Datasheet

933
32142D–06/2013
ATUC64/128/256L3/4U
Figure 36-2. QFN-48 Package Drawing
Note: The exposed pad is not connected to anything internally, but should be soldered to ground to increase board level reliability.
Table 36-5. Device and Package Maximum Weight
140 mg
Table 36-6. Package Characteristics
Moisture Sensitivity Level MSL3
Table 36-7. Package Reference
JEDEC Drawing Reference M0-220
JESD97 Classification E3