Datasheet

2
XMEGA B1 [DATASHEET]
Atmel-8330F-AVR-ATxmega64B1-128B1_datasheet–AVR–02/2014
1. Ordering Information
Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information.
2. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green.
3. For packaging information, see “Errata” on page 134.
4. Tape and Reel.
Typical Applications
Ordering Code
Flash
(Bytes)
EEPROM
(Bytes)
SRAM
(Bytes)
Speed (MHz)
Power
Supply
Package
(1)(2)(3)
Temp
ATxmega128B1-AU 128K + 8K 2K 8K
32 1.6 - 3.6V
100A
-40C - 85C
ATxmega128B1-AUR
(4)
128K + 8K 2K 8K
ATxmega128B1-CU 128K + 8K 2K 8K
7A1
ATxmega128B1-CUR
(4)
128K + 8K 2K 8K
ATxmega64B1-AU 64K + 4K 2K 4K
32 1.6 - 3.6V
100A
-40C - 85C
ATxmega64B1-AUR
(4)
64K + 4K 2K 4K
ATxmega64B1-CU 64K + 4K 2K 4K
7A1
ATxmega64B1-CUR
(4)
64K + 4K 2K 4K
Package Type
100A
100-lead, 14 x 14mm body size, 1.0mm body thickness, 0.5mm lead pitch, thin profile plastic quad flat package (TQFP)
7A1
100-ball (10x10 array), 7 x 7 x 1.0mm body, ball pitch 0.65mm, very thin fine-pitch ball grid array (VFBGA)
Industrial control Climate control Low power battery applications
Factory automation RF and ZigBee
®
Power tools
Building control USB connectivity HVAC
Board control Sensor control Utility metering
White goods Optical Medical applications