Datasheet

737
32133D–11/2011
UC3D
33.3 Soldering Profile
Table 33-14 gives the recommended soldering profile from J-STD-20.
A maximum of three reflow passes is allowed per component.
Table 33-14. Soldering Profile
Profile Feature Green Package
Average Ramp-up Rate (217°C to Peak) 3°C/s max
Preheat Temperature 175°C ±25°C 150°C min, 200°C max
Temperature Maintained Above 217°C 60-150 s
Time within 5
⋅C of Actual Peak Temperature 30 s
Peak Temperature Range 260°C
Ramp-down Rate 6°C/s max
Time 25
⋅C to Peak Temperature 8 minutes max