Datasheet

2
XMEGA D4 [DATASHEET]
8135P–AVR–01/2014
1. Ordering information
Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information.
2. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green.
3. For packaging information see ”Packaging information” on page 64.
4. Tape and Reel
Typical Applications
Ordering Code
Flash
(Bytes)
EEPROM
(Bytes)
SRAM
(Bytes)
Speed
(MHz)
Power
Supply
Package
(1)(2)(3)
Temp
ATxmega128D4-AU 128K + 8K 2K 8K
32 1.6 - 3.6V
44A
-40C - 85C
ATxmega128D4-AUR
(4)
128K + 8K 2K 8K
ATxmega64D4-AU 64K + 4K 2K 4K
ATxmega64D4-AUR
(4)
64K + 4K 2K 4K
ATxmega32D4-AU 32K + 4K 1K 4K
ATxmega32D4-AUR
(4)
32K + 4K 1K 4K
ATxmega16D4-AU 16K + 4K 1K 2K
ATxmega16D4-AUR
(4)
16K + 4K 1K 2K
ATxmega128D4-MH 128K + 8K 2K 8K
44M1
ATxmega128D4-MHR
(4)
128K + 8K 2K 8K
ATxmega64D4-MH 64K + 4K 2K 4K
ATxmega64D4-MHR
(4)
64K + 4K 2K 4K
ATxmega32D4-MH 32K + 4K 1K 4K
ATxmega32D4-MHR
(4)
32K + 4K 1K 4K
ATxmega16D4-MH 16K + 4K 1K 2K
ATxmega16D4-MHR
(4)
16K + 4K 1K 2K
ATxmega128D4-CU 128K + 8K 2K 8K
49C2
ATxmega128D4-CUR
(4)
128K + 8K 2K 8K
ATxmega64D4-CU 64K + 4K 2K 4K
ATxmega64D4-CUR
(4)
64K + 4K 2K 4K
ATxmega32D4-CU 32K + 4K 1K 4K
ATxmega32D4-CUR
(4)
32K + 4K 1K 4K
ATxmega16D4-CU 16K + 4K 1K 2K
ATxmega16D4-CUR
(4)
16K + 4K 1K 2K
Package type
44A
44-lead, 10x10mm body size, 1.0mm body thickness, 0.8mm lead pitch, thin profile plastic quad flat package (TQFP)
44M1
44-Pad, 7x7x1mm body, lead pitch 0.50mm, 5.20mm exposed pad, thermally enhanced plastic very thin quad no lead package (VQFN)
49C2
49-ball (7 x 7 Array), 0.65mm pitch, 5.0x5.0x1.0mm, very thin, fine-pitch ball grid array package (VFBGA)
Industrial control Climate control Low power battery applications
Factory automation RF and ZigBee
®
Power tools
Building control USB connectivity HVAC
Board control Sensor control Utility metering
White goods Optical Medical applications