOHPM 2 1 1 R7 0 R6 0 MIC_N1 MIC_P1 1 C13 2.2u/6.3V SPKR SPKL 2 2 R75 1K JP5 JP 1x2 1 2 Li Battery Connector LI NE_R LI NE_L R4 2K C14 1u/16V C10 1u/16V 2 C93 NP-0603 R3 1K P3 USBM3121-051-1-BN-R 1 5V 2 3 4 C18 5 10u/16V TSH-3865D P2 P1 PJ-2001-5K 3 5 4 2 1 2 AI R AI L C19 10u/16V BAT_IN R8 NP-0603 C17 1u/ 16V C16 1u/ 16V R5 NP-0603 MIC_BIAS C72 2.2u/6.
P2 RED BLUE MI C_BIAS LED2 LED-HR 1 LED2 2 DC-JACK 3 2 1 C18 1u/ 16V ADAP_IN C20 0.1u/ 16V LED LED1 LED-B 1 1 TP2 TP-4 BAT_IN ADAP_IN SY S_PWR P2_4 LED2 LED1 MFB HCI_RXD HCI_TXD P2_0 P3_0 C13 0.1u/ 16V SYS_PWR 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 4 JP4 SJP 1x2 3 C16 0.1u/16V C17 1u/16V BAT_IN BATTERY CONNECTOR GND P2_0 P3_0 P2_0 P2_7 P0_5 HCI _RXD HCI_TXD P0_3 P0_2 P2_4 LED2 LED1 MFB BK_OUT LED1 2 RST_N TP4 TP-4 DC POWER SOURCE C7 4.
Stereo Module 6.0 CERTIFICATION INFORMATION 6.1 BQTF INFORMATION FIGURE 6-1: BM15/BM20/BM23/BM25 QDID Data 2015 Microchip Technology Inc.
Stereo Module 6.2 REGULATORY APPROVAL BM23 has got these countries regulatory approval: • United States; FCC ID: A8TBM23SPKXYC2A • Canada; IC ID: 12246A-BM23SPKXYC2 • Europe • Japan: 202-SMC067 • Korea; Certification No.: MSIP-CRM-S9S-BM23SPKXY • Taiwan; NCC No.: CCAL15LP0270T3 BM20 has got these countries regulatory approval: • United States: FCC ID: A8TBM20SPKXYNBZ • Canada; IC ID: 12246A-BM20SPKS1 • Europe • Japan: 202-SMD048 • Korea; Certification No.
Stereo Module 7.0 MODULE OUTLINE AND REFLOW PROFILE 7.1 MODULE DIMENSION AND PCB FOOT PRINT FIGURE 7-1: BM20 Outline Dimension PCB dimension: X : 15.0 mm Y : 29.0 mm Tolerances: 0.25 mm 2015 Microchip Technology Inc.
Stereo Module FIGURE 7-2: BM23 Outline Dimension PCB dimension: X : 15.0 mm Y : 29.0 mm Tolerances: 0.25 mm 2015 Microchip Technology Inc.
Stereo Module FIGURE 7-3: BM20 PCB FOOT PRINT Note: The “Keep Out Area” is reserved for RF performance check. 2015 Microchip Technology Inc.
Stereo Module FIGURE 7-4: BM23 PCB FOOT PRINT Note: The “Keep Out Area” is reserved for RF performance check. 2015 Microchip Technology Inc.
Stereo Module 7.2 REFLOW PROFILE FIGURE 7-5: REFLOW PROFILE peak: 260 +5/-0℃ Slope: 1~2℃/sec max. (217℃ to peak) Ramp down rate : Max. 3℃/sec. 217℃ Preheat: 150~200℃ 20~40 sec. 60 ~ 180 sec. 60 ~150sec Time (sec) 25℃ Soldering Recommendations Stereo module was assembled using standard lead-free reflow profile IPC/JEDEC J-STD-020. The module can be soldered to the main PCB using standard leaded and lead-free solder reflow profiles.
Stereo Module 8.0 PACKAGING AND STORAGE INFORMATION The module is packaged into trays (see following page) of sixty three (63) modules in a 7 x 9 format. These trays are then sealed into bags. Ten sealed bags are then placed in a box of 630 pieces with a 3 dimension of 36 * 16 * 9.5 cm . The shelf life of each module in a sealed bag is 12 months at <40°C and <90% relative humidity.
Stereo Module 2015 Microchip Technology Inc.
Stereo Module 8.1 ORDERING INFORMATION TABLE 5-1: Module Ordering Information Part Number Description BM20SPKS1NBC Bluetooth 4.1 BDR/EDR, Class 2 Surface Mount module with integrated antenna and shield BM23SPKS1NB9 Bluetooth 4.1 BDR/EDR, Class 2 Surface Mount module with integrated antenna and shield Note: The module can only be purchased through a Microchip representative. Go to http://www.microchip.com/ for current pricing and a list of distributors carrying Microchip products.
Stereo Module APPENDIX A.1 United States The module has received Federal Communications Commission (FCC) CFR47 Telecommunications, Part 15 Subpart C “Intentional Radiators” modular approval in accordance with Part 15.212 Modular Transmitter approval. Modular approval allows the end user to integrate the module into a finished product without obtaining subsequent and separate FCC approvals for intentional radiation, provided no changes or modifications are made to the module circuitry.
Stereo Module This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy, and if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
Stereo Module A.2 Canada The BM23 module has been certified for use in Canada under Industry Canada (IC) Radio Standards Specification (RSS) RSS-210 and RSS-Gen. Modular approval permits the installation of a module in a host device without the need to recertify the device. A.2.1 LABELING AND USER INFORMATION REQUIREMENTS Labeling Requirements for the Host Device (from Section 3.2.1, RSS-Gen, Issue 3, December 2010): The host device shall be properly labeled to identify the module within the host device.
Stereo Module Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication.
Stereo Module A.3 Europe The BM23 module is an R&TTE Directive assessed radio module that is CE marked and has been manufactured and tested with the intention of being integrated into a final product. The BM23 module has been tested to R&TTE Directive 1999/5/EC Essential Requirements for Health and Safety (Article (3.1(a)), Electromagnetic Compatibility (EMC) (Article 3.1(b)), and Radio (Article 3.2) and are summarized in Table 3‐1: European Compliance Testing. A Notified Body Opinion has also been issued.
Stereo Module A.3.3 HELPFUL WEB SITES A document that can be used as a starting point in understanding the use of Short Range Devices (SRD) in Europe is the European Radio Communications Committee (ERC) Recommendation 70‐03 E, which can be downloaded from the European Radio Communications Office (ERO) at: http://www.ero.dk/. Additional helpful web sites are: • Radio and Telecommunications Terminal Equipment (R&TTE): http://ec.europa.eu/enterprise/rtte/index_en.
Stereo Module A.4 Japan The BM20/BM23 module has received type certification and is labeled with its own technical conformity mark and certification number as required to conform to the technical standards regulated by the Ministry of Internal Affairs and Communications (MIC) of Japan pursuant to the Radio Act of Japan.
Stereo Module A.5 Korea The BM23 module has received certification of conformity in accordance with the Radio Waves Act. Integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. A.5.1 LABELING AND USER INFORMATION REQUIREMENTS The label on the final product which contains the BM23 module must follow KC marking requirements.
Stereo Module A.6 Taiwan The BM23 module has received compliance approval in accordance with the Telecommunications Act. Customers seeking to use the compliance approval in their product should contact Microchip Technology sales or distribution partners to obtain a Letter of Authority. installation instructions are followed and no modifications of the module are allowed. Integration of this module into a final product does not require additional radio certification provided A.6.
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