Datasheet

2
XMEGA B3 [DATASHEET]
8074D–AVR–08/2013
1. Ordering Information
Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information.
2. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green.
3. For packaging information, see “Packaging information” on page 67.
4. Tape and Reel.
Typical Applications
Ordering Code
Flash
(Bytes)
EEPROM
(Bytes)
SRAM
(Bytes)
Speed (MHz)
Power
Supply
Package
(1)(2)(3)
Temp
ATxmega128B3-AU 128K + 8K 2K 8K
32 1.6 - 3.6V
64A
-40C - 85C
ATxmega128B3-AUR
(4)
128K + 8K 2K 8K
ATxmega128B3-MH 128K + 8K 2K 8K
64M2
ATxmega128B3-MHR
(4)
128K + 8K 2K 8K
ATxmega128B3-MCU 128K + 8K 2K 8K
64P2
ATxmega128B3-MCUR
(4)
128K + 8K 2K 8K
ATxmega64B3-AU 64K + 4K 2K 4K
32 1.6 - 3.6V
64A
-40C - 85C
ATxmega64B3-AUR
(4)
64K + 4K 2K 4K
ATxmega64B3-MH 64K + 4K 2K 4K
64M2
ATxmega64B3-MHR
(4)
64K + 4K 2K 4K
Package Type
64A
64-lead, 14 x 14mm body size, 1.0mm body thickness, 0.5mm lead pitch, thin profile plastic quad flat package (TQFP)
64M2
64-pad, 9 x 9 x 1.0mm body size, 0.05mm lead pitch, 7.65 exposed pad, Quad Flat No-Lead Package (QFN)
64P2
64-pad, 7 x 7 x 1.0mm body size, 0.65mm pitch (Dual row staggered), Very Thin Quad No Lead Package (VQFN) Sawn
Industrial control Climate control Low power battery applications
Factory automation RF and ZigBee
®
Power tools
Building control USB connectivity HVAC
Board control Sensor control Utility metering
White goods Optical Medical applications