Datasheet

13
XMEGA D3 [DATASHEET]
Atmel-8134N-ATxmega32D3-64D3-128D3-192D3-256D3-384D3_datasheet–03/2014
device-dependent. These two sections have separate lock bits, and can have different levels of protection. The store
program memory (SPM) instruction, which is used to write to the flash from the application software, will only operate
when executed from the boot loader section.
The application section contains an application table section with separate lock settings. This enables safe storage of
nonvolatile data in the program memory.
Figure 7-1. Flash program memory (Hexadecimal address).
7.3.1 Application section
The Application section is the section of the flash that is used for storing the executable application code. The protection
level for the application section can be selected by the boot lock bits for this section. The application section can not store
any boot loader code since the SPM instruction cannot be executed from the application section.
7.3.2 Application table section
The application table section is a part of the application section of the flash memory that can be used for storing data.
The size is identical to the boot loader section. The protection level for the application table section can be selected by
the boot lock bits for this section. The possibilities for different protection levels on the application section and the
application table section enable safe parameter storage in the program memory. If this section is not used for data,
application code can reside here.
7.3.3 Boot loader section
While the application section is used for storing the application code, the boot loader software must be located in the boot
loader section because the SPM instruction can only initiate programming when executing from this section. The SPM
instruction can access the entire flash, including the boot loader section itself. The protection level for the boot loader
section can be selected by the boot loader lock bits. If this section is not used for boot loader software, application code
can be stored here.
7.3.4 Production signature row
The production signature row is a separate memory section for factory programmed data. It contains calibration data for
functions such as oscillators and analog modules. Some of the calibration values will be automatically loaded to the
corresponding module or peripheral unit during reset. Other values must be loaded from the signature row and written to
the corresponding peripheral registers from software. For details on calibration conditions, refer to “Electrical
characteristics” on page 63.
The production signature row also contains an ID that identifies each microcontroller device type and a serial number for
each manufactured device. The serial number consists of the production lot number, wafer number, and wafer
coordinates for the device. The device ID for the available devices is shown in Table 7-1.
Word address
ATxmega 32D3 64D3 128D3 192D3 256D3 384D3
Application section
(32K/64K/128K/192K/256K/384K)
000000
...
37FF 77FF EFFF 16FFF 1EFFF 2EFFF
Application table section
(4K/4K/8K/8K/8K/8K)
3800 7800 F000 17000 1F000 2F000
3FFF 7FFF FFFF 17FFF 1FFFF 2FFFF
Boot section (4K/4K/8K/8K/8K/8K)
4000 8000 10000 18000 20000 30000
47FF 87FF 10FFF 18FFF 20FFF 30FFF