Datasheet
Table Of Contents
- Features
- 1. Ordering Information
- 2. Pinout/Block Diagram
- 3. Overview
- 4. Resources
- 5. Capacitive touch sensing
- 6. AVR CPU
- 7. Memories
- 8. Event System
- 9. System Clock and Clock options
- 9.1 Features
- 9.2 Overview
- 9.3 Clock Sources
- 9.3.1 32kHz Ultra Low Power Internal Oscillator
- 9.3.2 32.768kHz Calibrated Internal Oscillator
- 9.3.3 32.768kHz Crystal Oscillator
- 9.3.4 0.4 - 16MHz Crystal Oscillator
- 9.3.5 2MHz Run-time Calibrated Internal Oscillator
- 9.3.6 32MHz Run-time Calibrated Internal Oscillator
- 9.3.7 External Clock Sources
- 9.3.8 PLL with 1x-31x Multiplication Factor
- 10. Power Management and Sleep Modes
- 11. System Control and Reset
- 12. WDT – Watchdog Timer
- 13. Interrupts and Programmable Multilevel Interrupt Controller
- 14. I/O Ports
- 15. TC0/1 – 16-bit Timer/Counter Type 0 and 1
- 16. TC2 – Timer/Counter Type 2
- 17. AWeX – Advanced Waveform Extension
- 18. Hi-Res – High Resolution Extension
- 19. RTC – 16-bit Real-Time Counter
- 20. USB – Universal Serial Bus Interface
- 21. TWI – Two-Wire Interface
- 22. SPI – Serial Peripheral Interface
- 23. USART
- 24. IRCOM – IR Communication Module
- 25. CRC – Cyclic Redundancy Check Generator
- 26. ADC – 12-bit Analog to Digital Converter
- 27. AC – Analog Comparator
- 28. Programming and Debugging
- 29. Pinout and Pin Functions
- 30. Peripheral Module Address Map
- 31. Instruction Set Summary
- 32. Packaging information
- 33. Electrical Characteristics TBD
- 34. Typical Characteristics TBD
- 35. Errata
- 36. Datasheet Revision History
- Table of Contents
2
8493A–AVR–02/12
XMEGA C4
1. Ordering Information
Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information.
2. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also
Halide free and fully Green.
3. For packaging information, see ”Packaging information” on page 62.
4. Tape and Reel.
Ordering code Flash (bytes) EEPROM (bytes) SRAM (bytes) Speed (MHz) Power supply Package
(1)(2)(3)
Temp.
ATxmega32C4-AU 32K + 4K 1K 4K
32 1.6 - 3.6V
44A
-40°C - 85°C
ATxmega32C4-AUR
(4)
32K + 4K 1K 2K
ATxmega16C4-AU 16K + 4K 1K 4K
ATxmega16C4-AUR
(4)
16K + 4K 1K 2K
ATxmega32C4-MH 32K + 4K 1K 4K
44M1
ATxmega32C4-MHR
(4)
32K + 4K 1K 2K
ATxmega16C4-MH 16K + 4K 1K 4K
ATxmega16C4-MHR
(4)
16K + 4K 1K 2K
ATxmega32C4-CU 32K + 4K 1K 4K
49C2
ATxmega32C4-CUR
(4)
32K + 4K 1K 2K
ATxmega16C4-CU 16K + 4K 1K 4K
ATxmega16C4-CUR
(4)
16K + 4K 1K 2K
Package Type
44A
44-lead, 10 x 10mm body size, 1.0mm body thickness, 0.8mm lead pitch, thin profile plastic quad flat package (TQFP)
44M1
44-pad, 7 x 7 x 1.0mm body, lead pitch 0.50mm, 5.20 m exposed pad, thermally enhanced plastic very thin quad no lead
package (VQFN)
49C2
49-ball (7 x 7 Array), 0.65mm pitch, 5.0 x 5.0 x 1.0mm, very thin, fine-pitch ball grid array package (VFBGA)